JPH0556778B2 - - Google Patents
Info
- Publication number
- JPH0556778B2 JPH0556778B2 JP62297915A JP29791587A JPH0556778B2 JP H0556778 B2 JPH0556778 B2 JP H0556778B2 JP 62297915 A JP62297915 A JP 62297915A JP 29791587 A JP29791587 A JP 29791587A JP H0556778 B2 JPH0556778 B2 JP H0556778B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- chip
- substrate
- pyridine
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004593 Epoxy Substances 0.000 claims description 36
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 27
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 16
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 11
- 150000003222 pyridines Chemical class 0.000 claims description 7
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 claims description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- HOPRXXXSABQWAV-UHFFFAOYSA-N anhydrous collidine Natural products CC1=CC=NC(C)=C1C HOPRXXXSABQWAV-UHFFFAOYSA-N 0.000 claims description 2
- UTBIMNXEDGNJFE-UHFFFAOYSA-N collidine Natural products CC1=CC=C(C)C(C)=N1 UTBIMNXEDGNJFE-UHFFFAOYSA-N 0.000 claims description 2
- HPYNZHMRTTWQTB-UHFFFAOYSA-N dimethylpyridine Natural products CC1=CC=CN=C1C HPYNZHMRTTWQTB-UHFFFAOYSA-N 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- GFYHSKONPJXCDE-UHFFFAOYSA-N sym-collidine Natural products CC1=CN=C(C)C(C)=C1 GFYHSKONPJXCDE-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 229940106691 bisphenol a Drugs 0.000 claims 1
- XENVCRGQTABGKY-ZHACJKMWSA-N chlorohydrin Chemical compound CC#CC#CC#CC#C\C=C\C(Cl)CO XENVCRGQTABGKY-ZHACJKMWSA-N 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 description 12
- 239000000463 material Substances 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 230000003628 erosive effect Effects 0.000 description 5
- 229910018182 Al—Cu Inorganic materials 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 150000003462 sulfoxides Chemical class 0.000 description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- -1 polysiloxane Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004442 gravimetric analysis Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D9/00—Chemical paint or ink removers
- C09D9/005—Chemical paint or ink removers containing organic solvents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/948,259 US4729797A (en) | 1986-12-31 | 1986-12-31 | Process for removal of cured epoxy |
| US948259 | 1992-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63172746A JPS63172746A (ja) | 1988-07-16 |
| JPH0556778B2 true JPH0556778B2 (2) | 1993-08-20 |
Family
ID=25487551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62297915A Granted JPS63172746A (ja) | 1986-12-31 | 1987-11-27 | エポキシの除去方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4729797A (2) |
| EP (1) | EP0273294B1 (2) |
| JP (1) | JPS63172746A (2) |
| DE (1) | DE3770791D1 (2) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5346640A (en) * | 1989-08-30 | 1994-09-13 | Transcontinental Marketing Group, Inc. | Cleaner compositions for removing graffiti from surfaces |
| JPH08231989A (ja) * | 1995-02-23 | 1996-09-10 | Kurita Water Ind Ltd | 洗浄剤組成物及び洗浄方法 |
| US20080196828A1 (en) * | 1999-07-14 | 2008-08-21 | Gilbert Michael D | Electrically Disbonding Adhesive Compositions and Related Methods |
| US7332218B1 (en) * | 1999-07-14 | 2008-02-19 | Eic Laboratories, Inc. | Electrically disbonding materials |
| US20050066995A1 (en) * | 2003-09-30 | 2005-03-31 | International Business Machines Corporation | Non-hermetic encapsulant removal for module rework |
| US20070269659A1 (en) * | 2006-05-17 | 2007-11-22 | Eic Laboratories, Inc. | Electrically disbondable compositions and related methods |
| EP3262132A1 (en) | 2015-02-27 | 2018-01-03 | Henkel AG & Co. KGaA | Debondable reactive hot melt adhesives |
| EP3199344B1 (en) | 2016-02-01 | 2022-04-13 | Henkel AG & Co. KGaA | Electrical debonding of pu hot melt adhesives by use of conductive inks |
| CN109831879A (zh) * | 2019-02-23 | 2019-05-31 | 上海富柏化工有限公司 | 一种护锡型pcb去膜液 |
| ES2973449T3 (es) | 2019-12-13 | 2024-06-20 | Henkel Ag & Co Kgaa | Composición adhesiva curable de dos componentes (2K) |
| EP3835378A1 (en) | 2019-12-13 | 2021-06-16 | Henkel AG & Co. KGaA | Two component (2k) curable adhesive composition |
| PL3835381T3 (pl) | 2019-12-13 | 2023-06-26 | Henkel Ag & Co. Kgaa | Dwuskładnikowa (2k) utwardzalna kompozycja klejowa |
| EP3835383B1 (en) | 2019-12-13 | 2023-04-12 | Henkel AG & Co. KGaA | One component (1k) curable adhesive composition |
| CN115443320A (zh) | 2020-04-24 | 2022-12-06 | 汉高股份有限及两合公司 | 可热分离的双层胶黏剂体系和使用该体系的胶黏剂脱胶方法 |
| JP7804594B2 (ja) | 2020-06-22 | 2026-01-22 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 電気化学的に剥離可能な接着剤組成物 |
| EP4050040A1 (en) | 2021-02-26 | 2022-08-31 | Henkel AG & Co. KGaA | One component (1k) curable adhesive composition |
| EP4067401A1 (en) | 2021-03-30 | 2022-10-05 | Henkel AG & Co. KGaA | Two component (2k) curable adhesive composition |
| KR20230169152A (ko) | 2021-04-14 | 2023-12-15 | 헨켈 아게 운트 코. 카게아아 | 용매계 감압성 접착제 (psa)를 기반으로 하는 탈결합가능한 구조체 |
| EP4540296A1 (en) | 2022-06-17 | 2025-04-23 | Henkel AG & Co. KGaA | Two component (2k) curable adhesive composition |
| PT4332144T (pt) | 2022-09-05 | 2025-07-09 | Henkel Ag & Co Kgaa | Composição adesiva curável de um componente (1k) |
| WO2025093205A1 (en) | 2023-10-31 | 2025-05-08 | Henkel Ag & Co. Kgaa | Two component (2k) curable and debondable adhesive composition |
| EP4559672A1 (en) | 2023-11-27 | 2025-05-28 | Henkel AG & Co. KGaA | Method of separating bonded articles |
| EP4559671A1 (en) | 2023-11-27 | 2025-05-28 | Henkel AG & Co. KGaA | Method of separating bonded articles |
| WO2025119717A1 (en) | 2023-12-04 | 2025-06-12 | Henkel Ag & Co. Kgaa | An adhesive sheet |
| EP4678390A1 (en) | 2024-07-10 | 2026-01-14 | Henkel AG & Co. KGaA | An adhesive sheet |
| EP4566807A1 (en) | 2023-12-04 | 2025-06-11 | Henkel AG & Co. KGaA | An adhesive sheet |
| EP4566808A1 (en) | 2023-12-06 | 2025-06-11 | Henkel AG & Co. KGaA | Bonded structure comprising an electrochemically debondable adhesive |
| EP4567085A1 (en) | 2023-12-08 | 2025-06-11 | Henkel AG & Co. KGaA | Electrochemically debondable adhesive film |
| EP4644500A1 (en) | 2024-04-30 | 2025-11-05 | Henkel AG & Co. KGaA | Two-component (2k) curable adhesive composition |
| EP4644502A1 (en) | 2024-04-30 | 2025-11-05 | Henkel AG & Co. KGaA | Electrochemically debondable adhesive film |
| WO2025241057A1 (en) | 2024-05-20 | 2025-11-27 | Henkel Ag & Co. Kgaa | Bonded structure comprising an electrochemically debondable adhesive film |
| EP4663713A1 (en) | 2024-06-13 | 2025-12-17 | Henkel AG & Co. KGaA | Bonded structure comprising an thermally debondable adhesive film |
| DE102024117579A1 (de) | 2024-06-21 | 2025-12-24 | Henkel Ag & Co. Kgaa | Polyurethanbasierter Klebstoff mit schaltbarer Enthaftung |
| EP4717746A1 (en) | 2024-09-27 | 2026-04-01 | Henkel AG & Co. KGaA | One component (1k) composition based on epoxide compounds |
| EP4721970A1 (en) | 2024-10-01 | 2026-04-08 | Henkel AG & Co. KGaA | Bonded structure comprising an electrochemically debondable adhesive layer |
| EP4721971A1 (en) | 2024-10-07 | 2026-04-08 | Henkel AG & Co. KGaA | Method of separating bonded articles |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3673099A (en) * | 1970-10-19 | 1972-06-27 | Bell Telephone Labor Inc | Process and composition for stripping cured resins from substrates |
| US4168989A (en) * | 1975-06-10 | 1979-09-25 | Westinghouse Electric Corp. | Stripping composition for thermoset resins and method of repairing electrical apparatus |
| US4171240A (en) * | 1978-04-26 | 1979-10-16 | Western Electric Company, Inc. | Method of removing a cured epoxy from a metal surface |
| US4276186A (en) * | 1979-06-26 | 1981-06-30 | International Business Machines Corporation | Cleaning composition and use thereof |
| US4294729A (en) * | 1979-12-17 | 1981-10-13 | International Business Machines Corporation | Composition containing alcohol and use thereof for epoxy removal |
| US4304681A (en) * | 1980-09-15 | 1981-12-08 | Shipley Company, Inc. | Novel stripping composition for positive photoresists and method of using same |
| JPS58139430A (ja) * | 1982-02-15 | 1983-08-18 | Toray Ind Inc | レジストの剥離法 |
-
1986
- 1986-12-31 US US06/948,259 patent/US4729797A/en not_active Expired - Lifetime
-
1987
- 1987-11-27 JP JP62297915A patent/JPS63172746A/ja active Granted
- 1987-12-15 DE DE8787118548T patent/DE3770791D1/de not_active Expired - Lifetime
- 1987-12-15 EP EP87118548A patent/EP0273294B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63172746A (ja) | 1988-07-16 |
| EP0273294B1 (en) | 1991-06-12 |
| DE3770791D1 (de) | 1991-07-18 |
| EP0273294A2 (en) | 1988-07-06 |
| US4729797A (en) | 1988-03-08 |
| EP0273294A3 (en) | 1989-02-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0556778B2 (2) | ||
| EP0205190B1 (en) | Method of producing a resin packaged semiconductor device | |
| US5615827A (en) | Flux composition and corresponding soldering method | |
| EP0032179B1 (en) | Removal composition and process for removing a cured epoxy polymer from a substrate | |
| EP0110307B1 (en) | Semiconductor die-attach technique and composition therefor | |
| US5274913A (en) | Method of fabricating a reworkable module | |
| EP0575889A2 (en) | Semiconductor device, resin for sealing same and method of fabricating same | |
| JPS62199611A (ja) | 導電性組成物 | |
| KR100351996B1 (ko) | 반도체 장치 제조 방법 | |
| EP0433052A1 (en) | Thermally dissipated soldering flux and method of use | |
| CN111586990B (zh) | 印制电路板陶瓷柱栅阵列器件防护处理方法 | |
| JPS63293952A (ja) | 半導体素子接続端子形成方法 | |
| JPH06350000A (ja) | リードフレームの表面処理剤およびそれを用いた半導体集積回路装置の製造方法 | |
| US5190595A (en) | Ozone safe stripping solution for thermal grease | |
| US6503874B2 (en) | Cleaning method to remove flux residue in electronic assembly | |
| EP0540269A1 (en) | Soldering method and flux for use therein | |
| KR960007653A (ko) | 표면보호막 및 그것을 갖는 수지봉지형 반도체 장치와 그 제조방법 | |
| JPH107763A (ja) | 導電性樹脂ペースト | |
| JP7642501B2 (ja) | 洗浄剤及び半導体装置の製造方法 | |
| JPH06184278A (ja) | 半導体用導電性樹脂ペースト | |
| JPS622557A (ja) | 半導体デバイスの静電破壊防止方法 | |
| JP2546361B2 (ja) | 含フッ素シラン化合物を表面に付着結合させたハンダ付け性のない導電性金属 | |
| JPH0456137A (ja) | 高密度相互接続組立体に用いるダイ接続方法 | |
| CN121613690A (zh) | 一种半导体光刻胶剥离液及其制备方法 | |
| CN116339083A (zh) | 一种厚光刻胶清洗液 |