JPH0590732A - Electronic component mounting board - Google Patents

Abstract

(57) [Abstract] [Purpose] When the electronic components in the shape of a cylinder are temporarily fixed with an adhesive, the positional deviation of the components is more reliably prevented. In an electronic component mounting board 1 having a pair of lands 3A and 3B for soldering electrodes 4a and 4b at both ends thereof to mount a cylindrical electronic component (melf) 4, both lands 3A, A pair of support ridges 5 for sandwiching a center line connecting the centers of both lands 3A and 3B between 3B and having an inner shape parallel to the center line and supporting the melph 4
A and 5B are provided on the substrate body 2 by silk printing. Therefore, after the adhesive 6 is applied between the pair of support ridges 5A and 5B, both electrodes 4a and 4b of the melf 4 are mounted corresponding to the lands 3A and 3B in order to mount the melph 4. As a result, a part of the cylindrical body 4c of the melf 4 is fitted and supported between the support projections 5A and 5B and temporarily fixed by the adhesive 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting substrate in which electronic components are temporarily fixed with an adhesive and then mounted by soldering.

[0002]

2. Description of the Related Art Conventionally, as a technique of this type, for example, in Japanese Unexamined Patent Publication No. 1-245592, an appropriate amount of an adhesive is applied to a mounting position between lands of a printed circuit board, and a chip component is mounted on the adhesive. It is disclosed that (electronic component) is pressed and temporarily fixed by adhesion, and then the electronic component is mounted by soldering.

[0003]

However, in the above-mentioned prior art, when a cylindrical component is used as the electronic component, the contact area between the component and the printed circuit board is small and the component receives the adhesive from the adhesive. The power was also small. Therefore, some force may be applied to the component before the adhesive is cured, and the component may be displaced from the temporary fixing position.

For example, a cylindrical ceramic chip capacitor or a cylindrical chip resistor (generally called "melf")
After being temporarily fixed to the printed circuit board with an adhesive, the land and the melf on the circuit board are soldered with a solder jet. In this case, an impact force, which is larger than the adhesive force of the adhesive, is applied to the substrate by the jet of solder or the like, and thus the melph may be moved from the temporarily fixed position.

The present invention has been made in view of the above-mentioned circumstances, and an object thereof is to protect an electronic component against impact force, particularly when the electronic component having a cylindrical shape is temporarily fixed and mounted with an adhesive. An object of the present invention is to provide a board for mounting electronic components, which can prevent positional displacement more reliably.

[0006]

To achieve the above object, in the present invention, electronic component mounting is provided with a pair of lands for soldering electrodes located at both ends thereof to mount an electronic component. And a pair of support protrusions having an inner shape parallel to the center line and sandwiching a center line connecting the centers of the lands between the lands and supporting the electronic component. There is.

[0007]

According to the above construction, after the adhesive is applied between the pair of support protrusions, the electrodes at both ends thereof are placed so as to correspond to the pair of lands so as to mount the cylindrical electronic component. .. As a result, a part of the cylindrical body of the electronic component is fitted and supported between the support protrusions and is temporarily fixed by the adhesive.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the electronic component mounting board according to the present invention will now be described in detail with reference to FIGS.

FIG. 1 is a perspective view showing a part of an electronic component mounting substrate 1 in this embodiment, and FIG. 2 is a perspective view showing its mounting state. This substrate 1 is provided with a substrate body 2 made of an insulating material and a plurality of sets (only one set is shown in this embodiment) of a pair of lands 3A and 3B printed on the upper surface thereof. As shown in FIG. 2, these lands 3A and 3B are used as electronic parts, particularly as cylindrical ceramic chip capacitors and cylindrical chip resistors (hereinafter simply referred to as "melf").
Electrode 4 located at both ends to mount 4
It is for soldering a and 4b. Both lands 3
Around the center P of both lands 3A and 3B between A and 3B.
A pair of support projections 5A, 5B having a straight line inner shape parallel to the center line L sandwiching the center line L connecting the first and the second P2 are provided.

In this embodiment, both support protrusions 5A, 5
B is provided on the substrate body 2 by silk printing. Here, the length dimension of each of the support protrusions 5A and 5B is one fifth or more of the length of the melf 4, and the height dimension is 20 times the height of the melph 4.
It is desirable to make it one-third or more.

In this embodiment, when the melph 4 is mounted, the adhesive 6 is applied between the support projections 5A and 5B as shown in FIG. 1, and then the melph 4 is provided as shown in FIG.
The electrodes 4a and 4b on both ends of the respective lands 3A and 3B, respectively.
It is designed to be placed according to. As a result, a part of the cylindrical body 4c of the melf 4 is partially supported by the support protrusions 5A and 5B.
It is temporarily fixed with an adhesive 6 while being fitted and supported between the two. Then, in this embodiment, the melf 4 temporarily fixed to the substrate body 2 with the adhesive 6 is soldered by a solder jet.

Next, the mounting process of the mel 4 using the electronic component mounting substrate 1 having the above-described structure will be described in detail with reference to FIGS. In order to mount the melph 4 on the substrate 1, first, as shown in FIG. 3, at the mounting portion of the substrate 1, the nozzle 1 is provided between the support protrusions 5A and 5B.
The adhesive 6 taken out from 1 is applied.

Next, as shown in FIG. 4, the melf 4 is placed on the mounting portion and attached to the adhesive 6, and the electrodes 4a and 4b of the melph 4 are arranged corresponding to the lands 3A and 3B. .. At this point, the body 4c of the melf 4 is attached to the adhesive 6 while a part of the body 4c is fitted and supported between the support protrusions 5A and 5B.

Thereafter, as shown in FIG. 5, the adhesive 6 is cured by ultraviolet rays and infrared rays from the light source 12, and the melph 4 is fixed on the substrate body 2 and temporarily fixed. Then, as shown in FIG. 6, the substrate 1 is passed through the jet of solder 13 to solder the electrodes 4a and 4b of the melf 4 and the lands 3A and 3B of the substrate body 2, respectively.

Finally, as shown in FIG. 7, the substrate 1 after soldering is dipped in the cleaning tank 14 to clean the mel 4 and the series of mounting steps are completed. Through the mounting process as described above, the cylindrical melf 4 is soldered to the substrate 1.

Also in this embodiment, since the melph 4 has a cylindrical shape, the contact area between the body 4c and the substrate body 2 is small, and the body 4a receives a small adhesive force from the adhesive 6. However, according to the substrate 1 of this embodiment, after the adhesive 6 is applied between the pair of supporting protrusions 5A and 5B, a part of the body 4c of the cylindrical melph 4 is supported by the supporting protrusions 5A and 5B.
It is supported so as to be fitted between B and temporarily fixed with an adhesive 6.

Therefore, when the melf 4 is temporarily fixed by the adhesive 6 and then soldered by the jet of the solder 13, even if an impact force larger than the adhesive force of the adhesive 6 is applied to the substrate 1, Both support protrusions 5A and 5B lock the movement of the melph 4. As a result, it is possible to more reliably prevent the melph 4 from being displaced from the temporarily fixed position against the impact force.

In this embodiment, since it is possible to reliably prevent the melph 4 from being displaced from the desired temporary fixing position, the following secondary effects can be obtained. That is, it is possible to prevent problems caused by the interference between the melph 4 and other electronic components. Further, the soldering shape between the electrodes 4a and 4b of the melf 4 and the lands 3A and 3B can be stabilized, and the reliability of soldering can be improved. Furthermore, it is possible to prevent the electrodes 4a and 4b of the melf 4 from being soldered to each other to short-circuit the circuit.
That is, the reliability in mounting the mel 4 can be improved.

In addition, in this embodiment, both supporting protrusions 5
Since A and 5B have a function of displaying the position where the adhesive 6 is applied or the position where the melph 4 is mounted, it is not necessary to make a separate marking for position display.

The present invention is not limited to the above-described embodiment, but may be implemented as follows with a part of the configuration appropriately modified without departing from the spirit of the invention. (1) In the above-described embodiment, both the support protrusions 5A and 5B are simply parallel linear shapes, but as shown in FIG. 8, only a pair of ribs 7a protruding outward are parallel linear shapes. The supporting protrusions 7A and 7B may be used, or as shown in FIG. 9, a pair of supporting protrusions 8A and 8B may be formed so that only the inner side is parallel and linearly extended outward. The shape may be changed appropriately. In these cases, both support protrusions 7A, 7B and both support protrusions 8A, 8
The strength of B against deformation can be increased.

(2) In the above embodiment, both supporting protrusions 5A,
5B is provided on the substrate body 2 by silk printing,
Both supporting protrusions may be integrally formed on the surface of the substrate body with the same material.

[0022]

As described in detail above, according to the present invention, a center line connecting the centers of both lands is sandwiched between the two lands, and the inner shape is parallel to the center line. Since a pair of support protrusions for supporting the parts are provided, especially when mounting the cylindrical electronic parts by temporarily fixing them with an adhesive,
By fitting a part of the cylindrical body of the electronic component between both supporting protrusions and temporarily supporting it with an adhesive,
It is possible to more reliably prevent the displacement of the electronic component against the impact force, and thus it is possible to improve the reliability in mounting the electronic component.

[Brief description of drawings]

FIG. 1 is a perspective view showing a part of an electronic component mounting board according to an embodiment of the present invention.

FIG. 2 is a perspective view of a substrate showing a mounted state of a melf in one embodiment.

FIG. 3 is a plan view illustrating a step of applying an adhesive in a series of mounting steps in one embodiment.

FIG. 4 is a plan view illustrating a step of placing a melf among a series of mounting steps in one embodiment.

FIG. 5 is a diagram illustrating a step of curing the adhesive with ultraviolet rays and infrared rays from a light source in a series of mounting steps in one embodiment.

FIG. 6 is a diagram illustrating a step of soldering a melf by passing through jet solder in a series of mounting steps in one embodiment.

FIG. 7 is a diagram illustrating a cleaning process after soldering in a series of mounting processes in one embodiment.

FIG. 8 is a perspective view showing a part of an electronic component mounting board according to another embodiment of the present invention.

FIG. 9 is a perspective view showing a part of an electronic component mounting board according to another embodiment of the present invention.

[Explanation of symbols]

1 ... Substrate, 2 ... Substrate body, 3A, 3B ... Land, 6 ... Adhesive, 5A, 5B, 7A, 7B, 8A, 8B ... Support protrusion, P1, P2 ... Center, L ... Center line.

Claims (1)

[Claims] 1. An electronic component mounting board comprising a pair of lands for soldering electrodes located at both ends thereof for mounting an electronic component, wherein between the lands, substantially the center of both lands is provided. An electronic component mounting board comprising a pair of support protrusions having an inner shape that is parallel to the center line connecting the two and sandwiching the center line.