JPH0595026A - Method of applying voltage to continuous film mounting type semiconductor device - Google Patents

Abstract

(57) [Abstract] [Purpose] Low cost when performing burn-in of continuous film mounting type semiconductor device in which the same metal wiring pattern is repeatedly provided on the insulating film tape and the same semiconductor chip is mounted for each same pattern. Moreover, the present invention provides a voltage application method capable of reducing the number of steps. [Structure] In a continuous film mounting type semiconductor device manufactured by TAB, connection terminals 4, 4'for voltage application are provided for each semiconductor device. By mounting the external connection jig 5 between the voltage application connection terminals 4 and 4 ′, the metal wiring patterns of the adjacent semiconductor chips 1 and 1 ′ are connected. This is performed between all the terminals on the continuous film, and the voltage is applied to all the semiconductor chips on the film by connecting the voltage applying power supply a to the terminal 7 for applying the voltage. By this method, it can be placed in a constant temperature bath in a continuous film state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
When performing the burn-in of the semiconductor chips mounted on the film by the (Tape Automated Bonding) method, by applying a voltage to one place in the continuous film state, all the semiconductor chips mounted on the same film are The present invention relates to a structure of a metal wiring pattern for performing burn-in and a voltage applying method.

[0002]

2. Description of the Related Art When a semiconductor chip mounted on a film is burned in by a conventional TAB method, the film is cut for each semiconductor device mounted with a single chip and set in a socket of a burn-in board. Then, burn-in was performed by applying a voltage to the substrate.
In some cases, a semiconductor device mounted with a single chip, which has been cut off at one end, is re-joined after burn-in and shipped in a continuous film state.

[0003]

That is, in the above-mentioned conventional technique, a burn-in socket and a circuit board for performing burn-in must be manufactured, and a semiconductor in which a single chip is mounted for performing burn-in is required. There is a problem in that the work of cutting the film for each device and the work of rejoining the device thereafter occur, and the period, the process, and the cost are increased when the burn-in of the semiconductor chip mounted on the film by the TAB method is performed. have.

Therefore, the present invention solves such a problem, and its purpose is to reduce the cost and to reduce the number of steps, and a method for applying a voltage to a continuous film mounting type semiconductor device. Is in the place of providing.

[0005]

According to the method of applying a voltage to a continuous film mounting type semiconductor device of the present invention, a connection terminal for voltage application is installed on the film by a metal wiring pattern for each semiconductor device, and an external connection fixing device is provided. By connecting the tool between the adjacent semiconductor device terminals, the connection between the terminals is measured, and the voltage is applied to all the semiconductor chips mounted in the continuous film state only by finally applying the voltage to one place. It makes it possible.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 and FIG. 2 are schematic views of the essential parts for explaining an embodiment of the present invention. FIG. 1 is a diagram in which a connection terminal for voltage application is provided for each semiconductor device in a continuous film mounting type semiconductor device manufactured by a conventional TAB method, and FIG. 2 is a connection terminal for voltage application of FIG. It is a figure showing the state which attached the external connection jig between them. Reference numeral 1 is a terminal semiconductor chip mounted on a continuous film, 1'is a semiconductor chip adjacent to 1, 2 is an insulating film tape, 3
Is a metal wiring pattern having connection terminals for voltage application, 4 and 4'are adjacent connection terminals for voltage application, 5 is an external connection jig for connecting the connection terminals for voltage application, 6 is a reel for winding a film, Reference numeral 7 is a terminal for voltage application.
Here, the external connection jig 5 is connected to the voltage application connection terminal 4,
By attaching between 4 ', adjacent semiconductor chips 1
And 1'of the metal wiring pattern are connected. This is performed between all terminals on the continuous film, and the voltage application power source a is connected to the terminal 7 for voltage application at the end so that the voltage is applied to all the semiconductor chips on the film. .. Further, FIG. 3 is a simplified version of the electrical wiring diagram. Among them, 5'is a symbol representing an external connection jig for connecting between the voltage application connection terminals.

By this method, the continuous film mounting type semiconductor device can be put in a thermostatic chamber in a rolled state, and all the semiconductors on the film can be put into the constant temperature bath by simply applying a voltage to the voltage applying connection terminal 7. Since voltage can be applied to the chip, burn-in can be easily performed at low cost.

[0008]

As described above, according to the present invention, the burn-in of the continuous film mounting type semiconductor device can be performed without cutting the film and without manufacturing the burn-in socket and the burn-in substrate. You can do it. Thus, the practical effect of the present invention is extremely large.

[Brief description of drawings]

FIG. 1 is a diagram showing an example in which a continuous film mounting type semiconductor device is provided with a connection terminal for voltage application.

FIG. 2 is a diagram showing an embodiment in which an external connection jig for connecting between the voltage application connection terminals is attached in the view of FIG.

3 is a simplified diagram of electrical wiring according to the embodiment of FIG.

[Explanation of symbols]

1 ----- Mounted semiconductor chip (terminal semiconductor chip) 1 '--- Mounted semiconductor chip (semiconductor chip adjacent to terminal IC) 2 --- Insulating film provided with the same metal wiring pattern 3 --- Metal wiring pattern having voltage application terminal 4 --- Connection terminal (terminal semiconductor chip) 4 '--- Connection terminal (semiconductor chip adjacent to terminal semiconductor chip) 5 --- Connection jig 5 '−−− Symbol of connection jig 6 −−− Film reel 7 −−− Terminal of IC on the terminal side to which voltage is applied a −−− Power supply symbol for voltage application

Claims (2)

[Claims] 1. In a continuous film mounting type semiconductor device in which the same metal wiring pattern is repeatedly provided on an insulating film tape, and the same semiconductor chip is mounted for each same pattern, while the same metal wiring pattern is repeatedly provided, A method for applying a voltage to a continuous film-mounted semiconductor device, which has a connection terminal for applying a voltage. 2. The voltage applying connection terminal according to claim 1 is connected between adjacent semiconductor chips by using an external connecting jig, and a voltage is applied to one place to mount a plurality of mounted semiconductor chips. A method for applying a voltage to a continuous film-mounted semiconductor device, which is characterized in that a voltage can be applied simultaneously to a semiconductor chip.