JPH0577290B2 - - Google Patents
Info
- Publication number
- JPH0577290B2 JPH0577290B2 JP61048462A JP4846286A JPH0577290B2 JP H0577290 B2 JPH0577290 B2 JP H0577290B2 JP 61048462 A JP61048462 A JP 61048462A JP 4846286 A JP4846286 A JP 4846286A JP H0577290 B2 JPH0577290 B2 JP H0577290B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- metal
- tungsten
- opening
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61048462A JPS62206852A (ja) | 1986-03-07 | 1986-03-07 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61048462A JPS62206852A (ja) | 1986-03-07 | 1986-03-07 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62206852A JPS62206852A (ja) | 1987-09-11 |
| JPH0577290B2 true JPH0577290B2 (de) | 1993-10-26 |
Family
ID=12804033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61048462A Granted JPS62206852A (ja) | 1986-03-07 | 1986-03-07 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62206852A (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3777538D1 (de) * | 1986-11-10 | 1992-04-23 | American Telephone & Telegraph | Wolfram metallisierung. |
| JP3017742B2 (ja) * | 1988-09-13 | 2000-03-13 | ソニー株式会社 | 半導体装置 |
| JP2543192B2 (ja) * | 1989-07-10 | 1996-10-16 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
| JPH03239365A (ja) * | 1990-02-17 | 1991-10-24 | Takehide Shirato | 半導体装置 |
| JP2720567B2 (ja) * | 1990-03-28 | 1998-03-04 | ソニー株式会社 | 半導体装置の製造方法 |
| JP3001931B2 (ja) * | 1990-06-06 | 2000-01-24 | 松下電子工業株式会社 | 半導体装置の電極配線およびその形成方法 |
| US5250467A (en) * | 1991-03-29 | 1993-10-05 | Applied Materials, Inc. | Method for forming low resistance and low defect density tungsten contacts to silicon semiconductor wafer |
| JP2830540B2 (ja) * | 1991-10-01 | 1998-12-02 | 日本電気株式会社 | 多層配線の製造方法 |
| JP5365577B2 (ja) * | 2010-05-10 | 2013-12-11 | 富士通セミコンダクター株式会社 | 半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61147549A (ja) * | 1984-12-21 | 1986-07-05 | Toshiba Corp | 半導体装置 |
| JPS61248442A (ja) * | 1985-04-26 | 1986-11-05 | Hitachi Ltd | 半導体素子用微細電極配線 |
-
1986
- 1986-03-07 JP JP61048462A patent/JPS62206852A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62206852A (ja) | 1987-09-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |