JPH0557800A - Manufacture of resin impregnated base - Google Patents
Manufacture of resin impregnated baseInfo
- Publication number
- JPH0557800A JPH0557800A JP3221923A JP22192391A JPH0557800A JP H0557800 A JPH0557800 A JP H0557800A JP 3221923 A JP3221923 A JP 3221923A JP 22192391 A JP22192391 A JP 22192391A JP H0557800 A JPH0557800 A JP H0557800A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated base
- base material
- resin impregnated
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 21
- 239000011347 resin Substances 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 22
- 238000005470 impregnation Methods 0.000 abstract description 5
- 230000005611 electricity Effects 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- -1 polyacryl Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器、電気機器、
計算機器、通信機器等に用いられる電気用積層板、プリ
ント配線板等に用いられる樹脂含浸基材の製造方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment, electric equipment,
The present invention relates to a method for producing a resin-impregnated base material used for electrical laminates, printed wiring boards and the like used in computing equipment, communication equipment and the like.
【０００２】[0002]
【従来の技術】従来、電気用積層板、プリント配線板等
に用いられる樹脂含浸基材は、紙、ガラス布等の長尺基
材に樹脂を含浸し、スクイズロール等のクリアランスで
樹脂含浸量を定め、乾燥してから所要寸法に切断した樹
脂含浸基材を用いているが、基材にまんべんなく樹脂を
含浸することは難しく、ややもすると未含浸部が発生
し、電気用積層板、プリント配線板の耐熱性、絶縁性、
耐吸湿性を低下させる要因となっていた。2. Description of the Related Art Conventionally, a resin-impregnated base material used for electrical laminates, printed wiring boards, etc. is a long base material such as paper or glass cloth impregnated with resin, and the resin impregnation amount is set in a clearance such as a squeeze roll. However, it is difficult to evenly impregnate the base material with the resin, and if there is a non-impregnated part, it may cause a non-impregnated part. Heat resistance, insulation of wiring board,
It has been a factor that reduces the moisture absorption resistance.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来の樹脂含浸基材は、未含浸部が発生しやす
く、電気用積層板、プリント配線板の耐熱性、絶縁性、
耐吸湿性を低下させる要因となっていた。本発明は従来
の技術における上述の問題点に鑑みてなされたもので、
その目的とするところは、未含浸部の発生しない樹脂含
浸基材の製造方法を提供することにある。As described in the prior art, in the conventional resin-impregnated base material, unimpregnated portions are apt to occur, and the heat resistance, the insulation property of the electrical laminate and the printed wiring board,
It has been a factor that reduces the moisture absorption resistance. The present invention has been made in view of the above problems in the conventional art,
An object of the invention is to provide a method for producing a resin-impregnated base material in which no unimpregnated portion is generated.
【０００４】[0004]
【課題を解決するための手段】本発明は基材に樹脂を含
浸後、乾燥工程に至る間で樹脂含浸基材をＶ又はＵ字型
の形状で移送することを特徴とする樹脂含浸基材の製造
方法のため、上記目的を達成することができたもので、
以下本発明を詳細に説明する。The present invention is characterized in that, after impregnating a base material with a resin, the resin-impregnated base material is transferred in a V or U shape during the drying process. Due to the manufacturing method of, it was possible to achieve the above object,
The present invention will be described in detail below.
【０００５】本発明に用いる樹脂含浸基材の基材は、ガ
ラス、アスベスト等の無機質繊維や、ポリエステル、ポ
リアミド、ポリアクリル、ポリビニルアルコール、ポリ
イミド、フッ素樹脂等の有機質繊維や木綿等の天然繊維
からなる織布、不織布、マット、紙等である。基材に含
浸させる樹脂としては、フエノール、エポキシ、不飽和
ポリエステル樹脂、ポリイミド、フッ素樹脂、ポリフエ
ニレンオキサイド等の樹脂が用いられ、必要に応じてタ
ルク、クレー、シリカ、炭酸カルシュウム、水酸化アル
ミニゥム等の無機質粉末充填剤を添加することができ
る。基材に対する樹脂含浸は、全面含浸、片面含浸を問
わず任意である。更に樹脂含浸量は乾燥後樹脂量で４０
〜６０重量％（以下単に％と記す）であることが好まし
い。樹脂量の調節はスクイズロール等で行うことができ
る。乾燥工程は熱風等の加熱炉、赤外線照射等が用いら
れ任意である。含浸後、乾燥工程に至る間では樹脂含浸
基材をＶ又はＵ字型の形状にして、基材内の空気と樹脂
との置換を工程を長くせず、時間が充分とれるようにし
てやる必要がある。必要に応じてＶ又はＵ字型の形状を
複数連結することもできる。なおＶ又はＵ字型の角度は
任意であるが、緩い角度であることが好ましい。しかし
複数連結の場合は鋭角であってもよい。The base material of the resin-impregnated base material used in the present invention includes inorganic fibers such as glass and asbestos, organic fibers such as polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide and fluororesin, and natural fibers such as cotton. Woven fabric, non-woven fabric, mat, paper, etc. Resins such as phenol, epoxy, unsaturated polyester resin, polyimide, fluororesin, and polyphenylene oxide are used as the resin with which the base material is impregnated, and if necessary, talc, clay, silica, calcium carbonate, aluminum hydroxide. Inorganic powder fillers such as can be added. The resin may be impregnated into the substrate regardless of whether it is impregnated on the entire surface or impregnated on one surface. Furthermore, the resin impregnation amount is 40 after drying.
It is preferably ˜60% by weight (hereinafter referred to simply as “%”). The amount of resin can be adjusted with a squeeze roll or the like. A heating furnace such as hot air or infrared irradiation is used for the drying step, which is optional. After impregnation, it is necessary to make the resin-impregnated base material V-shaped or U-shaped during the drying process so that the time for replacing the air in the base material with the resin is not long and the time is sufficient. is there. If necessary, a plurality of V-shaped or U-shaped shapes can be connected. The angle of the V or U shape is arbitrary, but it is preferable that the angle is gentle. However, in the case of multiple connections, it may be an acute angle.
【０００６】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【０００７】[0007]
【実施例】１１６ｇ／ｍ2 のクラフト紙を樹脂量５０％
のフェノ−ル樹脂ワニスに、乾燥後樹脂量が５０％にな
るように含浸してから、緩いＶ字型を描くように樹脂含
浸基材を５分間かけて移送してから１５５℃の乾燥機に
送り、１５５℃で２０分間加熱後、冷却してから所要寸
法に切断して樹脂含浸基材を得た。次に該樹脂含浸基材
８枚の上面に厚み０．０１８ｍｍの接着剤付銅箔１枚
を、接着剤側を内側にして載置した積層体を成形圧力１
００Ｋｇ／ｃｍ2、１６０℃で６０分間加熱加圧成形し
て厚み１．６ｍｍの積層板を得た。Example: A resin amount of kraft paper of 116 g / m 2 is 50%.
After the resin resin varnish of No. 1 was impregnated with the resin amount to 50% after drying, the resin-impregnated base material was transferred for 5 minutes so as to draw a loose V shape, and then dried at 155 ° C. Was heated at 155 ° C. for 20 minutes, cooled, and then cut into a required size to obtain a resin-impregnated base material. Next, a laminated body was prepared by placing one sheet of 0.018 mm-thick copper foil with an adhesive on the upper surface of the eight resin-impregnated base materials with the adhesive side facing inward.
The laminate was heated and pressed at 00 Kg / cm 2 and 160 ° C. for 60 minutes to obtain a laminated plate having a thickness of 1.6 mm.
【０００８】[0008]
【比較例】含浸後直線状に樹脂含浸基材を３０秒かけて
移送した以外は、実施例と同様に処理して樹脂含浸基材
を得、更に厚み１．６ｍｍの積層板を得た。[Comparative Example] A resin-impregnated base material was obtained in the same manner as in Example except that the resin-impregnated base material was linearly transferred after impregnation for 30 seconds, and a laminate having a thickness of 1.6 mm was obtained.
【０００９】実施例及び比較例の積層板の性能は第１表
のようである。沿層絶縁抵抗は１００℃の煮沸水中に２
時間浸漬後の数値、吸湿半田耐熱は温度６０℃、湿度９
５％の空気中で２４時間処理後の数値、吸水率は２３℃
の水中に２４時間浸漬後の数値である。The performances of the laminates of Examples and Comparative Examples are shown in Table 1. The insulation resistance along the layer is 2 in boiling water at 100 ℃.
Numerical value after immersion for a long time, moisture absorption solder heat resistance is 60 ° C, humidity is 9
Numerical value, water absorption after treatment for 24 hours in 5% air is 23 ℃
Is the value after immersion in water for 24 hours.
【００１０】 [0010]
【００１１】[0011]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する樹脂含浸基材の
製造方法においては、未含浸部がなく、積層板、配線板
の耐熱性、絶縁性、耐吸湿性を向上させることを確認し
た。The present invention is constructed as described above.
In the method for producing a resin-impregnated base material having the structure described in the claims, it has been confirmed that there is no unimpregnated portion and the heat resistance, insulation property and moisture absorption resistance of the laminated board and the wiring board are improved.
Claims (1)
で樹脂含浸基材をＶ又はＵ字型の形状で移送することを
特徴とする樹脂含浸基材の製造方法。1. A method for producing a resin-impregnated base material, which comprises transferring the resin-impregnated base material in a V-shaped or U-shaped shape during the drying step after impregnating the base material with the resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3221923A JPH0557800A (en) | 1991-09-03 | 1991-09-03 | Manufacture of resin impregnated base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3221923A JPH0557800A (en) | 1991-09-03 | 1991-09-03 | Manufacture of resin impregnated base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0557800A true JPH0557800A (en) | 1993-03-09 |
Family
ID=16774277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3221923A Pending JPH0557800A (en) | 1991-09-03 | 1991-09-03 | Manufacture of resin impregnated base |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0557800A (en) |
-
1991
- 1991-09-03 JP JP3221923A patent/JPH0557800A/en active Pending
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