JPH06114865A - Production of laminated sheet - Google Patents
Production of laminated sheetInfo
- Publication number
- JPH06114865A JPH06114865A JP4268527A JP26852792A JPH06114865A JP H06114865 A JPH06114865 A JP H06114865A JP 4268527 A JP4268527 A JP 4268527A JP 26852792 A JP26852792 A JP 26852792A JP H06114865 A JPH06114865 A JP H06114865A
- Authority
- JP
- Japan
- Prior art keywords
- temp
- glass transition
- cooling
- laminated
- laminated sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は歪が少なく、寸法、反り
に優れた積層板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a laminated plate which has little distortion and is excellent in dimensions and warpage.
【0002】[0002]
【従来の技術】従来、歪の少ない積層板の製造方法とし
て低圧で成形する方法や成形後無圧での再加熱により歪
をとる方法があったが、前者では成形時フローの小さい
樹脂処方のものは成形不良をおこし、後者では工程が多
くなる欠点があった。2. Description of the Related Art Conventionally, as a method for producing a laminated plate with less distortion, there has been a method of molding at low pressure or a method of taking strain by reheating without pressure after molding. However, the latter has a defect that the number of processes increases in the latter case.
【0003】[0003]
【発明が解決しようとする課題】本発明は、ガラス転移
温度付近で毎分7℃以下の冷却速度で冷却することによ
り工数を増すことなく、歪の少ない積層板を提供するこ
とにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a laminated plate having less strain without increasing the number of steps by cooling at a cooling rate of 7 ° C. or less per minute near the glass transition temperature.
【0004】[0004]
【課題を解決するための課題】本発明は、樹脂ワニスを
基材に含浸させ、これを一枚もしくは複数枚重ね合わせ
1セットとし、熱盤間に3セット以上を同時に加熱加圧
する積層板の製造方法において、加熱後冷却する際、積
層板のガラス転移温度±10℃の温度範囲において、す
べての積層板を毎分7℃以下の冷却速度で冷却すること
を特徴とする積層板の製造方法である。前記のように、
従来の方法では、成形不良をおこしたり、工程が多くな
る欠点があった。また、歪の少ない積層板を得る方法と
して、加熱終了からゆっくり熱盤を冷却していけばよい
が冷却時間が長くなるという欠点がある。DISCLOSURE OF THE INVENTION The present invention relates to a laminated plate in which a base material is impregnated with a resin varnish, and one or a plurality of the resin varnishes are superposed to form one set, and three or more sets are simultaneously heated and pressed between hot plates. In the manufacturing method, when cooling after heating, all the laminated plates are cooled at a cooling rate of 7 ° C. or less per minute in the temperature range of the glass transition temperature ± 10 ° C. of the laminated plates. Is. As mentioned above,
The conventional methods have drawbacks such as defective molding and a large number of steps. Further, as a method of obtaining a laminated plate with less distortion, it is sufficient to cool the heating plate slowly after the end of heating, but there is a drawback that the cooling time becomes long.
【0005】本発明は、このような欠点を解決するもの
であり、積層板をガラス転移温度±10℃の温度範囲に
おいて、毎分7℃以下の冷却速度で冷却することによ
り、冷却時間を余り長くしないで、得られた積層板の歪
を少なくし反りのレベルを小さくすることができる。本
発明の方法を実施する際に、同じ樹脂処方、同じ基材、
同じ条件で塗布し、成形された積層板のガラス転移温度
(Tg)を予め測定しておく。熱盤間に挿入したプリプ
レグのすべて、即ち外押し(熱盤に最も近い挿入位置)
のものから中押し(熱盤から遠い挿入位置)のものま
で、及び熱盤について熱電対等で温度測定を行う。The present invention solves such drawbacks by cooling the laminate at a glass transition temperature of ± 10 ° C. at a cooling rate of 7 ° C. or less per minute, thereby reducing the cooling time. Without increasing the length, it is possible to reduce the strain of the obtained laminate and reduce the level of warpage. In carrying out the method of the present invention, the same resin formulation, the same substrate,
The glass transition temperature (Tg) of the laminated plate formed by applying under the same conditions is measured in advance. All of the prepregs inserted between the hot plates, that is, external push (insertion position closest to the hot plate)
Measure the temperature of the hot plate to the middle press (insertion position far from the hot plate) and the hot plate with a thermocouple.
【0006】このような構成で成形を行い、加熱加圧後
冷却過程において外押しの積層板がガラス転移温度より
10℃ないしそれよりやや高い温度にまで冷却された時
点で、冷却速度を小さくするために、熱盤内を循環する
熱媒体の温度や流量を調整し熱盤温度をコントロールす
る。この操作により成形中のすべての積層板がガラス転
移温度±10℃の温度範囲で毎分7℃以下、好ましくは
毎分2℃以下の冷却速度で冷却されるようにする。この
テスト操作を何回か繰り返して、成形中の全ての積層板
がガラス転移温度±10℃の温度範囲で毎分7℃以下、
好ましくは毎分2℃以下の冷却速度で冷却されるような
条件を決定する。以下、この条件に基づいて実際の積層
板成形を行う。[0006] Molding is performed with such a constitution, and the cooling rate is reduced when the externally pressed laminate is cooled to a temperature of 10 ° C or slightly higher than the glass transition temperature in the cooling process after heating and pressurizing. To this end, the temperature and flow rate of the heat medium circulating in the heating platen are adjusted to control the heating platen temperature. By this operation, all the laminated plates being molded are cooled at a cooling rate of 7 ° C. or less per minute, preferably 2 ° C. or less per minute in a temperature range of glass transition temperature ± 10 ° C. By repeating this test operation several times, all the laminated plates under molding have a glass transition temperature of ± 10 ° C. in a temperature range of 7 ° C. or less per minute,
Preferably, conditions are determined so that the cooling rate is 2 ° C. or less per minute. Hereinafter, actual laminated board molding is performed based on these conditions.
【0007】[0007]
【実施例】以下に、本発明の実施例及び比較例(従来
例)を示す。エポキシ樹脂ワニスの組成は次の通りであ
る。EXAMPLES Examples of the present invention and comparative examples (conventional examples) are shown below. The composition of the epoxy resin varnish is as follows.
【表1】 上記材料を混合して均一なワニスを作成した。[Table 1] The above materials were mixed to form a uniform varnish.
【0008】《比較例》上記ワニスを厚さ0.18mm の
ガラス織布(質量 205g/m2)に樹脂含有量が42〜
45重量%になるように含浸乾燥しガラス織布プリプレ
グを得た。このプリプレグを8枚重ね、更にその上下に
18μmの銅箔を重ねたものを一セットとして一対の熱
盤間に10セット挿入し、加圧加熱成形した。最高温度
180℃での加熱を終了後、毎分15℃の冷却速度で冷
却し、厚さ1.6mm の銅張積層板を得た。この積層板の
ガラス転移温度を熱機械分析(TMA)で測定し、13
5℃という値を得た。Comparative Example The above varnish was applied to a glass woven cloth having a thickness of 0.18 mm (mass 205 g / m 2 ) with a resin content of 42 to
The glass woven fabric prepreg was impregnated and dried to 45% by weight. Eight sheets of this prepreg were piled up, and a copper foil of 18 μm was piled up and down as one set, and 10 sets were inserted between a pair of hot plates, and pressure heating was carried out. After the heating at the maximum temperature of 180 ° C. was completed, it was cooled at a cooling rate of 15 ° C./min to obtain a copper-clad laminate having a thickness of 1.6 mm. The glass transition temperature of this laminate was measured by thermomechanical analysis (TMA),
A value of 5 ° C. was obtained.
【0009】《実施例1》比較例と同様にしてプリプレ
グを熱盤間に挿入し加圧加熱成形を行い、加熱終了後冷
却を開始し外押しが150℃になったところで冷却速度
が小さくなるように熱盤温度をコントロールして、外押
しの冷却速度が毎分2℃になっていることを確かめ、中
押しも毎分2℃になっていることも確かめた。外押し、
中押しとも120℃以下となった時点で毎分15℃の冷
却速度に入り、厚さ1.6mm の銅張積層板を得た。Example 1 Similar to the comparative example, a prepreg is inserted between hot plates and pressure heat molding is performed, cooling is started after heating is completed, and the cooling rate is reduced when the external push reaches 150 ° C. By controlling the hot platen temperature in this way, it was confirmed that the cooling rate of the external push was 2 ° C./min, and that of the intermediate push was 2 ° C./min. Pushing outward,
When the temperature reached 120 ° C. or less in both cases of the medium pressing, the cooling rate of 15 ° C./min was entered to obtain a copper-clad laminate having a thickness of 1.6 mm.
【0010】《実施例2》比較例と同様にしてプリプレ
グを熱盤間に挿入し加圧加熱成形を行い、加熱終了後冷
却を開始し外押しが160℃になったところで実施例1
と同様に熱盤温度をコントロールして、外押し、中押し
の冷却速度が毎分2℃になっていることを確かめ、外押
し、中押しとも110℃以下となった時点で毎分15℃
の冷却速度に入り、厚さ1.6mm の銅張積層板を得た。Example 2 In the same manner as in the comparative example, the prepreg was inserted between the heating plates to perform pressure heating molding, cooling was started after the heating was completed, and the external pressing reached 160 ° C. Example 1
Control the hot platen temperature in the same manner as above to confirm that the cooling rate for external push and middle push is 2 ° C / min.
At a cooling rate of 1.6 mm to obtain a copper clad laminate having a thickness of 1.6 mm.
【0011】以上の実施例及び比較例から得られた銅張
積層板について、加工工程における寸法変化率及び反り
を測定した。その結果を表2に示す。With respect to the copper clad laminates obtained from the above Examples and Comparative Examples, the dimensional change rate and warpage in the working process were measured. The results are shown in Table 2.
【表2】 [Table 2]
【0012】(測定方法) 寸法変化率:JIS C 6481に準じて測定 反 り :JIS C 6481に準じて測定 表2からも明らかなように、ガラス転移温度±10℃の
温度範囲において、毎分7℃以下の冷却速度で冷却して
得られた銅張積層板は、歪が少なく、反り及び寸法に優
れていることがわかる。(Measuring method) Dimensional change rate: Measured according to JIS C 6481 Warp: Measured according to JIS C 6481 As is apparent from Table 2, in the temperature range of glass transition temperature ± 10 ° C., every minute It can be seen that the copper-clad laminate obtained by cooling at a cooling rate of 7 ° C. or less has little distortion and is excellent in warpage and dimensions.
【0013】[0013]
【発明の効果】本発明では、ガラス転移温度±10℃の
温度範囲で毎分7℃以下の冷却速度で冷却することによ
り、工数を増すことなく、従来の積層板に比べ歪が少な
く、反り及び寸法収縮率が低減した積層板を提供するこ
とができる。According to the present invention, by cooling at a cooling rate of 7 ° C. or less per minute in a temperature range of glass transition temperature ± 10 ° C., distortion is less and warpage is less than that of a conventional laminated plate without increasing man-hours. Also, it is possible to provide a laminated plate having a reduced dimensional shrinkage rate.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 B32B 31/20 7639−4F // B29K 105:06 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location B32B 31/20 7639-4F // B29K 105: 06
Claims (1)
枚もしくは複数枚重ね合わせ1セットとし、熱盤間に3
セット以上を同時に加熱加圧する積層板の製造方法にお
いて、加熱後冷却する際、積層板のガラス転移温度±1
0℃の温度範囲において、すべての積層板を毎分7℃以
下の冷却速度で冷却することを特徴とする積層板の製造
方法。1. A base material is impregnated with a resin varnish, and one or a plurality of the resin varnishes are superposed to form one set, and three sets are provided between the heating plates.
In the method for producing a laminated sheet in which the set or more are heated and pressed at the same time, the glass transition temperature of the laminated sheet is ± 1 when cooled after heating.
A method for producing a laminated plate, which comprises cooling all the laminated plates at a cooling rate of 7 ° C. or less per minute in a temperature range of 0 ° C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4268527A JPH06114865A (en) | 1992-10-07 | 1992-10-07 | Production of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4268527A JPH06114865A (en) | 1992-10-07 | 1992-10-07 | Production of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06114865A true JPH06114865A (en) | 1994-04-26 |
Family
ID=17459761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4268527A Pending JPH06114865A (en) | 1992-10-07 | 1992-10-07 | Production of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06114865A (en) |
-
1992
- 1992-10-07 JP JP4268527A patent/JPH06114865A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH06114865A (en) | Production of laminated sheet | |
| JPS6365509B2 (en) | ||
| JPH05301240A (en) | Production of fiber fabric composite resin film | |
| JPH0343061B2 (en) | ||
| JP2954335B2 (en) | Manufacturing method of laminated board | |
| JPH04168038A (en) | Manufacture of laminated sheet | |
| JPH07156171A (en) | Production of laminated sheet for printed circuit board | |
| JP2591378B2 (en) | Manufacturing method of composite laminate | |
| JP2002264157A (en) | Manufacturing method of laminated board | |
| JPH04323034A (en) | Manufacture of laminated board | |
| JPH10166381A (en) | Manufacturing method of laminated board | |
| JPH0453714A (en) | Manufacture of laminated sheet | |
| JP4770674B2 (en) | Method for producing metal-clad laminate | |
| JPS61143123A (en) | Manufacture of laminated sheet | |
| JPH09262909A (en) | Production of laminated sheet | |
| JPS6088491A (en) | Dimensional stability of metal foil clad laminates | |
| JP2002067061A (en) | Method for manufacturing metal-clad laminate | |
| JPH0773905B2 (en) | Method for producing melamine resin metal decorative plate | |
| JPH021672B2 (en) | ||
| JPH0834349B2 (en) | Multilayer board manufacturing method | |
| JPH0671773A (en) | Method for manufacturing metal-clad laminate | |
| JPS637930B2 (en) | ||
| JPH0462051A (en) | Manufacture of laminated sheet | |
| JP2003342398A (en) | Manufacturing method of laminated board | |
| JPS63295217A (en) | Preparation of laminated plate |