JPH06155461A - Manufacture of laminate - Google Patents

Manufacture of laminate

Info

Publication number
JPH06155461A
JPH06155461A JP4312135A JP31213592A JPH06155461A JP H06155461 A JPH06155461 A JP H06155461A JP 4312135 A JP4312135 A JP 4312135A JP 31213592 A JP31213592 A JP 31213592A JP H06155461 A JPH06155461 A JP H06155461A
Authority
JP
Japan
Prior art keywords
laminate
thermosetting resin
paper
water
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4312135A
Other languages
Japanese (ja)
Inventor
Hitoshi Kawaguchi
均 川口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP4312135A priority Critical patent/JPH06155461A/en
Publication of JPH06155461A publication Critical patent/JPH06155461A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To obtain a laminate wherein migration phenomenon of silver in a printing circuit board hardly occurs by setting quantities of Na<+> and Cl<->, which is extracted when the laminate made of a paper base material impregnated with thermosetting resin is treated with high pressure and hot water under a predetermined condition, to below a specific value. CONSTITUTION:Quantities of Na and CF to be extracted when a paper base material thermosetting resin laminate is treated in a hot water of 120 deg.C under pressure for 48 hours are made to be 0.1wt.% or less of the laminate. For this purpose, restraint of elution of ionic impurity in the laminate will do. There are three means for that: to use resin containing only a little ionic impurity which is cleaned by water, to use paper containing only a little ionic impurity whose bleaching process is changed, and to coat fiber surface of the paper with water soluble thermosetting resin before it is impregnated with the thermosetting resin.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は銀の移行現象の発生しに
くい(以下、耐銀移行性に優れたと称する)印刷回路板
用紙基材熱硬化性樹脂積層板(以下、積層板と称する)
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is a printed circuit board paper base material thermosetting resin laminated plate (hereinafter referred to as laminated plate) in which silver migration phenomenon is unlikely to occur (hereinafter referred to as excellent in silver migration resistance).
Regarding

【0002】[0002]

【従来の技術】従来、このような積層板は熱硬化性樹脂
配合物ワニスをクラフト紙またはリンター紙等に含浸さ
せ、該含浸紙を複数枚積層し用途に応じてこの片面又は
両面に接着剤付き銅箔を重ねた後、加熱加圧成形して製
造されている。このようにして得られた積層板は、温湿
度条件下において、積層板に形成された2つの銀電極
(銀ジャンパ、銀スルーホール等)間に電圧を加えると
時間経過に伴い銀の移行現象が発生することはよく知ら
れている。近年の電気製品の軽薄短小化の傾向は印刷回
路配線板の高密度化を要求し、銀スルーホール間ピッチ
も、2.5mm〜2.0mmへ狭小化し、現在では1.5mm ピ
ッチのものさえ実用化されようとしている。このため、
銀の移行現象による短絡が起こりやすくなり、印刷回路
板の信頼性を確保するため、より耐銀移行性の優れた積
層板の要求が高まっている。積層板における銀移行現象
は、以下の反応により銀がイオン化することが主要因で
あると考えられている。
2. Description of the Related Art Conventionally, such a laminated board is obtained by impregnating kraft paper or linter paper with a varnish containing a thermosetting resin, laminating a plurality of the impregnated papers, and applying an adhesive on one or both sides depending on the application. It is manufactured by stacking coated copper foils and then heat-pressing. The laminated plate thus obtained exhibits a migration phenomenon of silver over time when a voltage is applied between two silver electrodes (silver jumper, silver through hole, etc.) formed on the laminated plate under temperature and humidity conditions. It is well known that In recent years, the trend toward lighter, thinner, shorter, and smaller electrical products requires higher density of printed circuit wiring boards, and the pitch between silver through-holes has been narrowed to 2.5 mm to 2.0 mm. It is about to be put to practical use. For this reason,
Short circuits due to the migration phenomenon of silver are likely to occur, and in order to secure the reliability of the printed circuit board, there is an increasing demand for a laminated board having more excellent silver migration resistance. It is considered that the silver migration phenomenon in the laminated plate is mainly due to the ionization of silver by the following reaction.

【0003】[0003]

【化1】 [Chemical 1]

【0004】この反応式に示されるように、銀のイオン
化が主要因であるため、銀移行現象の発生には積層板中
への水分の侵入が不可欠である。更に、侵入した水分中
にイオン性不純物が溶出することにより、積層板の電気
特性を劣化させ、特に銀のイオン化が促進され耐銀移行
性が著しく低下する。従って、積層板中への水分の侵入
を抑えるために、紙基材への樹脂の含浸性を高めたり、
樹脂を疎水性にするなどの方法がとられてきたが、紙基
材に樹脂を含浸させるという積層板の本質的特徴のため
大幅な改良には限界があった。
As shown in this reaction formula, since the ionization of silver is the main factor, the penetration of water into the laminate is indispensable for the occurrence of the silver migration phenomenon. Further, the elution of ionic impurities into the invaded water deteriorates the electrical characteristics of the laminate, and particularly the ionization of silver is promoted, resulting in a marked decrease in silver migration resistance. Therefore, in order to suppress the invasion of water into the laminated board, it is possible to improve the impregnation property of the resin into the paper base material,
Although the method of making the resin hydrophobic has been taken, there has been a limit to the significant improvement due to the essential feature of the laminate in which the paper base material is impregnated with the resin.

【0005】[0005]

【発明の解決しようとする課題】本発明は、高温高圧条
件下で積層板中より抽出されるイオン性不純物量を低減
することにより、耐銀移行性に優れた積層板を得ること
ができるとの知見を得、これに基づいて種々検討した結
果完成されたものである。
According to the present invention, it is possible to obtain a laminate excellent in silver migration resistance by reducing the amount of ionic impurities extracted from the laminate under high temperature and high pressure conditions. It was completed as a result of various findings based on this knowledge.

【0006】[0006]

【問題を解決するための手段】本発明は、加圧下で12
0℃の熱水中で48時間処理したときに、抽出されるN
+ 及びCl- の量が積層板の 0.1重量%以下である
ことを特徴とする積層板に関する。本発明者は、積層板
にイオン性不純物が含まれていても、水分中に溶出しな
ければ電気特性、特に銀移行現象に影響を与えないとい
う知見を得た。また銀移行現象の原因となる積層板中へ
の水分の侵入は、紙基材に樹脂を含浸させるという積層
板の本質的特徴からみて、完全には抑制できないと考
え、種々検討した結果、侵入した水分へ積層板中のイオ
ン性不純物が溶出するのを抑えることにより耐銀移行性
を向上させることに成功したものである。侵入した水分
中へのイオン性不純物の溶出を抑える手段としては、 水洗処理などを施したイオン性不純物含量の少ない
樹脂を用いる、 紙の漂白工程の変更によるイオン性不純物含量の少
ない紙を用いる、 熱硬化性樹脂を含浸させる前に、紙の繊維表面を水
溶性熱硬化性樹脂でコーティングすることにより紙に含
まれるイオン性不純物の溶出を抑える、 という3つの手段がある。
SUMMARY OF THE INVENTION The present invention provides 12
N extracted when treated in hot water at 0 ° C for 48 hours
It relates to a laminate characterized in that the amount of a + and Cl is not more than 0.1% by weight of the laminate. The present inventor has found that even if the laminated plate contains an ionic impurity, it does not affect the electrical characteristics, particularly the silver migration phenomenon, unless it is eluted into water. In addition, it is thought that the invasion of water into the laminate, which causes the phenomenon of silver migration, cannot be completely suppressed in view of the essential feature of the laminate in which the paper base material is impregnated with resin. By suppressing the elution of ionic impurities in the laminated plate into the water content, the silver migration resistance was successfully improved. As a means to suppress the elution of ionic impurities into the invading water, use a resin with a low ionic impurity content that has been washed with water, use a paper with a low ionic impurity content by changing the bleaching process of the paper, There are three means of suppressing the elution of ionic impurities contained in the paper by coating the fiber surface of the paper with the water-soluble thermosetting resin before impregnating the thermosetting resin.

【0007】また、積層板中へ侵入した水分へのイオン
性不純物の溶出量は、下記のように高温高圧条件下で抽
出されるイオン性不純物量により測定することができ
る。 (測定方法)板厚1.6mm の積層板を25mm×25mmの
正方形に裁断しよく洗浄する。この積層板4枚を純水4
0mlと共に耐圧容器中に入れ、120℃で48時間熱
水中で抽出し、抽出液中のイオン濃度をイオンクロマト
グラフィーにて測定する。このイオン濃度の値を積層板
の重量に対する割合に換算する。本発明においては、抽
出されるイオンとしてNa+ 及びCl- を代表に選ん
だ。その他のイオンはNa+ 及びCl- に比較すれば少
なく、抽出される種々のイオン濃度の割合も積層板によ
って大差はない。本発明で用いられる熱硬化性樹脂とし
ては、フェノール樹脂、エポキシ樹脂、不飽和ポリエス
テル樹脂、メラミン樹脂など、またこれらを桐油、トー
ル脂肪酸、カシュー油、アマニ油、ヒマシ油、リノレン
油、リノール油、エポキシ化植物油などの乾性油、半乾
性油、あるいはこれらのグリセリド、エポキシ化ポリブ
タジエン、ポリエチレングリコール、ポリエステル、ポ
リエーテルなどの可撓性付与剤で変性したものがあげら
れ、これらは単独又は併用して用いられる。
Further, the elution amount of ionic impurities into the water that has penetrated into the laminated plate can be measured by the amount of ionic impurities extracted under high temperature and high pressure conditions as described below. (Measurement method) A 1.6 mm thick laminated plate is cut into 25 mm x 25 mm squares and thoroughly washed. Pure water 4
It is put in a pressure resistant container together with 0 ml and extracted in hot water at 120 ° C. for 48 hours, and the ion concentration in the extract is measured by ion chromatography. The value of this ion concentration is converted into a ratio with respect to the weight of the laminated plate. In the present invention, Na + and Cl are selected as representative ions to be extracted. The amount of other ions is smaller than that of Na + and Cl , and the ratios of various ion concentrations to be extracted do not differ much depending on the laminated plate. As the thermosetting resin used in the present invention, phenol resin, epoxy resin, unsaturated polyester resin, melamine resin and the like, and tung oil, tall fatty acid, cashew oil, linseed oil, castor oil, linolenic oil, linole oil, Drying oils such as epoxidized vegetable oils, semi-drying oils, or glycerides thereof, those modified with a flexibility-imparting agent such as epoxidized polybutadiene, polyethylene glycol, polyester, polyether, and the like, and these may be used alone or in combination. Used.

【0008】[0008]

【実施例】以下、本発明を実施例に基づいて詳細に説明
するが、本発明はこれに限定されるものではない。 《実施例1》イオン性不純物含量の少ない紙(Na+
0.48%,Cl-:0.95%)に、予め水溶性熱硬化
樹脂にて紙繊維表面をコーティングした。次いで、水洗
などでイオン性不純物含量を減少させた桐油変性率35
%のレゾール樹脂を含浸させてプリプレグa(樹脂付着
量45〜50%)を得た。 《実施例2》イオン性不純物含量の多い紙(Na+:0.
92%,Cl-:1.95%)に、予め水溶性熱硬化樹脂
にて紙繊維表面をコーティングした。次いで、水洗など
でイオン性不純物含量を減少させた桐油変性率35%の
レゾール樹脂を含浸させてプリプレグb(樹脂付着量4
5〜50%)を得た。
EXAMPLES The present invention will now be described in detail based on examples, but the present invention is not limited thereto. Example 1 Paper with a low content of ionic impurities (Na + :
0.48%, Cl : 0.95%), the surface of the paper fiber was previously coated with a water-soluble thermosetting resin. Then, the paulownia oil modification rate of 35 was obtained by reducing the content of ionic impurities by washing with water.
% Resol resin was impregnated to obtain a prepreg a (resin adhesion amount 45 to 50%). Example 2 Paper with a high ionic impurity content (Na + : 0.03).
92%, Cl : 1.95%) was previously coated on the surface of the paper fiber with a water-soluble thermosetting resin. Next, a prepreg b (resin adhesion amount 4
5 to 50%) was obtained.

【0009】《比較例1》イオン性不純物含量の多い紙
に(Na+:0.92%,Cl-:1.95%)、桐油変性
率35%のレゾール樹脂を含浸させてプリプレグc(樹
脂付着量45〜50%)を得た。 《比較例2》イオン性不純物含量の少ない紙(Na+
0.48%,Cl-:0.95%)に、水洗などでイオン
性不純物含有量を減少させた桐油変性率35%のレゾー
ル樹脂を含浸させてプリプレグd(樹脂付着量45〜5
0%)を得た。
Comparative Example 1 Paper containing a large amount of ionic impurities (Na + : 0.92%, Cl : 1.95%) was impregnated with a resole resin having a tung oil modification rate of 35% to prepare a prepreg c (resin). An adhesion amount of 45-50%) was obtained. << Comparative Example 2 >> Paper containing a small amount of ionic impurities (Na + :
(0.48%, Cl : 0.95%) is impregnated with a resole resin having a paulownia oil modification rate of 35%, which has a reduced ionic impurity content by washing with water, and the like, and is impregnated with prepreg d (resin adhesion amount 45 to 5).
0%).

【0010】前記のようにして得られたそれぞれのプリ
プレグ8枚と接着剤付き銅箔とを1組として加熱加圧
し、板厚1.6mmの4種類の積層板A,B,C及びDを
得た。以上得られた積層板の特性を表1に示す。
Eight pieces of each prepreg obtained as described above and a copper foil with an adhesive as one set are heated and pressed to obtain four kinds of laminated plates A, B, C and D having a thickness of 1.6 mm. Obtained. Table 1 shows the properties of the laminated board obtained above.

【表1】 [Table 1]

【0011】(試験方法) 1.抽出イオン性不純物量 よく洗浄し、25mm×25mmに切断した板厚1.6mm の
積層板4枚を40mlの純水とともに耐圧容器に入れ、1
20℃で48時間抽出した後、耐圧容器内の水中に含ま
れるイオン性不純物量を測定した。更に、この値から積
層板に含まれるイオン性不純物の含有量を求めた。 2.耐銀移行性 ランド径1.5mm、スルーホール径0.7mmの銀スル
ーホールが100穴連続してつながっている回路2本
を、スルーホール間ピッチが 2.0mmになるように隣接
して配置したテストパターンを作成した。このテストパ
ターンを使用して、印加電圧50VDC、温度40℃、
湿度93%RHの条件下にて2000時間処理後の回路
間絶縁抵抗を測定した。 ランド径1.2mm、スルーホール径0.4mmの銀スル
ーホールが100穴連続してつながっている回路2本
を、スルーホール間ピッチが 1.5mmになるように隣接
して配置したテストパターンを作成した。このテストパ
ターンを使用して、印加電圧50VDC、温度40℃、
湿度93%RHの条件下にて2000時間処理後の回路
間絶縁抵抗を測定した。
(Test method) 1. Amount of extracted ionic impurities Washed well and put four 1.6 mm thick laminated plates cut into 25 mm x 25 mm into a pressure vessel with 40 ml of pure water.
After extraction at 20 ° C. for 48 hours, the amount of ionic impurities contained in water in the pressure vessel was measured. Furthermore, the content of the ionic impurities contained in the laminate was determined from this value. 2. Resistance to silver migration Two circuits with 100 continuous silver through-holes with a land diameter of 1.5 mm and a through-hole diameter of 0.7 mm are arranged adjacent to each other with a pitch between the through-holes of 2.0 mm. The test pattern was created. Using this test pattern, applied voltage 50VDC, temperature 40 ℃,
The insulation resistance between circuits was measured after 2000 hours of treatment under the condition of a humidity of 93% RH. A test pattern in which two circuits in which 100 silver through-holes with a land diameter of 1.2 mm and a through-hole diameter of 0.4 mm are continuously connected are arranged adjacent to each other with a pitch between through holes of 1.5 mm. Created. Using this test pattern, applied voltage 50VDC, temperature 40 ℃,
The insulation resistance between circuits was measured after 2000 hours of treatment under the condition of a humidity of 93% RH.

【0012】[0012]

【発明の効果】以上の結果から明らかなように、本発明
の積層板は極めて優れた耐銀移行性を有する。
As is clear from the above results, the laminate of the present invention has extremely excellent resistance to silver migration.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H05K 1/03 J 7011−4E // B29D 9/00 8823−4F B29K 105:06 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Office reference number FI technical display location H05K 1/03 J 7011-4E // B29D 9/00 8823-4F B29K 105: 06

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 熱硬化性樹脂積層板を加圧下で120℃
の熱水中で48時間処理したときに、抽出されるNa+
及びCl- の量が前記熱硬化性樹脂積層板の0.1重量
%以下であることを特徴とする紙基材熱硬化性樹脂積層
板。
1. A thermosetting resin laminate is heated to 120 ° C. under pressure.
Na + extracted when treated in hot water for 48 hours
And the amount of Cl is 0.1% by weight or less of the thermosetting resin laminate, a paper-based thermosetting resin laminate.
JP4312135A 1992-11-20 1992-11-20 Manufacture of laminate Pending JPH06155461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4312135A JPH06155461A (en) 1992-11-20 1992-11-20 Manufacture of laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4312135A JPH06155461A (en) 1992-11-20 1992-11-20 Manufacture of laminate

Publications (1)

Publication Number Publication Date
JPH06155461A true JPH06155461A (en) 1994-06-03

Family

ID=18025680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4312135A Pending JPH06155461A (en) 1992-11-20 1992-11-20 Manufacture of laminate

Country Status (1)

Country Link
JP (1) JPH06155461A (en)

Similar Documents

Publication Publication Date Title
JPH06155461A (en) Manufacture of laminate
JPH06256546A (en) Production of laminated board
JPH06255013A (en) Thermosetting resin laminated sheet
JP2000082332A (en) Conductive paste composition for via filling
JPH07241961A (en) Production of laminated sheet
JP2641361B2 (en) Manufacturing method of laminated board
JPH06278134A (en) Manufacture of laminate
JPH08238713A (en) Coppered laminated plate
JPH0977886A (en) Non-woven glass for laminated board and laminated board
JPS6153332A (en) Production of laminate
JP3016931B2 (en) Manufacturing method of laminated board
JPH06155695A (en) Method for evaluating laminated plate
JPS6143191B2 (en)
JP3317575B2 (en) Manufacturing method of laminated board
JPH04318032A (en) Production of laminated board
JP2915041B2 (en) Manufacturing method of laminated board
JPH0931210A (en) Production of laminate
JPH0931211A (en) Production of laminate
JPH0841222A (en) Production of thermosetting resin laminate board
JPH0931209A (en) Production of laminate
JP2610707B2 (en) Manufacturing method of thermosetting resin laminate
JPH0971671A (en) Production of laminated sheet
JPH08209587A (en) Electrically insulating laminated base paper
JPH09164646A (en) Manufacture of phenol resin laminated plate
JPH04180842A (en) Ion collecting resin composition and laminated sheet formed using the same