JPH0565109B2 - - Google Patents

Info

Publication number: JPH0565109B2
Authority: JP; Japan
Prior art keywords: movable electrode; electrode; cantilever; plate; fixed
Prior art date: 1987-12-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

JP30968487A

Other languages

English (en)

Japanese (ja)

Other versions

JPH01152369A (ja

Inventor

Kyomitsu Suzuki

Satoshi Shimada

Shigeki Tsucha

Shigeyuki Kobori

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hitachi Ltd

Original Assignee

Hitachi Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-12-09

Filing date

1987-12-09

Publication date

1993-09-17

1987-12-09 Application filed by Hitachi Ltd filed Critical Hitachi Ltd

1987-12-09 Priority to JP30968487A priority Critical patent/JPH01152369A/ja

1989-06-14 Publication of JPH01152369A publication Critical patent/JPH01152369A/ja

1993-09-17 Publication of JPH0565109B2 publication Critical patent/JPH0565109B2/ja

Status Granted legal-status Critical Current

Links

230000001133 acceleration Effects 0.000 claims description 68
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 49
229910052710 silicon Inorganic materials 0.000 claims description 49
239000010703 silicon Substances 0.000 claims description 49
239000011521 glass Substances 0.000 claims description 38
238000005530 etching Methods 0.000 claims description 14
230000005484 gravity Effects 0.000 claims description 8
238000001514 detection method Methods 0.000 description 39
238000000605 extraction Methods 0.000 description 16
235000012431 wafers Nutrition 0.000 description 16
238000006073 displacement reaction Methods 0.000 description 14
238000000034 method Methods 0.000 description 12
239000000853 adhesive Substances 0.000 description 11
230000001070 adhesive effect Effects 0.000 description 11
230000035945 sensitivity Effects 0.000 description 10
230000008859 change Effects 0.000 description 9
238000007740 vapor deposition Methods 0.000 description 8
238000010586 diagram Methods 0.000 description 7
238000004458 analytical method Methods 0.000 description 5
230000000694 effects Effects 0.000 description 5
238000005516 engineering process Methods 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 4
238000005259 measurement Methods 0.000 description 4
230000004044 response Effects 0.000 description 4
239000000463 material Substances 0.000 description 3
239000002184 metal Substances 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
229920002379 silicone rubber Polymers 0.000 description 3
239000004945 silicone rubber Substances 0.000 description 3
238000005452 bending Methods 0.000 description 2
239000005388 borosilicate glass Substances 0.000 description 2
230000002950 deficient Effects 0.000 description 2
238000009792 diffusion process Methods 0.000 description 2
230000003287 optical effect Effects 0.000 description 2
238000002161 passivation Methods 0.000 description 2
238000007747 plating Methods 0.000 description 2
229920002545 silicone oil Polymers 0.000 description 2
238000004544 sputter deposition Methods 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
239000003513 alkali Substances 0.000 description 1
239000012670 alkaline solution Substances 0.000 description 1
230000004888 barrier function Effects 0.000 description 1
238000005422 blasting Methods 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
238000013016 damping Methods 0.000 description 1
230000007423 decrease Effects 0.000 description 1
239000007772 electrode material Substances 0.000 description 1
238000007772 electroless plating Methods 0.000 description 1
238000011156 evaluation Methods 0.000 description 1
230000008713 feedback mechanism Effects 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
239000007788 liquid Substances 0.000 description 1
230000008569 process Effects 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
230000006903 response to temperature Effects 0.000 description 1
238000005488 sandblasting Methods 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
230000002277 temperature effect Effects 0.000 description 1
230000000007 visual effect Effects 0.000 description 1

Landscapes

Pressure Sensors (AREA)

JP30968487A 1987-12-09 1987-12-09 容量式加速度センサ Granted JPH01152369A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP30968487A JPH01152369A (ja)	1987-12-09	1987-12-09	容量式加速度センサ

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP30968487A JPH01152369A (ja)	1987-12-09	1987-12-09	容量式加速度センサ

Publications (2)

Publication Number	Publication Date
JPH01152369A JPH01152369A (ja)	1989-06-14
JPH0565109B2 true JPH0565109B2 (de)	1993-09-17

Family

ID=17996033

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP30968487A Granted JPH01152369A (ja)	1987-12-09	1987-12-09	容量式加速度センサ

Country Status (1)

Country	Link
JP (1)	JPH01152369A (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2512171B2 (ja) *	1989-10-18	1996-07-03	株式会社日立製作所	加速度検出器
JPH0833410B2 (ja) *	1990-01-12	1996-03-29	株式会社日立製作所	加速度センサ
JPH0833411B2 (ja) *	1990-06-15	1996-03-29	株式会社日立製作所	半導体加速度センサ
JPH0447271A (ja) *	1990-06-15	1992-02-17	Hitachi Ltd	加速度センサ及びその出力電圧調整方法
JPH04130277A (ja) *	1990-09-21	1992-05-01	Nissan Motor Co Ltd	半導体加速度センサ
JP3194594B2 (ja) *	1990-09-26	2001-07-30	株式会社日立製作所	構造体の製造方法
US5504356A (en) *	1992-11-16	1996-04-02	Nippondenso Co., Ltd.	Semiconductor accelerometer
JP3303430B2 (ja) *	1993-05-21	2002-07-22	株式会社デンソー	Ｆｅｔ型加速度センサ
JP2010066231A (ja) *	2008-09-12	2010-03-25	Mitsubishi Electric Corp	加速度センサ
JP4962482B2 (ja) *	2008-12-18	2012-06-27	株式会社デンソー	半導体装置

1987
- 1987-12-09 JP JP30968487A patent/JPH01152369A/ja active Granted

Also Published As

Publication number	Publication date
JPH01152369A (ja)	1989-06-14

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Legal Events

Date	Code	Title	Description
2007-09-17	LAPS	Cancellation because of no payment of annual fees