JPH057245Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> This invention relates to a strip-shaped object take-out device that can take out a plurality of strip-shaped objects such as IC lead frames in a stacked state.

<Prior art> For example, when plating a strip-shaped object such as an IC lead frame, it is necessary to improve the processing efficiency of the plating device as a whole, that is, the processing speed. This is naturally required not only for the processing speed of the processing tank (see Japanese Utility Model Application Publication No. 178365/1983).

<Problem that the invention aims to solve> However, since strip-shaped objects such as IC lead frames have many small protrusions on the front and back, they tend to get caught on surrounding parts and are difficult to handle. Because it is thin, easily deformed, and vulnerable to impact, it was necessary to take it out and store it gently without applying impact to the IC lead frame from the lead line. As described above, a device for taking out a strip-shaped object is faced with the technical problem of having to simultaneously satisfy two conflicting demands: improvement in processing speed and careful handling.

<Means for solving the problem> The device for taking out strip-shaped objects according to this invention was proposed in response to the above-mentioned request, and includes a tray with pins or a frame on the outlet side of the processing tank. A device for taking out strip-shaped objects sent out from the processing tank by placing them one by one into a pin or a frame, receiving them one by one, stacking a plurality of strip-shaped objects, and taking out the tray together, the device having an output side to the processing tank. The water tank is provided with a water tank in which the tray can be exchanged and taken out, and the water tank includes a water flow applying means for applying a water flow to the tray disposed inside to guide the fall of the strip-shaped object. , is provided.

In another device for taking out strip-shaped objects, the water tank serves as a plating liquid collection tank.

<Function> A tray with pins or a frame for storing the strip-shaped objects is placed in the water tank, so even if the strip-shaped objects sent out from the treatment tank are dropped there, the buffering effect of the water will not be applied. You will not receive any shock from it. Therefore, if the strip-shaped object is something like an IC lead frame, it will not affect the plating applied in the plating process, and there is no risk of deforming the IC lead frame itself.

In addition, the water tank is equipped with a water flow applying means for applying a water flow to the tray disposed inside to guide the fall of the rectangular object, so that the rectangular object dropped (sent out) onto the water surface is affected by the water flow. Due to the fall guidance effect, the object can be quickly dropped into the water, and multiple strip-shaped objects can be taken out and stored at high processing speed.

Furthermore, if the water tank is used as a plating liquid recovery tank, if the strip-shaped object is a plated object, even if there is residual plating liquid on the plated object, it can be washed away and the precious metal components in the plating liquid can be washed away. Recovery may also be possible.

<Example> Hereinafter, a preferred example of this invention will be described based on the drawings.

Reference numeral 1 denotes a take-out device, which is installed as a next step on the outlet side of a spray plating device (spargeer device) serving as a "processing tank" (not shown) on the plating device line. This take-out device 1 includes a water tank 2 and a tray 5 with support pins 3 and 4 that is submerged in the water tank 2. An overflow wall 6 is formed on the rear side of the water tank 2 (downstream side of the plating processing line, direction A in the figure), and the position of the water surface 7 in the water tank 2 is always kept constant. The bottom 9 of the overflow chamber 8 formed by the wall 6 and the rear wall 16 and the bottom 10 on the front side (direction B) of the water tank 2 are connected by a circulation path 12 via a water pump 11. The water in the overflow chamber 8 is channeled through an inlet 13 provided at the rear bottom 9.
The introduction of the water jets constitutes a "water flow providing means" that injects water from a nozzle 14 provided in the bottom portion 10 in the forward direction. Then, the water jetted from the nozzle 14 rises along the front wall 15 of the water tank 2,
The water then flows horizontally along the water surface 7, then descends and returns to the original nozzle 14, where it flows back (water flow) K in the vertical direction within the water tank 2. In other words, the entire water in the water tank 2 flows back in the vertical direction together with the water injected from the nozzle 14.

A rail 19 is fixed from the approximate center of the bottom 10 of the water tank 2 to the rear position, and the tray 5 is disposed on the rail 19 so as to be movable back and forth and also to be replaceable and removable. The reason why the range in which the tray 5 can be moved back and forth is limited to the area from the approximate center of the water tank 2 to the rear position is because the water flows downward in this range, which will be described in detail later. .

Furthermore, on the top surface of this tray 5, there are two support pins 3 that regulate the front and back of the IC lead frame 17 as a "rectangular object" and two pairs (4) of support pins that regulate the left and right side edges. 4 has been erected. These support pins 3 and 4 are all long enough to make the heads 3a and 4a protrude from the water surface 7. Further, a handle portion 18 is provided at the front end of this tray 5, and after storing a predetermined number of IC lead frames 17, the IC lead frame
7 and tray 5 can be carried around.

Next, the effect will be explained. The IC lead frame 17 that is sent out from the exit side of the jet plating device (not shown) is sent toward the take-out device 1 as shown by the arrow, but is guided by guide means (not shown) and support pins 3 and 4 protruding from the water surface 7. The IC lead frame 17 can be received by the heads 3a and 4a within an area that can be controlled by the support pins 3 and 4.
In addition, although the IC lead frame 17 that has been sent falls onto the water surface 7, it receives almost no impact due to the buffering effect of the water, so that the minute and precise plating (precipitates) applied in the spray plating process is not affected. without affecting the IC lead frame 17
It does not deform itself. Furthermore, this IC
As a means for sending out the lead frame 17,
The side ends of the IC lead frame 17 may be pinched by a chuck mechanism (claw mechanism), and the IC lead frame 17 may be securely transferred onto the area defined by the support pins 3 and 4, and dropped there.

Water surface 7 within the area that can be regulated by support pins 3 and 4
The IC lead frame 17 that has fallen into the water begins to fall into the water due to its own weight, but since downward reflux K is occurring as described above from the approximate center of the water tank 2 in which the tray 5 is placed to the rear position, this Due to the downward reflux (water flow) action, the IC lead frame 17 sinks more quickly than the natural falling speed in the water due to its own weight, and is stacked and stored one after another on the tray 5. Therefore, the storage processing speed of the IC lead frame 17 is fast, and a large number of IC lead frames can be stored in a short period of time.
Even if the IC lead frame 17 is sent in, it can be handled, and it can contribute to improving the processing speed of the entire plating device.

Furthermore, since the IC lead frame 17 is stored submerged in water, even if the plating liquid carried over from the plating processing device upstream of the line remains on the IC lead frame 17, it can be washed away. Precious metal recovery device 20 inside
By interposing the plating liquid, the water tank 2 directly serves as a plating liquid recovery tank, and the precious metals in the carryover plating liquid adhering to the IC lead frame 17 can also be recovered. Note that the means for collecting the plating solution is not limited to this, and any known collection means can be provided in the water tank 2.

In the above description, the IC lead frame 17 was used as an example of a "rectangular object", but the present invention is not limited to this. Moreover, although an example in which the water in the water tank 2 is recirculated in the vertical direction is shown as an example of the "water flow," the water flow does not need to be recirculated as long as it is a water flow that induces a fall of the rectangular object.

<Effect of the invention> The device for taking out a strip-shaped object according to this invention has the content as explained above, and a tray with a pin or a frame for storing the strip-shaped object is placed in an aquarium. Because of this arrangement, even if a strip-shaped object sent out from the processing tank falls there, it will not be affected by the buffering effect of water. Therefore, if the strip-shaped object is something like an IC lead frame, it will not affect the plating applied in the plating process, and there is no risk that the IC lead frame itself will be deformed.

In addition, the water tank is equipped with a water flow applying means for applying a water flow to the tray disposed inside to guide the fall of the rectangular object, so that the rectangular object dropped (sent out) onto the water surface is A plurality of strip-shaped objects can be taken out and stored at high processing speeds because they are quickly dropped into the water by the action of water flow.

Furthermore, if the water tank is used as a plating liquid collection tank, if the strip-shaped object is a plated object such as an IC lead frame, even if there is residual plating liquid on the plated object, it can be washed away and the plating liquid in the plated object can be washed away. Recovery of precious metal components can also be performed.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a device for taking out a strip-shaped object according to an embodiment of the invention, and FIG.
It is a sectional view corresponding to the arrow - line in the figure. 1... Removal device, 2... Water tank, 3, 4... Support pin, 5... Tray, 17... Plated item, {11
... Water flow pump, 12 ... Circulation path, 13 ... Inlet, 14 ... Nozzle} Water flow imparting means, 17 ...
IC lead frame (rectangular object), K...reflux (water flow).

Claims (1)

[Scope of Claim for Utility Model Registration] (1) A tray with pins or a frame is disposed on the outlet side of the treatment tank, and strip-shaped objects sent out from the treatment tank are received one by one by placing them in the pin or frame, A device for taking out a plurality of strip-shaped objects in a stacked state and taking out the tray together, which has a water tank provided on the outlet side of the processing tank and into which the trays can be exchanged and taken out freely, and in this water tank. A device for taking out a strip-shaped object, characterized in that it is provided with a water flow applying means for applying a water flow for guiding the fall of the strip-shaped object to a tray installed inside the device. (2) The device for taking out a strip-shaped object according to claim (1), wherein the water tank is a plating liquid collection tank.