JPH0572169U - Tool-like mechanism for heating type bonding equipment - Google Patents

Abstract

(57) [Summary] [Object] To provide a tool following mechanism for a heating type bonding apparatus, which can effectively maintain the adhesion of the bonding tool even against deformation on the heating type bonding side. [Structure] A bonding tool 5 for thermocompression bonding of an object to be bonded, a swing block 4 which suspends and supports this bonding tool 5 and swings about a rotation center as a fulcrum, and as a rotation center of this swing block 4. It includes a pin 2 that functions and supports the rocking block 4, elastic bodies 3 and 3 that hold the rocking block 4 on both sides thereof in advance and expand and contract by external pressure, and a housing 1 that holds the pin 2.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a tool following mechanism for a heating type bonding device, and more particularly to a following tool following mechanism for a bonding tool for thermocompression bonding an electronic component onto a printed circuit board.

[0002]

[Prior Art]

 Heretofore, as this type of tracing mechanism, a leaf spring has been generally used, or a mechanism in which the shape of a component is machined and its elastic deformation is utilized has been generally used.

[0003]

[Problems to be solved by the device]

 However, in the case of a leaf spring, due to variations in the deformation strength of deformed parts, etc. and the variety of deformation directions, the flatness is not sufficient, and the flatness of each side is not independent, so the flat state of the board side is sufficiently followed. However, there was the inconvenience that the adhesion between the bonding tool and the substrate could not be ensured.

[0004]

[The purpose of the device]

 The present invention improves the disadvantages of the conventional example, and particularly for a heating type bonding apparatus capable of maintaining the adhesiveness of the bonding tool effectively against the deformation of the heating type bonding side. A tool tracking mechanism can be provided.

[0005]

[Means for Solving the Problems]

 In the present invention, a bonding tool for thermocompression bonding of an object to be bonded, a swing block that suspends and supports the bonding tool and swings about a rotation center as a fulcrum, and functions as a rotation center of the swing block. The structure includes a pin that supports the rocking block, an elastic body that holds the rocking block on both sides thereof with a preload and expands and contracts by an external pressure, and a housing that holds the pin. This aims to achieve the above-mentioned purpose.

[0006]

【Example】

 An embodiment of the present invention will be described below with reference to FIGS. In the embodiment shown in FIG. 1 or FIG. 2, a bonding tool 5 for thermocompression bonding of a chip terminal, which is an object to be bonded, and the bonding tool 5 are suspended and supported, and swing about a rotation center as a fulcrum. The oscillating block 4, the pin 2 that functions as the center of rotation of the oscillating block 4 and supports the oscillating block 4, and the elastic bodies 3 and 3 that pre-hold the oscillating block 4 on both sides and expand and contract by external pressure. And a housing 1 for holding the pin 2.

This will be described in more detail. 1 and 2, the swing block 4 is held by a pin 2 attached to a housing 1 so as to be movable in the horizontal direction of the drawing. The rocking block 4 is preloaded by the elastic body 3 in the left-right direction of the drawing, and the bonding tool 5 is fixed to the lower part of the rocking block 4.

Next, an operation example of the present invention will be described. When the housing 1 linearly moves by an arbitrary drive source and comes into contact with the base plate 6 inclined by an angle θ from the direction perpendicular to the moving direction of the housing 1, the bonding tool 5 is further pressed against the printed circuit board 6. In the process, the oscillating block 4 further deforms the elastic body 3 in the pre-loaded state and tilts up to the angle θ with the pin 2 as a fulcrum, so that the bonding tool 5 is brought into close contact with the upper surface of the substrate 6.

[0009]

[Effect of the device]

 As described above, according to the present invention, the fixing portion of the bonding tool is preloaded by the elastic body and can be swung only in the necessary direction about the rotation center as a fulcrum, and each side is independently provided with the function. Therefore, it is possible to provide an unconventional and practical tool-like mechanism for a heating-type bonding apparatus, which enables the bonding tool to be surely brought into close contact with the printed circuit board.

[Brief description of drawings]

FIG. 1 is a partially sectional front view showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing the operation of FIG.

[Explanation of symbols]

 1 Housing 2 Pin 3 Elastic Body 4 Swing Block 5 Bonding Tool 6 Printed Circuit Board

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[Procedure amendment]

[Submission date] December 11, 1992

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 1

[Correction method] Change

[Correction content]

[Figure 1]

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 2

[Correction method] Change

[Correction content]

[Fig. 2]

Claims (1)

[Scope of utility model registration request] 1. A bonding tool for thermocompression bonding of an object to be bonded, a swinging block that suspends and supports the bonding tool and swings around a rotation center as a fulcrum, and functions as the rotation center of the swinging block. And a pin for supporting the rocking block, an elastic body that holds the rocking block on both sides of the rocking block and expands and contracts by an external pressure, and a housing for holding the pin. mechanism.