JPH056903U - Stripline resonator - Google Patents

Abstract

(57) [Abstract] [Purpose] In a triplate-type stripline resonator in which two dielectric substrates each having a resonance electrode formed on the main surface and side electrodes formed on the side surfaces are bonded together, It is possible to prevent an unnecessary electrode pattern from being formed in the gap. [Structure] Resonance electrodes 2 and 3 are formed on a first main surface of a dielectric substrate 1, side electrodes 10 are formed on side surfaces, two dielectric substrates are opposed to each other, and then side electrodes 10a-10b are soldered. Connect by attaching. The molten solder does not permeate into the gap between the two dielectric substrates and an unnecessary electrode pattern due to the solder is not formed in the gap between the two dielectric substrates.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a stripline resonator formed by forming a resonance electrode on a dielectric substrate.

[0002]

[Prior Art]

 For example, a stripline resonator used as a filter in a microwave band generally has a stripline resonance electrode formed on a first main surface of a dielectric substrate and a ground electrode formed on a second main surface. .. In addition, in a triplate-type stripline resonator that has the effect of reducing conduction loss and electromagnetic field leakage, two dielectric substrates with substantially symmetrical electrode patterns are joined with their resonant electrodes facing each other. It consists of:

FIG. 5 shows the structure of two dielectric substrates forming a triplate stripline resonator. In FIG. 5, 1a and 1b are dielectric substrates, respectively. Two resonant electrodes 2a and 3a and input / output electrodes 4a and 5a are formed on the first main surface (upper surface in the figure) of the dielectric substrate 1a. Further, lead electrodes for input / output electrodes are formed on two side surfaces of the dielectric substrate 1a, and ground electrodes are formed from the second main surface (lower surface in the figure) to four side surfaces of the dielectric substrate 1a. Similarly, resonance electrodes 2b and 3b, input / output electrodes 4b and 5b, and a ground electrode are also formed on the dielectric substrate 1b.

After the dielectric substrates having various electrodes thus formed are bonded to each other with the silver paste or the like so that the resonance electrodes face each other, a laminated body is formed, and then the silver paste is applied to the side surface of the laminated body. By applying, drying and baking, the resonance electrodes formed on the two dielectric substrates are joined together, and the ground electrodes are connected together.

[0005]

However, in such a conventional tri-plate type stripline resonator, the silver paste for connecting the side surfaces of the laminated body formed by laminating two dielectric substrates is There is a problem that an unnecessary electrode pattern is formed in the space between the two dielectric substrates due to the capillary phenomenon that the material permeates into the gap formed between the two dielectric substrates and then is baked.

FIG. 6 is a plan view of one of the dielectric substrates obtained by disassembling a stripline resonator that is considered defective by the characteristic test. In this way, the silver paste penetrates from the peripheral portion of the dielectric substrate to the inside, and the unnecessary electrode S is formed by baking.

When the electrode S is attached to a portion other than the short-circuited end of the input / output electrode or the resonance electrode, the characteristics of the resonator are affected. Therefore, there is a problem in that the characteristics vary depending on the amount of bleeding, and the input / output electrodes and the ground electrode are short-circuited, and the desired characteristics cannot be obtained.

The purpose of the present invention is to prevent the adverse effect of the silver paste penetrating from the side between two bonded dielectric substrates and to easily obtain the desired characteristics. To provide a container.

[0009]

[Means for Solving the Problems]

 This invention is a stripline resonator in which two dielectric substrates, each having a resonance electrode formed on a first main surface and a side electrode formed on a side surface, are bonded to each other with the first main surfaces facing each other. The side electrodes of the two dielectric substrates are connected by soldering.

[0010]

[Action]

 In the stripline resonator of the present invention, the resonance electrodes are formed on the first main surfaces of the two dielectric substrates, and the side electrodes that act as ground electrodes are formed on the side surfaces. Then, the side electrodes are connected by soldering with the first main surfaces of the two dielectric substrates facing each other. As described above, since the two side electrodes are preliminarily formed in the stacked state and the side electrodes are connected by soldering, the electrodes are not formed due to the surface tension of the molten solder at the time of soldering. Solder does not adhere to the part, and solder does not penetrate into the gap between the two dielectric substrates. As a result, an unnecessary electrode pattern is not formed around the surface of the dielectric substrate on which the resonance electrode is formed, and a stripline resonator having desired characteristics and having less characteristic variation can be obtained.

[0011]

【Example】

 FIG. 1 shows a configuration before assembly of a stripline resonator which is an embodiment of the present invention. In FIG. 1, 1a and 1b are dielectric substrates, respectively. Two resonant electrodes 2a and 3a and input / output electrodes 4a and 5a are formed on the first main surface (upper surface in the figure) of the dielectric substrate 1a. Further, lead electrodes for input / output electrodes such as 9a are formed on the two side surfaces of the dielectric substrate 1a, and side surface electrodes 10a are formed on the four side surfaces of the substrate excluding the lead electrode portions. On the main surface (lower surface in the figure), the ground electrode 11a is formed on almost the entire surface. Similarly, the resonance electrodes 2b and 3b and the input / output electrodes 4b and 5b are formed on the first main surface (upper surface in the figure) of the dielectric substrate 1b, and the lead-out electrodes of the input / output electrodes such as 9b are formed on the two side surfaces. Side electrodes 10b are formed on the four side surfaces, and a ground electrode 11b is formed on substantially the entire second main surface (lower surface in the figure). The two dielectric substrates 1a and 1b having the symmetrical electrode patterns formed as described above are stacked so that the resonance electrodes face each other to form a laminated body as shown in FIG.

After that, the side electrodes 10a-10b exposed on the side surface of the laminated body shown in FIG. 2 and the lead electrodes 9a-9b of the input / output electrodes are soldered to each other and integrated as shown in FIG. Turn into. In FIG. 3, reference numeral 12 is a solder for connecting the side electrodes, and 13 is a solder for connecting the lead electrodes. Such soldering between silver electrodes can be done manually by using a soldering iron, but as another method, so-called paste solder (cream) in which a solder powder and a vehicle are mixed and a solvent is added is used. It is also possible to apply (solder) to the side surface of the laminate and solder it through a reflow oven. By applying such paste solder to the side surface of the laminated body, paste solder may penetrate into the gap between the two substrates.However, even if it penetrates, the solder particles will be removed by the subsequent heating. The surface tension of the molten solder causes the solder to adhere only to the surface on which the silver electrode is formed, and the electrode pattern is not formed by the solder in the gap between the substrates.

Therefore, when the stripline resonator in which the side electrodes are connected by soldering in this manner is disassembled, an unnecessary electrode pattern is not formed on the peripheral portion of the dielectric substrate as shown in FIG. A stripline resonator with little characteristic variation can be obtained.

In the above-described embodiment, two dielectric substrates are joined by soldering on the side surface. However, in order to more reliably connect the resonance electrodes to each other, among the opposing resonance electrodes, It is also possible to apply paste solder to at least one of the resonance electrodes, bond the two dielectric substrates together, and then connect the resonance electrodes together with the side electrodes by a subsequent reflow process. Alternatively, the resonance electrodes may be attached to each other via a silver paste, baked, and then soldered to the side surfaces of the laminate in the same manner.

[0015]

[Effect of the device]

 According to this invention, since an unnecessary electrode pattern is not formed in the gap between the two dielectric substrates that are bonded together, a strip line resonator having desired characteristics and having less characteristic variation can be obtained. Further, since the side electrodes are connected using solder, the material cost can be reduced.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a stripline resonator according to an embodiment before assembly.

FIG. 2 is a perspective view of a laminated body including the two dielectric substrates shown in FIG.

FIG. 3 is a perspective view of a stripline resonator formed by soldering between side electrodes of a laminated body.

FIG. 4 is a plan view of a dielectric substrate obtained by disassembling a stripline resonator according to an example.

FIG. 5 is an exploded perspective view of a conventional stripline resonator before assembly.

FIG. 6 is a plan view of a dielectric substrate obtained by disassembling a conventional stripline resonator.

[Explanation of symbols]

 1-Dielectric substrate, 2,3-Resonance electrode 4,5-Input / output electrode 9-Lead electrode 10-Side electrode 11-Ground electrode 12,13-Solder

Claims (1)

[Claims for utility model registration] [Claim 1] Two dielectric substrates, each having a resonance electrode formed on a first main surface and a side electrode formed on a side surface, are bonded so that the first main surfaces face each other. In the stripline resonator, the stripline resonator is characterized in that side electrodes of the two dielectric substrates are connected by soldering.