JPH058711Y2 - - Google Patents

Description

[Detailed description of the invention] (Industrial application field) The present invention efficiently dissipates heat and prevents the influence of heat radiation on other electronic components.
The present invention also relates to a mounting structure for heat-generating electronic components that can be easily mounted.

(Prior Art) FIG. 3 shows an example of a conventional mounting structure for heat-generating electronic components. In FIG. 3, a heat sink 2 of an electronic component 1 is connected to a heat sink 4 via an insulating sheet 3.
is fixed by bolts 5 and nuts 6.
In addition, 7 is an insulating sleeve, 8 is a board|substrate, and 9 is another electronic component provided in the board|substrate 8 adjacent to the electronic component 1.

FIG. 4 shows another example of a conventional mounting structure for heat-generating electronic components. In FIG. 4, the same or equivalent members as in FIG. 3 are given the same reference numerals, and redundant explanations will be omitted. In Figure 4, electronic component 1
A heat dissipation plate 2 is clamped and fixed to a heat sink 4 by a clamping spring 10.

(Problems to be solved by the invention) By the way, in the conventional mounting structure for heat-generating electronic components shown in FIG. 3, the heat sink 2 is fixed to the heat sink 4 by bolts 5 and nuts 6.
Can be fixed securely. However, it requires a large space in which a screwdriver can be used to turn the bolt 5, and it can only be applied where such space is available. Another problem is that heat radiation from the electronic component 1 tends to have a negative effect on other electronic components 9 provided nearby.

In addition, in the other conventional mounting structure for heat-generating electronic components shown in FIG. 4, the heat sink 2 is fixed to the heat sink 4 by the elasticity of the clamping spring 10 using a special jig or the like, so it is relatively easy to install. Easy to work with. However, a mechanism is required to prevent the clamping spring 10 from shifting due to its elasticity and falling off the heat sink 4. Further, similar to the conventional mounting structure shown in FIG. 3, there is a problem in that heat radiation from the electronic component 1 tends to have a negative effect on other electronic components 9 that are installed nearby.

The purpose of the present invention was to solve the above-mentioned problems with the conventional mounting structure for heat-generating electronic components. To provide a mounting structure for a heat-generating electronic component that prevents the electronic component from being adversely affected by heat radiation from the electronic component.

(Means for Solving the Problem) In order to achieve such an object, the heat-generating electronic component mounting structure of the present invention has a heat dissipating structure consisting of two members arranged facing each other with a predetermined distance apart on the board. and a fixing member having a protrusion on one side that engages with the member for fixing the heat-generating electronic component between the members, The fixing member is disposed between the two members in contact with the electronic component, and the fixing member is press-fitted between the electronic component and the other member to fix the electronic component.

(Function) Since the electronic component that generates heat is disposed between two members serving as heat radiators, the heat radiated from the electronic component is blocked by the two members. Furthermore, heat from the electronic components is dissipated through one member and the fixing member. Just by press-fitting the fixing member, the protrusion engages with the other member.

(Description of Embodiments) Hereinafter, embodiments of the mounting structure for heat-generating electronic components of the present invention will be described with reference to FIG. Figure 1 shows
FIG. 1 is an exploded perspective view showing an embodiment of the heat-generating electronic component mounting structure of the present invention.

In FIG. 1, a heat sink 1 is placed on a substrate 11.
2 is arranged, and this heat sink 12 is connected to first and second members 13, 1 facing each other with a predetermined distance apart.
4 is formed. An electronic component 16 including a heat sink 15 is arranged in contact with the first member 13. Further, a fixing member 17 is interposed between the electronic component 16 and the second member 14 so as to be press-fitted in the direction of the arrow in the figure. This fixing member 17 is formed into an L-shaped wedge by aluminum die casting. Furthermore, a heat sink 15 is attached to the fixing member 17.
A projection 19 is provided facing a fixing hole 18 provided in the second member 14, and a projection 21 is provided facing a hole 20 formed in the second member 14. By press-fitting the fixing member 17, the holes 18, 20 and the protrusions 19, 21 are engaged with each other, and the fixing member 17 is reliably prevented from coming out from between the electronic component 16 and the second member 14.

In such a structure, the mounting of the electronic component 16 is as follows:
The fixing member 17 is press-fitted between the electronic component 16 and the second member 14, and the electronic component 16 can be fixed to the first member 13 by pressure due to the wedge-shaped effect. The operation of press-fitting the fixing member 17 is simple and easy, and can be carried out easily even in a narrow space. Furthermore, since the electronic component 16 is placed between the two opposing first and second members 13 and 14, the heat radiation from the electronic component 16 is transferred to the first and second members 13 and 14. , 14, so that other electronic components etc. are not adversely affected. Furthermore, since the fixing member 17 is made of aluminum die-casting with good thermal conductivity, the fixing member 17 itself also has a heat dissipation function, so that the heat dissipation of the electronic component 16 can be made efficient.

FIG. 2 shows a perspective view of another embodiment of the fixing member used in the heat-generating electronic component mounting structure of the present invention. In FIG. 2, the fixing member 22 is formed of an elastic member made of a phosphor bronze plate having an S-shaped cross section instead of a wedge shape. Then, facing the hole 18 of the heat sink 15 and the hole 20 of the second member 14, the protrusion 23,
24 is formed. Fixing member 2 having such a configuration
2 can easily and reliably press and fix the electronic component 16 to the first member 13 due to its elasticity.

Note that the present invention is not limited to the above embodiment, and the fixing members 17 and 22 are connected to the electronic component 16 and the second
Any structure may be used as long as it can be interposed between the members 14 to press and fix the electronic component 16 to the first member 13. Further, in the above embodiment, the heat-generating electronic component equipped with a heat sink was explained as an example, but the present invention can be applied to a heat-generating electronic component that does not have a heat sink and radiates heat in the case of the electronic component itself. Of course, it is also a good thing.

(Effects of the invention) As explained above, according to the mounting structure of the heat-generating electronic component according to the present invention, the heat radiated from the electronic component is blocked by the two members, and the radiant heat is transmitted to other electronic components in the vicinity. is never added. Moreover, the heat of the electronic components is efficiently and sufficiently dissipated by both the first member and the fixing member. In addition, the assembly work can be done simply by press-fitting the fixing member, and since the protrusion of the press-fitted fixing member engages with the second member and does not fall off, the assembly work is simple and excellent.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view showing one embodiment of the heat-generating electronic component mounting structure of the present invention, and FIG. 2 is an exploded perspective view of another fixing member used in the heat-generating electronic component mounting structure of the present invention. FIG. 3 is a perspective view of the embodiment;
The figure is a diagram showing an example of a conventional mounting structure for a heat-generating electronic component, and FIG. 4 is a diagram showing another example of a conventional mounting structure for a heat-generating electronic component. 1, 16... Electronic component, 4, 12... Heat sink, 13... First member, 14... Second member, 17, 22... Fixing member.

Claims (1)

[Claims for Utility Model Registration] (1) A heat radiator consisting of two members arranged to face each other with a predetermined distance apart on a board, and a heat sink on one side for fixing a heat-generating electronic component between the members. A mounting device for a heat-generating electronic component, comprising a fixing member having a protrusion that engages with the member,
The electronic component is placed in contact with one of the members and the second
1. A heat-generating electronic component mounting apparatus, characterized in that the electronic component is fixed by being placed between two members, and further by press-fitting and interposing the fixing member between the electronic component and the other member. (2) The heat-generating electronic component mounting device according to claim 1, wherein the fixing member is an L-shaped wedge. (3) The heat-generating electronic component mounting device as set forth in claim 1, wherein the fixing member is made of an elastic member.