JPH0561359B2 - - Google Patents

Info

Publication number
JPH0561359B2
JPH0561359B2 JP59002918A JP291884A JPH0561359B2 JP H0561359 B2 JPH0561359 B2 JP H0561359B2 JP 59002918 A JP59002918 A JP 59002918A JP 291884 A JP291884 A JP 291884A JP H0561359 B2 JPH0561359 B2 JP H0561359B2
Authority
JP
Japan
Prior art keywords
plating
plating liquid
liquid supply
outflow
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59002918A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60149798A (ja
Inventor
Tsutomu Itano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP59002918A priority Critical patent/JPS60149798A/ja
Publication of JPS60149798A publication Critical patent/JPS60149798A/ja
Publication of JPH0561359B2 publication Critical patent/JPH0561359B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP59002918A 1984-01-11 1984-01-11 めつき装置 Granted JPS60149798A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59002918A JPS60149798A (ja) 1984-01-11 1984-01-11 めつき装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59002918A JPS60149798A (ja) 1984-01-11 1984-01-11 めつき装置

Publications (2)

Publication Number Publication Date
JPS60149798A JPS60149798A (ja) 1985-08-07
JPH0561359B2 true JPH0561359B2 (de) 1993-09-06

Family

ID=11542726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59002918A Granted JPS60149798A (ja) 1984-01-11 1984-01-11 めつき装置

Country Status (1)

Country Link
JP (1) JPS60149798A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH068630U (ja) * 1992-07-06 1994-02-04 新明和工業株式会社 機械式駐車装置の安全装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02185999A (ja) * 1989-01-11 1990-07-20 Nec Corp 電気メッキ槽
US12221713B2 (en) 2018-07-30 2025-02-11 RENA Technologies GmbH Flow generator, deposition device and method for the deposition of a material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH068630U (ja) * 1992-07-06 1994-02-04 新明和工業株式会社 機械式駐車装置の安全装置

Also Published As

Publication number Publication date
JPS60149798A (ja) 1985-08-07

Similar Documents

Publication Publication Date Title
US5514258A (en) Substrate plating device having laminar flow
US5597460A (en) Plating cell having laminar flow sparger
US3649509A (en) Electrodeposition systems
US3536594A (en) Method and apparatus for rapid gold plating integrated circuit slices
US4391694A (en) Apparatus in electro deposition plants, particularly for use in making master phonograph records
JP3308333B2 (ja) 電解メッキ装置，及び電解メッキ処理方法
JPS62207895A (ja) 電解めつき槽
US3317410A (en) Agitation system for electrodeposition of magnetic alloys
JPS5852034B2 (ja) 部分メツキ方法及びその装置
FI873215A0 (fi) Menetelmä ja laite sähkökemiallisesti aktiivisten komponenttien määrittämiseksi
KR100723845B1 (ko) 전기 절연 포일 재료의 표면상에 상호 절연된 도전성 구조체들을 전해 처리하는 방법 및 장치
CN109475884A (zh) 在半导电晶片上电沉积均匀厚度的金属层
IT8249009A1 (it) Sistema ed apparecchio per elettrodepositare un metallo su una superficie conduttiva.
US4376683A (en) Method and device for the partial galvanization of surfaces which are conducting or have been made conducting
US4483749A (en) Method and apparatus for plating minute parts
US3929592A (en) Plating apparatus and method for rotary engine housings
TWI851953B (zh) 無電解電鍍裝置
US4290856A (en) Electroplating apparatus and method
US4132609A (en) Method of and apparatus for electrolytic treatment of metal
JPS60149798A (ja) めつき装置
JPH0539579A (ja) 無電解めつき装置
US5198089A (en) Plating tank
US6949172B1 (en) Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement
US3824137A (en) Solution agitation process
US2828255A (en) Apparatus for producing galvanic coatings