JPH06256546A - Production of laminated board - Google Patents

Production of laminated board

Info

Publication number
JPH06256546A
JPH06256546A JP5046915A JP4691593A JPH06256546A JP H06256546 A JPH06256546 A JP H06256546A JP 5046915 A JP5046915 A JP 5046915A JP 4691593 A JP4691593 A JP 4691593A JP H06256546 A JPH06256546 A JP H06256546A
Authority
JP
Japan
Prior art keywords
resin
paper
weight
base material
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5046915A
Other languages
Japanese (ja)
Inventor
Hitoshi Kawaguchi
均 川口
Takahisa Iida
隆久 飯田
Yasushi Takimoto
恭史 瀧本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP5046915A priority Critical patent/JPH06256546A/en
Publication of JPH06256546A publication Critical patent/JPH06256546A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE:To provide a paper substrate thermosetting resin laminated board excellent in silver transfer resistance by swelling a paper substrate into a larger thickness than its original thickness and simultaneously impregnating the swollen paper substrate with a resin until reaching the inner parts of the paper fibers. CONSTITUTION:This method for producing the objective laminated board is characterized by swelling a paper substrate such as craft paper or linter paper into a thickness larger >=10% than its original thickness and simultaneously impregnating the swollen paper substrate with a polar solvent (e.g. water, an alcohol) and a thermosetting resin (e.g. a phenol resin, epoxy resin, unsaturated polyester resin) until reaching the inner parts of the paper fibers.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、銀の移行現象の発生し
にくい(以下、「耐銀移行性に優れた」と称する)紙基
材熱硬化性樹脂積層板(以下、積層板と称する)の製造
方法を提供するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paper base thermosetting resin laminated plate (hereinafter referred to as a laminated plate) in which a silver migration phenomenon is less likely to occur (hereinafter referred to as "excellent silver migration resistance"). ) Is provided.

【0002】[0002]

【従来の技術】従来、積層板は熱硬化性樹脂配合物ワニ
スをクラフト紙またはリンター紙等に含浸させ、該含浸
紙を複数枚積層し、用途に応じてこの片面又は両面に接
着剤付き銅箔を重ねた後、加熱加圧成形して製造されて
いる。このようにして得られた積層板は、温湿度条件下
において積層板に形成された2つの銀電極(銀ジャン
パ、銀スルーホール等)間に電圧を加えると時間経過に
伴い銀の移行現象が発生することは良く知られている。
近年の電気製品の軽薄短小化の傾向は印刷回路配線板の
高密度化を要求し、銀スルーホール間ピッチも、2.5
〜2.0mmへ狭小化し、現在では 1.5mmピッチの
ものさえ実用化されようとしている。このため、銀の移
行現象による短絡が起こりやすくなり、印刷回路配線板
の信頼性を確保するため、より耐銀移行性の優れた積層
板の要求が高まっている。
2. Description of the Related Art Conventionally, a laminated board is prepared by impregnating a varnish containing a thermosetting resin compound into a kraft paper or a linter paper, laminating a plurality of the impregnated papers, and copper with an adhesive on one or both sides depending on the application. It is manufactured by stacking foils and then heat-pressing. The laminated plate thus obtained shows a migration phenomenon of silver over time when a voltage is applied between two silver electrodes (silver jumpers, silver through holes, etc.) formed on the laminated plate under temperature and humidity conditions. It is well known to occur.
In recent years, the trend toward lighter, thinner, shorter, and smaller electronic products requires higher density of printed circuit wiring boards, and the pitch between silver through holes is 2.5.
It has been narrowed down to ~ 2.0 mm, and now even a 1.5 mm pitch is about to be put to practical use. Therefore, a short circuit due to the migration phenomenon of silver is likely to occur, and in order to secure the reliability of the printed circuit wiring board, there is an increasing demand for a laminated board having more excellent silver migration resistance.

【0003】積層板における銀移行現象は下記のメカニ
ズムで生じることが知られている。 Ag⇔Ag++e- Ag++OH-⇔AgOH (1) 2AgOH⇔Ag2O+H2O (2) Ag2O+H2O⇔2AgOH⇔2Ag++2OH- (3) このように、銀のイオン化が主要因であるため、積層板
中への水分の侵入が不可欠である。更に、侵入した水分
にイオン性不純物が溶出することにより、積層板の電気
特性を劣化させ、特に銀のイオン化が促進され、耐銀移
行性が著しく低下する。このため、従来より樹脂を疎水
性にしたり、2段含浸などにより樹脂の含浸性を向上さ
せることにより積層板の耐湿性を改善する方法や樹脂に
イオン捕集剤を添加することにより銀のイオン化を抑制
する等の方法が採られてきた。
It is known that the silver migration phenomenon in a laminated plate occurs by the following mechanism. Ag⇔Ag + + e - Ag + + OH - ⇔AgOH (1) 2AgOH⇔Ag 2 O + H 2 O (2) Ag 2 O + H 2 O⇔2AgOH⇔2Ag + + 2OH - (3) Thus, ionization of silver main factor Therefore, it is indispensable that moisture penetrates into the laminated plate. Further, the elution of ionic impurities into the invaded water deteriorates the electrical characteristics of the laminated plate, particularly promotes the ionization of silver, and significantly reduces the resistance to silver migration. For this reason, the method of improving the moisture resistance of the laminate by making the resin hydrophobic or improving the impregnation of the resin by two-stage impregnation or the ionization of silver by adding an ion collector to the resin Methods have been adopted to suppress this.

【0004】[0004]

【発明が解決しようとする課題】本発明は耐銀移行性に
優れた積層板の製造方法を提供するものである。
DISCLOSURE OF THE INVENTION The present invention provides a method for producing a laminate having excellent silver migration resistance.

【0005】[0005]

【課題を解決するための手段】本発明は、樹脂含浸工程
において、紙基材を厚み方向に10%以上膨潤させなが
ら樹脂の含浸を行うことにより紙の繊維内部まで樹脂を
浸透させて得られた樹脂含浸紙基材を使用することによ
り、耐銀移行性に優れた積層板を得ることができるもの
である。以下、本発明を詳細に説明する。銀移行現象は
積層板中の紙繊維が吸湿することにより、その繊維内部
で発生する。よって、紙繊維内部にまで樹脂を含浸し吸
湿しにくくすることにより銀移行現象を抑制することが
できる。
Means for Solving the Problems The present invention is obtained by impregnating a resin while impregnating the paper base material with the resin swelling in the thickness direction by 10% or more in the resin impregnation step so that the resin penetrates into the fibers of the paper. By using the resin-impregnated paper base material, it is possible to obtain a laminated plate having excellent silver migration resistance. Hereinafter, the present invention will be described in detail. The silver migration phenomenon occurs inside paper fibers in the laminate due to moisture absorption. Therefore, it is possible to suppress the silver migration phenomenon by impregnating the inside of the paper fiber with the resin to make it difficult to absorb moisture.

【0006】本発明者は、紙繊維の主成分がアルコール
性水酸基を多量にもつセルロースであり、そのアルコー
ル性水酸基が極性溶剤分子を吸着し、ついには紙繊維内
部にまで極性溶剤分子を侵入させ紙繊維自体が膨潤する
ことに着目し、ワニス中に適切な極性溶剤と水溶性熱硬
化性樹脂の組み合わせを選択し添加することにより、含
浸工程中に紙繊維を膨潤させ、具体的には紙基材の厚さ
を10%以上膨潤させながら極性溶剤とともに樹脂を紙
繊維内部にまで含浸させることにより積層板の耐銀移行
性を著しく向上させることに成功したものである。本発
明の方法は1段含浸法、2段含浸法などの含浸方法にか
かわらず適用可能であり、特に2段含浸法の一次処理に
適用することにより大きな効果を得ることができる。
The inventors of the present invention have found that the main component of paper fiber is cellulose having a large amount of alcoholic hydroxyl groups, and the alcoholic hydroxyl groups adsorb polar solvent molecules and finally allow the polar solvent molecules to penetrate into the inside of the paper fibers. Paying attention to the fact that the paper fiber itself swells, by selecting and adding an appropriate polar solvent and water-soluble thermosetting resin combination into the varnish, the paper fiber swells during the impregnation step, and specifically By swelling the thickness of the base material by 10% or more and impregnating the resin with the polar solvent into the inside of the paper fiber, the silver migration resistance of the laminate was remarkably improved. The method of the present invention can be applied regardless of the impregnation method such as the one-step impregnation method and the two-step impregnation method, and particularly when applied to the primary treatment of the two-step impregnation method, a great effect can be obtained.

【0007】ここでいう含浸工程で膨潤した紙基材の厚
みの測定方法は以下のとおりである。即ち、紙基材にか
かる荷重が0となるように調整した厚み測定ゲージに紙
基材をはさみ、十分量のワニスを紙基材に滴下し、製造
工程中の含浸時間と同時間経過したときの紙基材の厚さ
を測定する。本発明で用いられる紙基材としては、クラ
フト紙、リンター紙等があり、極性溶媒としては、水、
アルコール類などがある。また、本発明で用いられる熱
硬化性樹脂としては、フェノール樹脂、エポキシ樹脂、
不飽和ポリエステル樹脂、メラミン樹脂、あるいはこれ
らを、桐油、トール脂肪酸、カシュー油、アマニ油、ヒ
マシ油、リノレン油、リノール油、エポキシ化植物油な
どの乾性油、半乾性油、これらのグリセリド、エポキシ
化ポリブタジエン、ポリエチレングリコール、ポリエス
テル、ポリエーテルなどの可撓化剤で変性したものがあ
げられ、これらは単独又は併用して用いられる。
The method for measuring the thickness of the paper base material swollen in the impregnation step here is as follows. That is, when the paper base material is inserted into a thickness measuring gauge adjusted so that the load applied to the paper base material is 0, a sufficient amount of varnish is dropped on the paper base material, and the same time as the impregnation time during the manufacturing process has elapsed. The thickness of the paper base material is measured. The paper base material used in the present invention includes kraft paper, linter paper, and the like, and the polar solvent is water,
There are alcohols. Further, as the thermosetting resin used in the present invention, phenol resin, epoxy resin,
Unsaturated polyester resin, melamine resin, or tung oil, tall fatty acid, cashew oil, linseed oil, castor oil, linolenic oil, linole oil, epoxidized vegetable oil and other drying oils, semi-drying oils, glycerides of these, epoxidation Examples thereof include those modified with a flexibilizing agent such as polybutadiene, polyethylene glycol, polyester and polyether, and these may be used alone or in combination.

【0008】[0008]

【実施例】以下、本発明を実施例に基づいて詳細に説明
するが、本発明はこれに限定されるものではない。 《実施例1》水90重量部、水溶性低分子量フェノール
樹脂ワニス(固形分50重量%)10重量部からなる一次
処理ワニスを用いて含浸時間25秒になるように一次処
理することにより紙基材を厚さ方向に30%膨潤させ、
その後乾性油変性フェノール樹脂ワニス(固形分50重
量%)にて樹脂量が50重量%になるように塗布含浸し
プリプレグAを得た。 《実施例2》水60重量部、メタノール30重量部、前
記水溶性低分子量フェノール樹脂ワニス10重量部から
なる一次処理ワニスを用いて含浸時間25秒になるよう
に一次処理することにより紙基材を厚さ方向に23%膨
潤させ、その後前記乾性油変性フェノール樹脂ワニスに
て樹脂量が50重量%になるように塗布含浸しプリプレ
グBを得た。
EXAMPLES The present invention will now be described in detail based on examples, but the present invention is not limited thereto. Example 1 A paper base was prepared by primary treatment using a primary treatment varnish consisting of 90 parts by weight of water and 10 parts by weight of a water-soluble low molecular weight phenolic resin varnish (solid content 50% by weight) so that the impregnation time was 25 seconds. Swell the material 30% in the thickness direction,
Then, a prepreg A was obtained by coating and impregnating with a dry oil-modified phenol resin varnish (solid content: 50% by weight) so that the resin amount became 50% by weight. Example 2 Paper base material by primary treatment using a primary treatment varnish consisting of 60 parts by weight of water, 30 parts by weight of methanol and 10 parts by weight of the water-soluble low-molecular weight phenolic resin varnish so that the impregnation time is 25 seconds. Was swelled by 23% in the thickness direction, and then coated and impregnated with the dry oil-modified phenolic resin varnish so that the resin amount was 50% by weight to obtain a prepreg B.

【0009】《実施例3》水60重量部、メタノール3
0重量部、前記水溶性低分子量フェノール樹脂ワニス1
0重量部からなる一次処理ワニスを用いて含浸時間20
秒になるように一次処理することにより紙基材を厚さ方
向に18%膨潤させ、その後前記乾性油変性フェノール
樹脂ワニスにて樹脂量が50重量%になるように塗布含
浸しプリプレグCを得た。 《実施例4》水60重量部、メタノール30重量部、前
記水溶性低分子量フェノール樹脂ワニス10重量部から
なる一次処理ワニスを用いて含浸時間15秒になるよう
に一次処理することにより紙基材を厚さ方向に14%膨
潤させ、その後前記乾性油変性フェノール樹脂ワニスに
て樹脂量が50重量%になるように塗布含浸しプリプレ
グDを得た。
Example 3 Water 60 parts by weight, methanol 3
0 parts by weight of the water-soluble low molecular weight phenolic resin varnish 1
Impregnation time 20 with a primary treatment varnish consisting of 0 parts by weight
The paper base material is swelled by 18% in the thickness direction by a primary treatment for 10 seconds, and then coated and impregnated with the dry oil-modified phenolic resin varnish so that the resin amount becomes 50% by weight to obtain a prepreg C. It was <Example 4> Paper base material by primary treatment using a primary treatment varnish consisting of 60 parts by weight of water, 30 parts by weight of methanol, and 10 parts by weight of the water-soluble low-molecular weight phenolic resin varnish so that the impregnation time is 15 seconds. Was swelled by 14% in the thickness direction, and then coated and impregnated with the dry oil-modified phenolic resin varnish so that the resin amount was 50% by weight to obtain a prepreg D.

【0010】《実施例5》水10重量部、前記水溶性低
分子量ワニス20重量部を添加した前記乾性油変性フェ
ノール樹脂ワニスで紙基材を10%膨潤させながら樹脂
量が50重量%になるように塗布含浸しプリプレグEを
得た。 《比較例1》紙基材に前記乾性油変性フェノール樹脂ワ
ニスを樹脂量が50重量%になるように塗布含浸しプリ
プレグFを得た。
<Example 5> 10 parts by weight of water and 20 parts by weight of the water-soluble low-molecular-weight varnish were added to the drying oil-modified phenol resin varnish to swell the paper base material by 10%, and the resin amount became 50% by weight. Thus, coating and impregnation were carried out to obtain a prepreg E. Comparative Example 1 A prepreg F was obtained by coating and impregnating a paper base material with the dry oil-modified phenol resin varnish so that the resin amount was 50% by weight.

【0011】前記のようにして得られたそれぞれのプリ
プレグ8枚と接着剤付き銅箔とを1組として加熱加圧成
形し、板厚 1.6mmの4種類の積層板A,B,C,D,
E,Fを得た。以上、得られた積層板の特性を表1に示
す。
Eight pieces of each prepreg obtained as described above and a copper foil with an adhesive are set as a set and heat-pressed to obtain four kinds of laminated plates A, B, C having a thickness of 1.6 mm. D,
E and F were obtained. Table 1 shows the characteristics of the laminated plate thus obtained.

【0012】 [0012]

【0013】(試験方法) 耐銀移行性 ランド径1.5mm、スルーホール径0.7mmの銀スルーホ
ールが100穴連続してつながっている回路2本を、ス
ルーホール間ピッチが 2.0mmになるように隣接して配
置したテストパターンを作成した。このテストパターン
を使用して、印加電圧50VDC、温度40℃、相対湿
度93%の条件下にて1000時間処理した後の回路間
絶縁抵抗を測定した。
(Test method) Silver migration resistance Two circuits in which 100 silver through-holes having a land diameter of 1.5 mm and a through-hole diameter of 0.7 mm are continuously connected to each other and the pitch between the through-holes is 2.0 mm. A test pattern was formed so as to be adjacent to each other. Using this test pattern, the insulation resistance between circuits was measured after 1000 hours of treatment under the conditions of an applied voltage of 50 VDC, a temperature of 40 ° C. and a relative humidity of 93%.

【0014】[0014]

【発明の効果】以上の結果から明らかなように、本発明
による積層板は極めて優れた耐銀移行性を有する。
As is clear from the above results, the laminate according to the present invention has extremely excellent resistance to silver migration.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 紙基材への樹脂含浸工程において、紙基
材の厚みを10%以上膨潤させながら紙基材の繊維内部
まで樹脂を浸透させることを特徴とする紙基材熱硬化性
樹脂積層板の製造方法。
1. A thermosetting resin for a paper base material, characterized in that, in the step of impregnating a paper base material with a resin, the resin penetrates into the fibers of the paper base material while swelling the thickness of the paper base material by 10% or more. Laminated board manufacturing method.
JP5046915A 1993-03-08 1993-03-08 Production of laminated board Pending JPH06256546A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5046915A JPH06256546A (en) 1993-03-08 1993-03-08 Production of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5046915A JPH06256546A (en) 1993-03-08 1993-03-08 Production of laminated board

Publications (1)

Publication Number Publication Date
JPH06256546A true JPH06256546A (en) 1994-09-13

Family

ID=12760646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5046915A Pending JPH06256546A (en) 1993-03-08 1993-03-08 Production of laminated board

Country Status (1)

Country Link
JP (1) JPH06256546A (en)

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