JPH0575590B2 - - Google Patents

Info

Publication number
JPH0575590B2
JPH0575590B2 JP63227524A JP22752488A JPH0575590B2 JP H0575590 B2 JPH0575590 B2 JP H0575590B2 JP 63227524 A JP63227524 A JP 63227524A JP 22752488 A JP22752488 A JP 22752488A JP H0575590 B2 JPH0575590 B2 JP H0575590B2
Authority
JP
Japan
Prior art keywords
heat
resistant
layer
film
thermal head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63227524A
Other languages
English (en)
Japanese (ja)
Other versions
JPH021339A (ja
Inventor
Katsuhisa Honma
Masaru Nikaido
Yoshiaki Oochi
Hideji Yoshizawa
Mutsuki Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP63227524A priority Critical patent/JPH021339A/ja
Priority to US07/328,980 priority patent/US4963893A/en
Priority to EP89303052A priority patent/EP0335660B1/de
Priority to KR1019890003860A priority patent/KR920005317B1/ko
Priority to DE89303052T priority patent/DE68908749T2/de
Publication of JPH021339A publication Critical patent/JPH021339A/ja
Priority to US07/519,179 priority patent/US5119112A/en
Priority to US07/804,014 priority patent/US5177498A/en
Publication of JPH0575590B2 publication Critical patent/JPH0575590B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3353—Protective layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/3355—Structure of thermal heads characterised by materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/3359—Manufacturing processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electronic Switches (AREA)
JP63227524A 1988-03-28 1988-09-13 耐熱性絶縁基板、サーマルヘッドおよび感熱記録装置 Granted JPH021339A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP63227524A JPH021339A (ja) 1988-03-28 1988-09-13 耐熱性絶縁基板、サーマルヘッドおよび感熱記録装置
US07/328,980 US4963893A (en) 1988-03-28 1989-03-27 Heat-resistant insulating substrate, thermal printing head, and thermographic apparatus
EP89303052A EP0335660B1 (de) 1988-03-28 1989-03-28 Wärmebeständiges, isolierendes Substrat, thermischer Druckkopf und thermografischer Apparat
KR1019890003860A KR920005317B1 (ko) 1988-03-28 1989-03-28 내열성 절연기판, 서멀헤드 및 감열 기록 장치
DE89303052T DE68908749T2 (de) 1988-03-28 1989-03-28 Wärmebeständiges, isolierendes Substrat, thermischer Druckkopf und thermografischer Apparat.
US07/519,179 US5119112A (en) 1988-03-28 1990-05-04 Heat-resistant insulating substrate, thermal printing head, and thermographic apparatus
US07/804,014 US5177498A (en) 1988-03-28 1991-12-09 Heat-resistant insulating substrate, thermal printing head, and thermographic apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7424188 1988-03-28
JP63-74241 1988-03-28
JP63227524A JPH021339A (ja) 1988-03-28 1988-09-13 耐熱性絶縁基板、サーマルヘッドおよび感熱記録装置

Publications (2)

Publication Number Publication Date
JPH021339A JPH021339A (ja) 1990-01-05
JPH0575590B2 true JPH0575590B2 (de) 1993-10-20

Family

ID=13541466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63227524A Granted JPH021339A (ja) 1988-03-28 1988-09-13 耐熱性絶縁基板、サーマルヘッドおよび感熱記録装置

Country Status (2)

Country Link
JP (1) JPH021339A (de)
KR (1) KR920005317B1 (de)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842472A (ja) * 1981-09-07 1983-03-11 Semiconductor Energy Lab Co Ltd サ−マルヘツド
JPS6112357A (ja) * 1984-06-29 1986-01-20 Hitachi Ltd 感熱記録ヘツド
JPS6144401A (ja) * 1984-08-08 1986-03-04 ティーディーケイ株式会社 耐摩耗層および電子部品
JPS61169262A (ja) * 1985-01-24 1986-07-30 Toshiba Corp サ−マルヘツド及びその製造方法
JPS6277476A (ja) * 1985-10-01 1987-04-09 Tdk Corp 保護膜及びその製造法
JPS62117760A (ja) * 1985-11-19 1987-05-29 Fujitsu Ltd サ−マルヘツド

Also Published As

Publication number Publication date
KR920005317B1 (ko) 1992-07-02
KR890014999A (ko) 1989-10-28
JPH021339A (ja) 1990-01-05

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