JPH0590944U - Lead frame transport mechanism in lead frame cleaning device - Google Patents

Abstract

(57) [Summary] [Object] An object of the present invention is to provide a lead frame carrying mechanism in a lead frame cleaning device capable of favorably discharging high-pressure jet water in the wet blasting method. [Structure] An unevenness is formed on the lead frame attachment surface of the lead frame conveying belt in the wet blasting method,
The concave and convex portions are set as water passages.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a lead frame carrying mechanism capable of favorably cleaning a lead frame.

[0002]

[Prior Art]

 Conventionally, a so-called wet blast method has been proposed in which an IC mold formed by fixing an IC chip packaged with a synthetic resin on a lead frame is cleaned (washed, deburring of the synthetic resin). In this conventional method, the IC mold is continuously conveyed, and high-pressure water mixed with abrasive grains is sprayed at a predetermined position of this conveyance path to clean the IC mold.

[0003]

[Problems to be solved by the device]

 In this conventional method, the IC mold is generally conveyed by sandwiching both side edges of the lead frame with a holding belt that moves above and below the lead frame. The holding surface of this holding belt is formed into a flat surface to obtain a holding force, and both sides of the lead frame are held by the flat surfaces.

By the way, in such a wet blasting method, it is an essential condition that the high-pressure water containing abrasive grains injected into the IC mold should be satisfactorily discharged. This is because if water remains on the IC mold due to poor drainage, the IC mold will be covered with the residual water, and the effects of cleaning and deburring by high-pressure water injection will be halved.

Further, as a lead frame transfer mechanism in a conventional wet blast method, there is a type in which one side edge of an IC mold is held by a holding belt and the lower surface of the IC mold is supported by a guide rod to transfer. However, this type inevitably complicates the structure by the amount of the guide rod, resulting in a costly device.

As a result of various researches by the applicant, the conventional IC mold conveying device has the flat surface of the lead frame holding surface as described above. Therefore, the high pressure water containing abrasive particles sprayed onto the IC mold is used. However, since both side edges of the lead frame are blocked by this clinging belt, they are not drained from the both side edges of the lead frame, but are eventually drained from the gaps between the leads. Was confirmed to have. Moreover, it has been described above that it has a drawback of becoming a costly device.

An object of the present invention is to provide a lead frame transport mechanism in a lead frame cleaning device that solves the above problems.

[0008]

[Means for Solving the Problems]

 The gist of the present invention will be described with reference to the accompanying drawings.

A rotation shaft is mounted vertically above and below the base end side and above and below the tip end side of a transfer path for transferring the lead frame 2 to which the IC package 1 is fixed, and the upper and lower rotation shafts 3 and 3 are provided at both ends of the upper and lower ends. Conveying belts 5, 5, 6, 6 are suspended around both ends of the rotating shafts 4, 4, and the lead frame 2 is held by sandwiching both side edges of the lead frame by the upper and lower conveying belts 5, 5, 6, 6. In a lead frame cleaning device for continuously cleaning the lead frame 2 by spraying high pressure water containing abrasive grains onto the lead frame 2 and the outer surface width of the upper and lower conveyor belts 5, 5, 6, 6. The present invention relates to a lead frame transporting mechanism in a lead frame cleaning device, which is characterized in that ridges 7 are juxtaposed at predetermined intervals.

[0010]

[Action]

 Since both side edges of the lead frame 2 are not clamped by the surface but are clamped by the protrusions 7 of the conveyor belts 5, 5, 6, 6 located above and below, deformation of the lead frame 2 due to high-pressure water is prevented. It is possible to prevent that much. Moreover, since the lead frame 2 is clamped on both side edges, the lead frame 2 can be reliably transported. Moreover, since the recesses 8 between the ridges 7 serve as water passages, good drainage is achieved. Be done.

[0011]

【Example】

 The drawings illustrate one embodiment of the present invention and are described below.

Gears 9 are fixed to both ends of rotary shafts 3, 3, 4, 4 which are vertically mounted near the base end side of the transport path of the lead frame 2 and vertically near the tip end side, and mesh with the gear 9. Four rubber holding belts 5, 5, 6 and 6 having unevenness formed on the inner surface are suspended around both ends of the gear 9.

The conveyor belts 5, 5, 6 and 6 are also provided with ridges 7 arranged in parallel in the outer surface width direction at regular intervals, and the center of the conveyor belts 5, 5, 6 and 6 is arranged. A longitudinal groove 10 is formed in the length direction to divide the ridge 7. Reference numeral 11 is a guide fitted in the vertical groove 10 and restricts the holding belts 5, 5, 6 and 6 from meandering.

Since the embodiment has the above-mentioned structure, both side edges of the lead frame 2 are held by the minimum necessary small area portions of the protrusions 7 of the conveyor belts 5, 5, 6, 6. Therefore, even if the high-pressure water containing abrasive grains is sprayed, it is possible to prevent the lead frame 2 from being deformed as much as compared with the above-mentioned conventional method in which the surface is held by a wide surface in the length direction.

For example, when the lead frame 2 is conventionally held by a wide surface in the length direction, and the lead frame 2 is slightly bent by high-pressure water and a holding surface has a gap, the gap is inevitably lengthened. Since the gap is long in the direction, the lead frame 2 is poorly held. However, according to the present embodiment, since each ridge 7 is freely bent at the boundary of the connecting portion 12 of each ridge 7, even if the lead frame 2 is curved by high-pressure water, it becomes a holding surface. Even if there is a gap, since the ridge 7 bends at the continuous portion 12 as a boundary, the gap does not become longer in the length direction, and it is suppressed to the necessary minimum. Therefore, the conveyance of the lead frame 2 becomes defective. Will certainly be prevented.

Since the recesses 8 between the ridges 7 serve as water passages, high-pressure water containing abrasive grains ejected at a high pressure is discharged through the water passages, so that water remains on the lead frame 2. Of the high-pressure water is not impaired.

In addition, since the present embodiment is a method of sandwiching both side edges of the lead frame 2, a guide rod or the like for supporting the lower surface of the lead frame 2 unlike the conventional example is unnecessary, and the cost is low. It becomes an excellent transport mechanism.

[0018]

[Effect of the device]

 Since the present invention is configured as described above, the lead frame can be transported smoothly, and the high-pressure jet water containing abrasive grains of the wet blast method can be discharged very well, so that the IC mold can be cleaned well. It is intended to provide a lead frame transport mechanism for a lead frame cleaning device that can be manufactured at low cost and has excellent mass productivity.

[Submission date] December 3, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction content]

The conveyor belts 5, 5, 6 and 6 are also provided with ridges 7 arranged in parallel in the outer surface width direction at regular intervals. A longitudinal groove 10 is formed in the length direction to divide the ridge 7. Reference numeral 11 is a guide fitted into the vertical groove 10 and restricts the holding belts 5, 5, 6 and 6 from meandering. In the drawing, a vertical groove 10 is also formed in the central length direction of the inner surfaces of the conveyor belts 5, 5, 6 and 6 in order to improve drainage.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part of this embodiment.

FIG. 2 is a vertical sectional view of a main part of this embodiment.

FIG. 3 is a cross-sectional view of the main part of this embodiment.

FIG. 4 is a perspective view of a lead frame to which an IC package is fixed.

[Explanation of symbols]

 1 IC Package 2 Lead Frame 3 Upper Rotating Shaft 4 Lower Rotating Shaft 5 Conveyor Belt 6 Conveyor Belt 7 Protrusion

Claims (1)

[Scope of utility model registration request] 1. A rotary shaft is mounted above and below a base end side and a top end side of a transport path for transporting a lead frame to which an IC package is fixed, and both ends of the upper rotary shaft and a lower rotary shaft. Conveying belts are suspended between both ends of the lead frame, and both sides of the lead frame are clamped by the upper and lower conveying belts to continuously convey the lead frame, and high pressure water containing abrasive grains is jetted to the lead frame. In a lead frame cleaning device for cleaning a frame, a lead frame carrying mechanism in a lead frame cleaning device, wherein projections are arranged in parallel in a width direction of outer surfaces of upper and lower carrying belts at predetermined intervals.