JPH055948Y2 - - Google Patents

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Publication number
JPH055948Y2
JPH055948Y2 JP7885590U JP7885590U JPH055948Y2 JP H055948 Y2 JPH055948 Y2 JP H055948Y2 JP 7885590 U JP7885590 U JP 7885590U JP 7885590 U JP7885590 U JP 7885590U JP H055948 Y2 JPH055948 Y2 JP H055948Y2
Authority
JP
Japan
Prior art keywords
cooling
low
temperature
temperature gas
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7885590U
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Japanese (ja)
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JPH0437534U (en
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Filing date
Publication date
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Priority to JP7885590U priority Critical patent/JPH055948Y2/ja
Publication of JPH0437534U publication Critical patent/JPH0437534U/ja
Application granted granted Critical
Publication of JPH055948Y2 publication Critical patent/JPH055948Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Devices For Use In Laboratory Experiments (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Description

【考案の詳細な説明】 [産業上の利用分野] 本考案は、IC寒冷テスト用低温ガスの発生装
置に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a low-temperature gas generator for IC cold testing.

[従来の技術] ICの寒冷性能をテストするために、現在は−
30℃〜−50℃の低温室(冷蔵庫等)内にICを入
れて行う場合と、フロンガスのような冷却用ガス
をスプレーして行う場合とがある。
[Conventional technology] Currently, in order to test the cold performance of ICs, -
There are two methods: placing the IC in a low-temperature room (refrigerator, etc.) at temperatures between 30°C and -50°C, and spraying a cooling gas such as chlorofluorocarbon gas.

[従来技術の課題] しかし、上記何れの場合も、所定の温度まで
ICが冷却されるには時間がかかると共にICの冷
却温度の確認が難かしいという問題がある。
[Problems with conventional technology] However, in any of the above cases, up to a certain temperature
There are problems in that it takes time for the IC to cool down and it is difficult to confirm the cooling temperature of the IC.

本考案は、低温ガスを直接ICに吹きつけて冷
却時間の短縮を図ることのできる寒冷テスト用低
温ガスの製造装置を提案することが目的である。
The purpose of this invention is to propose a low-temperature gas production device for cold tests that can shorten the cooling time by directly blowing low-temperature gas onto ICs.

[課題を解決するための手段] 上記目的を達成するために提案される本考案の
構成は次のとおりである。
[Means for Solving the Problems] The configuration of the present invention proposed to achieve the above object is as follows.

冷却温度では擬固しない冷媒液を充填して成る
冷却槽と、 前記冷却槽内の冷媒液中に浸漬された被冷却ガ
スが通る吸熱器と、 同じように冷却槽内の冷媒液中に浸漬された冷
却用液体が通る放熱器と、 から成るIC寒冷テスト用低温ガスの発生装置。
A cooling tank filled with a refrigerant liquid that does not pseudo-solid at cooling temperatures, a heat absorber through which the gas to be cooled is immersed in the refrigerant liquid in the cooling tank, and a heat absorber that is similarly immersed in the refrigerant liquid in the cooling tank. A low-temperature gas generation device for IC cold testing, consisting of a radiator through which the cooled cooling liquid passes;

なお、冷媒液としてはエチルアルコール、アセ
トン、ヘキサン等の利用が可能である。
Note that ethyl alcohol, acetone, hexane, etc. can be used as the refrigerant liquid.

又、被冷却ガスとしては窒素ガスを、冷却用液
体としては液化窒素を用いることができる。
Further, nitrogen gas can be used as the gas to be cooled, and liquefied nitrogen can be used as the cooling liquid.

[作用] 放熱器に対しては目的とする冷却温度以下の温
度の冷却用液体が供給される。この結果、冷却槽
内の冷媒液が冷却され、この冷媒液の冷熱によつ
て被冷却ガスが冷却されてIC寒冷テスト用の低
温ガスが製造される。この製造された低温ガス
を、直接ICに吹きつけて所定の温度まで冷却し、
寒冷テストを行う。
[Operation] A cooling liquid having a temperature lower than the target cooling temperature is supplied to the radiator. As a result, the refrigerant liquid in the cooling tank is cooled, and the cooled gas is cooled by the cold heat of the refrigerant liquid, producing low-temperature gas for the IC cold test. This produced low-temperature gas is blown directly onto the IC to cool it to a predetermined temperature.
Perform a cold test.

[実施例] 第1図は本考案に係る低温ガス製造装置を示す
もので、1は内部に冷媒液としてのエチルアルコ
ール2を充填した冷却槽にして、3はこの冷却槽
1内に浸漬したその内部を液化窒素が通る放熱
器、4は同じように冷却槽1内に浸漬したその内
部を窒素ガスが通る吸熱器にして、放熱器3に液
化窒素を送入すると、この冷熱により冷媒液2が
冷却され、この冷媒液2が冷却されると吸熱器4
内を通る窒素ガスが冷却される。このようにして
冷却されて低温化した窒素ガスは処理室に導か
れ、ここで直接ICに吹きつけられる。図中5は
攪拌装置である。
[Example] Figure 1 shows a low-temperature gas production apparatus according to the present invention, in which 1 is a cooling tank filled with ethyl alcohol 2 as a refrigerant liquid, and 3 is a cooling tank immersed in this cooling tank 1. 4 is a heat sink through which liquefied nitrogen passes, and 4 is a heat absorber through which nitrogen gas passes, which is immersed in the cooling tank 1. When liquefied nitrogen is fed into the heat radiator 3, the cooling heat causes the refrigerant to cool. 2 is cooled, and when this refrigerant liquid 2 is cooled, the heat absorber 4
The nitrogen gas passing through is cooled. The nitrogen gas cooled in this way is led to the processing chamber, where it is blown directly onto the IC. In the figure, 5 is a stirring device.

第2図にシステム化した低温ガス発生装置を示
す。符号の6は液化窒素タンクにして、このタン
ク6から送り出された液化窒素は気化器7でガス
化され、2つのライン8,8aを経由して2台の
低温ガス発生装置A,Bに送られて吸熱器4内に
入る。
Figure 2 shows a systemized low-temperature gas generator. The symbol 6 is a liquefied nitrogen tank, and the liquefied nitrogen sent out from this tank 6 is gasified in a vaporizer 7 and sent to two low temperature gas generators A and B via two lines 8 and 8a. and enters the heat absorber 4.

一方、冷却用に使用される液化窒素は、タンク
9内に貯蔵されており、このタンク9からライン
10,10aを経由して低温ガス発生装置A,B
内の放熱器3内に入り、前記した熱移動により窒
素ガスを冷却する。このようにして冷却された窒
素ガスは、低温ガス送出ライン13から送り出さ
れてICを直接冷却する。
On the other hand, liquefied nitrogen used for cooling is stored in a tank 9, and is passed from this tank 9 to the low temperature gas generators A and B via lines 10 and 10a.
The nitrogen gas enters the radiator 3 inside and cools the nitrogen gas by the heat transfer described above. The nitrogen gas thus cooled is sent out from the low temperature gas delivery line 13 to directly cool the IC.

このシステムにおいては、2台の低温ガス発生
器A,Bは交互に使用され、連続的な低温ガスの
製造が可能である。又、低温ガスの温度は冷媒液
センサ12で常時監視されており、設定温度に維
持するように液化窒素の送入量がコントローラ1
1で制御されている。
In this system, two low-temperature gas generators A and B are used alternately, allowing continuous production of low-temperature gas. In addition, the temperature of the low-temperature gas is constantly monitored by the refrigerant liquid sensor 12, and the amount of liquefied nitrogen fed is controlled by the controller 1 to maintain the temperature at the set temperature.
It is controlled by 1.

[本考案の効果] 本考案は以上のように、冷媒液を充填した冷却
槽内に冷却液体が通る放熱器と被冷却ガスが通る
吸熱器を浸漬し、冷却液体→冷媒液→被冷却ガス
の順に熱移動を行なわせて低温ガスを製造するの
で、冷媒液温度をセンサで検出し、この温度を冷
却液体の供給量でコントロールすることにより、
低温ガスの温度を正確に維持管理できる。
[Effects of the present invention] As described above, the present invention immerses a heat radiator through which the cooling liquid passes and a heat sink through which the gas to be cooled passes in a cooling tank filled with a refrigerant liquid, and cools the liquid → refrigerant liquid → the gas to be cooled. Since low-temperature gas is produced by heat transfer in the order of
The temperature of low-temperature gas can be maintained and controlled accurately.

この結果、ICの寒冷テストを行う際に、低温
ガスを直接ICに吹きつけて冷却時間の短縮を図
ることができると共にICを所定のテスト温度に
正確に制御できるという効果がある。
As a result, when performing a cold test on an IC, it is possible to shorten the cooling time by directly blowing low-temperature gas onto the IC, and it is also possible to accurately control the IC to a predetermined test temperature.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る低温ガス発生装置の説明
図、第2図は低温ガス発生システムの説明図であ
る。 1……冷却槽、2……冷媒液(エチルアルコー
ル)、3……放熱器、4……吸熱器、5……冷媒
液攪拌装置、6……液化窒素タンク、7……気化
器、9……液化窒素タンク、11……コントロー
ラ、12……冷媒液温度センサ、13……低温ガ
ス送出ライン。
FIG. 1 is an explanatory diagram of a low-temperature gas generation device according to the present invention, and FIG. 2 is an explanatory diagram of a low-temperature gas generation system. 1... Cooling tank, 2... Refrigerant liquid (ethyl alcohol), 3... Heat radiator, 4... Heat absorber, 5... Refrigerant liquid stirring device, 6... Liquid nitrogen tank, 7... Vaporizer, 9 ...Liquid nitrogen tank, 11...Controller, 12...Refrigerant liquid temperature sensor, 13...Low temperature gas delivery line.

Claims (1)

【実用新案登録請求の範囲】 1 冷却温度では凝固しない冷媒液を充填して成
る冷却槽と、 前記冷却槽内の冷媒液中に浸漬された被冷却
ガスが通る吸熱器と、 同じように冷却槽内の冷媒液中に浸漬された
冷却用液体が通る放熱器と、 から成るIC寒冷テスト用低温ガスの発生装置。 2 冷媒液としてエチルアルコール、アセトン、
ヘキサンの中から一種選択された請求項1記載
のIC寒冷テスト用低温ガスの発生装置。 3 被冷却ガスがIC冷却テスト用に使用される
窒素ガスであるところの請求項1記載のIC寒
冷テスト用低温ガスの発生装置。 4 冷却用液体として液化窒素を用いる請求項1
記載のIC寒冷テスト用低温ガスの発生装置。
[Claims for Utility Model Registration] 1. A cooling tank filled with a refrigerant liquid that does not solidify at the cooling temperature, and a heat absorber through which a gas to be cooled immersed in the refrigerant liquid in the cooling tank is cooled in the same way. A low-temperature gas generation device for IC cold testing, consisting of a radiator through which a cooling liquid immersed in a refrigerant liquid in a tank passes; 2 Ethyl alcohol, acetone,
2. The low-temperature gas generator for IC cold test according to claim 1, wherein the low-temperature gas generator is selected from hexane. 3. The low temperature gas generator for IC cooling test according to claim 1, wherein the gas to be cooled is nitrogen gas used for IC cooling test. 4 Claim 1 in which liquefied nitrogen is used as the cooling liquid
The described low temperature gas generator for IC cold testing.
JP7885590U 1990-07-25 1990-07-25 Expired - Lifetime JPH055948Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7885590U JPH055948Y2 (en) 1990-07-25 1990-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7885590U JPH055948Y2 (en) 1990-07-25 1990-07-25

Publications (2)

Publication Number Publication Date
JPH0437534U JPH0437534U (en) 1992-03-30
JPH055948Y2 true JPH055948Y2 (en) 1993-02-16

Family

ID=31622496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7885590U Expired - Lifetime JPH055948Y2 (en) 1990-07-25 1990-07-25

Country Status (1)

Country Link
JP (1) JPH055948Y2 (en)

Also Published As

Publication number Publication date
JPH0437534U (en) 1992-03-30

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