JPH056685Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention is a flexible printed wiring board (hereinafter referred to as
This is an FPC arrangement structure in which multiple printed wiring boards, including FPCs on which electronic components are mounted, are arranged so as to overlap with each other at a predetermined interval. , relates to a technique for ensuring insulation between mounted electronic components placed in close proximity.

[Prior art]

In devices that incorporate multiple printed wiring boards, including FPCs, there is a tendency to pack the printed wiring boards into an increasingly narrow space due to the demand for compactness.

FIG. 5 shows a group of printed wiring boards stored in the printed wiring board storage section of a camera, for example.
Rigid board (hereinafter referred to as PCB) 1 and
The FPC 5 is arranged in an overlapping manner in the vertical direction with a slight gap. PCB1 has connector part 3
is provided, and connection terminals 3a protrude from the back surface of the PCB 1. The terminal 3 of FPC5
An electronic component 6 is mounted near a. One end of the FPC 5a is connected and fixed to another PCB 7, and the other end of the FPC is connected to a moving member (not shown) so that it can move in the direction indicated by arrow A in FIG.

[Problem that the invention attempts to solve]

In the FPC arrangement structure described above, FPC5 is the fifth
When the FPC 5 moves to the left in the figure, the FPC 5 bends upward as shown by the imaginary line, and therefore the electronic component 6 may come into contact with the terminal 3a and be shot. Further, even when the FPC 5 is not connected to a moving member, the FPC 5 swings vertically due to vibrations, etc., and as a result, there is a problem in that the electronic component 6 comes into contact with the terminal 3a.

The present invention was developed in view of the problems of the prior art described above, and its purpose is to improve insulation between conductive parts mounted on an FPC and conductive parts mounted on other FPCs or PCBs in close proximity. The purpose of this invention is to provide an FPC arrangement structure that can ensure the following.

[Means to solve the problem]

In order to achieve the above purpose, the present invention
In an FPC arrangement structure, one FPC and a PCB or other FPC are arranged in a superposed state with a predetermined distance apart, and one FPC on which a conductive component is mounted, and a PCB or other FPC on which a conductive component is mounted. In an FPC arrangement structure in which conductive components are arranged close to each other, one FPC or one of the above-mentioned
At least a partial region of the FPC is bent so as to extend between the conductive parts and fixed to the PCB or the other FPC.

[Effect]

Even if the FPC-mounted conductive component and the PCB or other FPC-mounted conductive component come close to each other, the FPC area extending between these conductive components acts as a wall and prevents contact between the two conductive components.

〔Example〕

Next, embodiments of the present invention will be described based on the drawings.

1 and 2 show an embodiment of the present invention, and FIG. 1 shows a longitudinal cross-sectional view of an FPC arrangement structure in which a PCB and an FPC are arranged close to each other in the vertical direction. Figure 2 shows a plan view of the FPC before assembly.

In these figures, an FPC 20 is placed below the PCB 10 with a gap d in between. PCB1
0 is constructed by forming a predetermined copper circuit pattern on a rigid board, while the FPC 20 is
A predetermined circuit pattern is formed using copper foil on an insulating base film, and a base film is coated on the circuit pattern, which is conventionally known, and detailed structural explanation thereof will be omitted.

A terminal connection land (not shown) is formed on the surface of the PCB 10, and a connection cord 14 from an electronic device (not shown) is connected to this land via a connector section 12. and
Connection terminals 16, 16a, 16 on the back side of PCB 10
b stands out.

On the other hand, a land (not shown) is formed in a region of the FPC 20 corresponding to the mounting position of the connector section 12 of the PCB 10, and a land (not shown) is formed here.
2a to 22f are connected by solder. One end 20a of the FPC is connected to another PCB 10A, and the other end 20b is connected to another PCB (not shown). As shown in FIG. 2, a partial region 21 connected to the mounting area of the electronic component group 22 of the FPC 20 is formed in the shape of a tongue, and is bent at the base of the tongue as shown by the imaginary line in FIG. It is folded back and extended to cover the electronic component group 22. The tip end portion 21a is fixed to the FPC 20 in an overlapping state by a boss 18 protruding from the back surface of the PCB 10.

The boss 18 is the gap d between the PCB 10 and the FPC 20.
It is formed larger, and its tip portion is formed into an eboshi hat shape consisting of a tip swollen portion 18a and a constricted diameter portion 18b connected thereto. On the other hand, this
Holes 24a and 24b are formed in the FPC 20 at a position facing the boss 18 and at the tip of the tongue-like extension 21, into which the boss tip bulge 18a can be press-fitted. Then, bend the tongue-shaped extension portion 21,
By press-fitting the holes 24a and 24b into the boss tip bulging portion 18a, the tongue-like extension portion 21 can be disposed between the electronic component group 22 and the terminal 16.

In this way, in this embodiment, the tongue-shaped extension portion 21 is disposed between the electronic component group 22 mounted on the FPC and the connection terminal 16 protruding from the back surface of the PCB, so that the FPC 20 does not swing. Even if the electronic component group 22 approaches the connection terminal 16, it cannot come into direct contact because of the tongue-shaped extension 21, so there is no short circuit between the two.

Further, the front and back surfaces of the FPC 20 are coated with an insulating member (base film or overlay film), so that even if the tongue-like extension portion 21 and the connecting terminal 16 come into contact, there is no risk of short circuit between them.

Furthermore, in this embodiment, since the insulation between the FPC side electronic component group 22 and the PCB side connection terminal 16 is ensured, the PCB 10 and the FPC 2
This allows the printed wiring boards to be placed in a polymerized state to be multi-layered.In other words, by making the printed wiring board storage space thinner, it is possible to reduce the space d between the printed wiring boards. Can be made compact.

FIG. 3 shows an FPC arrangement structure according to another embodiment of the present invention, which differs from the first embodiment described above in that the tip portion 21 of the tongue-like extension portion 21 of the FPC 20
A is fixed to the FPC 20 using rivets 40. The rest is the same as in the previous embodiment, and the explanation thereof will be omitted by giving the same reference numerals.

FIG. 4 shows still another embodiment of the present invention, in which the tongue-shaped extension part 21 of the FPC is folded back and extended above the electronic component group 22, and the PCB
It is fixed to the back side of 10 with double-sided adhesive tape 50.

According to this embodiment, the same effects as in the previous embodiment can be obtained, and there is no need to provide other members such as the boss 18 and rivet 40 shown in the above embodiment to fix the FPC extension portion 21. The configuration is extremely simple.

In the above embodiment, the FPC 20 and the PCB 10 are arranged in a polymerized state, but it goes without saying that the present invention can also be applied to a structure in which the FPCs are arranged.

[Effect of idea]

As is clear from the above explanation, the present invention
According to the FPC arrangement structure, conductive components mounted on one FPC and conductive components mounted on a PCB or another FPC are separated by a partial area of the FPC extending between them. As a result, contact between conductive parts is avoided, thereby ensuring reliable insulation.

[Brief explanation of drawings]

Fig. 1 is a longitudinal sectional view showing one embodiment of the present invention, Fig. 2 is a plan view of the FPC before assembly, Fig. 3 is a longitudinal sectional view of the second embodiment of the invention, and Fig. 4 is the main body of the present invention. A vertical sectional view of the third embodiment of the invention, FIG.
FIG. 3 is a longitudinal cross-sectional view of an FPC arrangement structure. 10... PCB, 12... Connector portion which is a mounted conductive component, 16, 16a, 16b... Connection terminal which is a part of mounted conductive component, 18... Boss which is a means for fixing the tongue-shaped extension part of FPC , 20...FPC,
21...Disposed between the electronic components group and the connection terminals
A tongue-shaped extension part that is a part of the FPC, 22...
Electronic components that are mounted conductive components, 40...FPC
A rivet, 50...
...Double-sided adhesive tape that is a means of fixing the tongue-like extension of the FPC, d...The separation distance between the FPC and the PCB.

Claims (1)

[Scope of utility model registration request] A flexible printed wiring board arrangement structure in which one flexible printed wiring board and a rigid board or another flexible printed wiring board are arranged in an overlapping state with a predetermined distance apart, the flexible printed wiring board In a device in which a conductive component mounted on a rigid board or a conductive component mounted on a rigid board or other flexible printed wiring board are arranged close to each other, at least one of the first flexible printed wiring board or one of the flexible printed wiring boards area is bent,
A flexible printed wiring board arrangement structure, characterized in that the flexible printed wiring board is fixed to a rigid board or the other flexible printed wiring board so as to extend between the conductive parts arranged close to each other.