JPH0592937U - Temperature-sensitive reed switch device - Google Patents

Abstract

(57) [Summary] [Purpose] To prevent damage to the reed switch. The temperature-sensitive reed switch device 20 is a reed switch in which one end of a pair of lead wires 3 is overlapped and sealed with a glass tube 2 and the other end of each lead wire 3 is projected outside the glass tube 2. 4, a temperature-sensitive reed switch body 1 including a temperature-sensitive magnetic body 5 and a permanent magnet 6 is sealed with a resin member 30. The resin member 30 has windows on both sides for exposing a part of the temperature-sensitive magnetic body 5, and intersects the intermediate portion 3c between the root 3b of the lead wire 3 of the switch body 1 and the bent portion 3a. It has through holes 32, 32. When the temperature-sensitive reed switch device 20 is manufactured by a molding die, the position of the intermediate portion 3c of the lead wire 3 can be regulated from the through holes 32, 32, so that the lead wire 3 is not bent, and thus the glass tube of the switch 4 is not formed. It is possible to prevent the occurrence of cracks in 2.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a temperature-sensitive reed switch device that detects ambient temperature and performs switching operation.

[0002]

[Prior Art]

 BACKGROUND ART Conventionally, a temperature-sensitive reed switch device that detects the temperature of the atmosphere and performs a switching operation has been known.

FIG. 9 is a perspective view of the temperature-sensitive reed switch body 1. The temperature-sensitive reed switch body 1 includes a reed switch 4 in which one end of a pair of lead wires 3 is overlapped and sealed with a glass tube 2 and the other end of each lead wire 3 is projected outside the glass tube 2. It has a temperature-sensitive magnetic body 5 and a permanent magnet 6 arranged on the outer circumference of the glass tube 2.

Usually, the temperature-sensitive reed switch body 1 is used as a structure as shown in FIG. 10 by sealing the body 1 with a resin member 7 for reinforcement for the purpose of mechanical protection. The temperature-sensitive reed switch device 10 shown in the figure is one in which the lead wire 3 is bent in the same direction and exposed from the resin part 7. For example, the temperature-sensitive reed switch device 10 is applied to a through-connection type printed circuit board, etc. Reference numeral 3 is inserted into a through hole provided in a printed circuit board or the like to be connected.

However, the resin sealing technique of the resin member 7 in the conventional temperature-sensitive reed switch device 10 is performed by positioning the temperature-sensitive magnetic body 5 with respect to the molding die, and positioning the lead wire 3. This was not the case (for example, Japanese Utility Model Laid-Open No. 3-15445 and Japanese Patent Laid-Open No. 3-37929).

Therefore, as shown in FIG. 11, bending occurs at the lead wire bent portion 3a inside the resin member 7, and the exposed portion 3d of the lead wire 3 is inclined, or as shown in FIG. The root 3b was bent, and the exposed portions 3d of the lead wires 3 had different lengths L1 and L2.

[0007]

[Problems to be solved by the device]

 As described above, when the lead wire 3 is bent, the bending stress causes a crack in the glass tube 2 of the reed switch 4.

Therefore, the present invention solves the above-mentioned problems, and an object of the present invention is to provide a temperature-sensitive reed switch device which prevents damage to the reed switch.

[0009]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention has a structure in which one end of a pair of lead wires is overlapped with each other and sealed by a glass tube, and the other end of each lead wire is projected outside the glass tube. In a temperature-sensitive reed switch device having a temperature-sensitive reed switch in which a permanent magnet and a temperature-sensitive magnetic material are arranged, and a resin member that seals the entire lead wire excluding the other end, a glass tube is provided on the resin member. It is characterized by having a through hole that intersects with the portion of the lead wire that protrudes to the outside. Further, a window is provided in the resin member so that the temperature-sensitive magnetic body is partially exposed from the resin member.

[0010]

[Action]

 The operation of the present invention thus constructed will be described.

When the resin member is molded by the molding die, the lead wire is held through the through hole to prevent bending stress from being generated in the lead wire. This can prevent the glass tube of the reed switch from cracking due to the bending stress of the lead wire.

Further, by partially exposing the temperature-sensitive magnetic body from the resin member, heat is easily conducted to the exposed portion, and the thermal response is improved.

[0013]

Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of a temperature-sensitive reed switch device 20 according to an embodiment of the present invention, and FIGS. 2, 3, and 4 are cross-sectional views taken along the line AA and the line BB in FIG. 1, respectively. , C-C line sectional drawing. The temperature-sensitive reed switch device 20 has a temperature-sensitive lead switch main body 1 similar to that shown in FIG. 9 and a resin member 30 sealing the periphery of the main body 1.

The resin member 30 has windows 31 on both sides for exposing a part of the temperature-sensitive magnetic body 5 of the switch body 1, and has a rectangular shape as a whole. The lead wire 3 of is exposed in the same direction. The resin member 30 also has through holes 32, 32 that intersect the intermediate portion 3c between the root 3b of the lead wire 3 of the switch body 1 and the bent portion 3a. It should be noted that reference numeral 33 in FIGS. 1 and 2 is a seat for providing a gap between the connection partner (print substrate or the like).

FIG. 5 is a perspective view of a molding die 40 for manufacturing the temperature-sensitive reed switch device 20, and FIG. 6 is a central cross-sectional view showing a state in which the temperature-sensitive reed switch device 20 is arranged in the die 40. . The molding die 40 is composed of a pair of dies 40a and 40b. A lead wire exposed portion recess 41 for receiving and positioning the exposed portion 3d of the lead wire 3 is provided in each of the dies 40a and 40b, and a resin member. It has a concave portion 42 which forms a space corresponding to 33. In the recess 42, a magnetic material restricting portion 43 for contacting and positioning the temperature-sensitive magnetic material 5 is provided in a protruding manner. The contact surface 43a of the magnetic body restricting portion 43 is formed in an arc shape in accordance with the outer peripheral shape of the temperature-sensitive magnetic body 5 so that the temperature-sensitive magnetic body 5 can be reliably positioned. Further, lead wire restricting portions 44 for positioning the intermediate portion 3c between the bent portion 3a and the root 3b of the lead wire 3 are provided at both ends of the recess 42 so as to project. It should be noted that one mold 40a is provided with a pouring port 45 for pouring the resin member 30.

FIG. 7 is a cross-sectional view of the lead wire restricting portion 44 and its vicinity in the same state. As shown in FIG. 7, the contact surface 44a of the lead wire restricting portion 44 with the intermediate portion 3c of the lead wire 3 has a semicircular shape in accordance with the shape of the lead wire 3, and the intermediate portion 3c of the lead wire 3 is formed. It is possible to reliably position. Further, the lead wire restricting portion 44, together with the lead wire exposed portion recess 41, prevents the lead wire 3 from being bent when the resin member 30 is molded.

FIG. 8 is a sectional view of a main part of a lead wire restricting portion 54 according to another example of the present invention. As shown in the figure, the contact surface 54a of the lead wire restricting portion 54 has a shape in which the contact surface 54a of one molding die is a substantially U-shaped groove and the contact surface 54a of the other molding die 40b. The shape of the trapezoidal ′ is very good.

When the present temperature-sensitive reed switch device 20 is manufactured by the molding die 40, first, the temperature-sensitive reed switch body 1 in which the lead wire 3 is bent at the bending portion 3 a is arranged in the molding die 40. The position of the temperature-sensitive magnetic body 5, the exposed portion 3d of the lead wire 3, and the intermediate portion 3c of the lead wire 3 are regulated by the magnetic body regulation portion 43, the lead wire exposed portion recess 41, and the lead wire regulation portion 44, respectively. Next, the fluid resin member 30 is injected from the injection port 45. After the resin member 30 is solidified, the temperature-sensitive reed switch device 20 according to the present invention is obtained by removing the temperature-sensitive reed switch device 20 from the molding die 40.

According to the temperature-sensitive reed switch device 20 of this embodiment, since the lead wire 3 is not bent when the switch body 1 is sealed with the resin member 30, the glass tube of the switch 4 is not formed. It is possible to prevent the occurrence of cracks in 2.

Further, since the temperature-sensitive magnetic body 5 is partially exposed from the resin member 30, the thermal response is good, and since the resin member 30 has a uniform thickness, the temperature-sensitive magnetic sensor with good detection accuracy can be obtained. The switch device 20 can be provided.

The present invention is not limited to the above embodiment, and can be modified within the scope of the invention. For example, although the lead wire 3 of the reed switch 4 is bent in the same direction as described above, the present invention is also applicable to the lead wire 3 exposed in opposite directions from the resin member 30.

[0023]

[Effect of the device]

 According to the invention of claim 1 detailed above, when the resin member is molded by the molding die, the lead wire can be held from the through hole to prevent bending stress from occurring in the lead wire. It is possible to provide a temperature-sensitive reed switch device in which damage to the reed switch due to bending stress of a wire is prevented.

According to the second aspect of the invention, in addition to the effect of the first aspect, since the temperature-sensitive magnetic body is partially exposed from the resin member, the thermal responsiveness is good, and the resin member Since the wall thickness is made uniform, it is possible to provide a temperature-sensitive reed switch device with good detection accuracy.

[Brief description of drawings]

FIG. 1 is a perspective view of a temperature-sensitive reed switch device according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA in FIG.

FIG. 3 is a sectional view taken along line BB in FIG.

4 is a cross-sectional view taken along the line CC in FIG.

5 is a perspective view of a molding die for explaining one manufacturing method of the temperature-sensitive reed switch device shown in FIG. 1. FIG.

6 is a central cross-sectional view showing a state in which the temperature-sensitive reed switch body shown in FIG. 1 is arranged in the molding die shown in FIG.

7 is a cross-sectional view of the vicinity of the lead wire restricting portion in a state where the temperature-sensitive reed switch body shown in FIG. 1 is arranged in the molding die shown in FIG.

FIG. 8 is a cross-sectional view of a main portion showing another example of the lead wire restricting portion shown in FIG.

FIG. 9 is a perspective view of a temperature-sensitive reed switch body.

FIG. 10 is a perspective view of a conventional temperature-sensitive reed switch device.

FIG. 11 is a cross-sectional view for explaining a problem of the conventional temperature-sensitive reed switch device.

FIG. 12 is a cross-sectional view for explaining a problem of the conventional temperature-sensitive reed switch device.

[Explanation of symbols]

 3 lead wire 4 reed switch 5 temperature-sensitive magnetic body 6 permanent magnet 20 temperature-sensitive reed switch device 30 resin member 32 through hole

Claims (2)

[Scope of utility model registration request] 1. A pair of lead wires are overlapped at one end and sealed with a glass tube, and the other end of each lead wire is projected outside the glass tube, and a permanent magnet and a temperature-sensitive magnetic material are provided on the outer circumference of the glass tube. In a temperature-sensitive reed switch device having a temperature-sensitive reed switch in which is arranged, and a resin member that seals the entire lead wire except the other end thereof, the resin member is provided with a lead wire protruding outside the glass tube. A temperature-sensitive reed switch device comprising a through hole intersecting with a portion. 2. The temperature-sensitive reed switch device according to claim 1, wherein the resin member has a window that partially exposes the temperature-sensitive magnetic body.