JPS63172746A - エポキシの除去方法 - Google Patents

エポキシの除去方法

Info

Publication number
JPS63172746A
JPS63172746A JP62297915A JP29791587A JPS63172746A JP S63172746 A JPS63172746 A JP S63172746A JP 62297915 A JP62297915 A JP 62297915A JP 29791587 A JP29791587 A JP 29791587A JP S63172746 A JPS63172746 A JP S63172746A
Authority
JP
Japan
Prior art keywords
epoxy
substrate
chip
pyridine
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62297915A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0556778B2 (2
Inventor
ハロルド・ジヨージ・リンダ
エリザベス・テレサ・マフイー
デニス・ジヨン・ポリイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS63172746A publication Critical patent/JPS63172746A/ja
Publication of JPH0556778B2 publication Critical patent/JPH0556778B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C09D9/005—Chemical paint or ink removers containing organic solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
JP62297915A 1986-12-31 1987-11-27 エポキシの除去方法 Granted JPS63172746A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/948,259 US4729797A (en) 1986-12-31 1986-12-31 Process for removal of cured epoxy
US948259 1992-09-21

Publications (2)

Publication Number Publication Date
JPS63172746A true JPS63172746A (ja) 1988-07-16
JPH0556778B2 JPH0556778B2 (2) 1993-08-20

Family

ID=25487551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62297915A Granted JPS63172746A (ja) 1986-12-31 1987-11-27 エポキシの除去方法

Country Status (4)

Country Link
US (1) US4729797A (2)
EP (1) EP0273294B1 (2)
JP (1) JPS63172746A (2)
DE (1) DE3770791D1 (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109831879A (zh) * 2019-02-23 2019-05-31 上海富柏化工有限公司 一种护锡型pcb去膜液

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346640A (en) * 1989-08-30 1994-09-13 Transcontinental Marketing Group, Inc. Cleaner compositions for removing graffiti from surfaces
JPH08231989A (ja) * 1995-02-23 1996-09-10 Kurita Water Ind Ltd 洗浄剤組成物及び洗浄方法
US20080196828A1 (en) * 1999-07-14 2008-08-21 Gilbert Michael D Electrically Disbonding Adhesive Compositions and Related Methods
US7332218B1 (en) * 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
US20050066995A1 (en) * 2003-09-30 2005-03-31 International Business Machines Corporation Non-hermetic encapsulant removal for module rework
US20070269659A1 (en) * 2006-05-17 2007-11-22 Eic Laboratories, Inc. Electrically disbondable compositions and related methods
EP3262132A1 (en) 2015-02-27 2018-01-03 Henkel AG & Co. KGaA Debondable reactive hot melt adhesives
EP3199344B1 (en) 2016-02-01 2022-04-13 Henkel AG & Co. KGaA Electrical debonding of pu hot melt adhesives by use of conductive inks
ES2973449T3 (es) 2019-12-13 2024-06-20 Henkel Ag & Co Kgaa Composición adhesiva curable de dos componentes (2K)
EP3835378A1 (en) 2019-12-13 2021-06-16 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
PL3835381T3 (pl) 2019-12-13 2023-06-26 Henkel Ag & Co. Kgaa Dwuskładnikowa (2k) utwardzalna kompozycja klejowa
EP3835383B1 (en) 2019-12-13 2023-04-12 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
CN115443320A (zh) 2020-04-24 2022-12-06 汉高股份有限及两合公司 可热分离的双层胶黏剂体系和使用该体系的胶黏剂脱胶方法
JP7804594B2 (ja) 2020-06-22 2026-01-22 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電気化学的に剥離可能な接着剤組成物
EP4050040A1 (en) 2021-02-26 2022-08-31 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
EP4067401A1 (en) 2021-03-30 2022-10-05 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
KR20230169152A (ko) 2021-04-14 2023-12-15 헨켈 아게 운트 코. 카게아아 용매계 감압성 접착제 (psa)를 기반으로 하는 탈결합가능한 구조체
EP4540296A1 (en) 2022-06-17 2025-04-23 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
PT4332144T (pt) 2022-09-05 2025-07-09 Henkel Ag & Co Kgaa Composição adesiva curável de um componente (1k)
WO2025093205A1 (en) 2023-10-31 2025-05-08 Henkel Ag & Co. Kgaa Two component (2k) curable and debondable adhesive composition
EP4559672A1 (en) 2023-11-27 2025-05-28 Henkel AG & Co. KGaA Method of separating bonded articles
EP4559671A1 (en) 2023-11-27 2025-05-28 Henkel AG & Co. KGaA Method of separating bonded articles
WO2025119717A1 (en) 2023-12-04 2025-06-12 Henkel Ag & Co. Kgaa An adhesive sheet
EP4678390A1 (en) 2024-07-10 2026-01-14 Henkel AG & Co. KGaA An adhesive sheet
EP4566807A1 (en) 2023-12-04 2025-06-11 Henkel AG & Co. KGaA An adhesive sheet
EP4566808A1 (en) 2023-12-06 2025-06-11 Henkel AG & Co. KGaA Bonded structure comprising an electrochemically debondable adhesive
EP4567085A1 (en) 2023-12-08 2025-06-11 Henkel AG & Co. KGaA Electrochemically debondable adhesive film
EP4644500A1 (en) 2024-04-30 2025-11-05 Henkel AG & Co. KGaA Two-component (2k) curable adhesive composition
EP4644502A1 (en) 2024-04-30 2025-11-05 Henkel AG & Co. KGaA Electrochemically debondable adhesive film
WO2025241057A1 (en) 2024-05-20 2025-11-27 Henkel Ag & Co. Kgaa Bonded structure comprising an electrochemically debondable adhesive film
EP4663713A1 (en) 2024-06-13 2025-12-17 Henkel AG & Co. KGaA Bonded structure comprising an thermally debondable adhesive film
DE102024117579A1 (de) 2024-06-21 2025-12-24 Henkel Ag & Co. Kgaa Polyurethanbasierter Klebstoff mit schaltbarer Enthaftung
EP4717746A1 (en) 2024-09-27 2026-04-01 Henkel AG & Co. KGaA One component (1k) composition based on epoxide compounds
EP4721970A1 (en) 2024-10-01 2026-04-08 Henkel AG & Co. KGaA Bonded structure comprising an electrochemically debondable adhesive layer
EP4721971A1 (en) 2024-10-07 2026-04-08 Henkel AG & Co. KGaA Method of separating bonded articles

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673099A (en) * 1970-10-19 1972-06-27 Bell Telephone Labor Inc Process and composition for stripping cured resins from substrates
US4168989A (en) * 1975-06-10 1979-09-25 Westinghouse Electric Corp. Stripping composition for thermoset resins and method of repairing electrical apparatus
US4171240A (en) * 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
US4276186A (en) * 1979-06-26 1981-06-30 International Business Machines Corporation Cleaning composition and use thereof
US4294729A (en) * 1979-12-17 1981-10-13 International Business Machines Corporation Composition containing alcohol and use thereof for epoxy removal
US4304681A (en) * 1980-09-15 1981-12-08 Shipley Company, Inc. Novel stripping composition for positive photoresists and method of using same
JPS58139430A (ja) * 1982-02-15 1983-08-18 Toray Ind Inc レジストの剥離法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109831879A (zh) * 2019-02-23 2019-05-31 上海富柏化工有限公司 一种护锡型pcb去膜液

Also Published As

Publication number Publication date
EP0273294B1 (en) 1991-06-12
DE3770791D1 (de) 1991-07-18
EP0273294A2 (en) 1988-07-06
US4729797A (en) 1988-03-08
EP0273294A3 (en) 1989-02-08
JPH0556778B2 (2) 1993-08-20

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