JPH06231908A - Structure of network resistor with capacitor - Google Patents

Abstract

PURPOSE:To make the height dimension small by setting a chip-type capacitor element, which is to be fixed to an insulating substrate where a plurality of thick resistor elements are formed, in the mounting hole bored in an insulating substrate. CONSTITUTION:In case of fixing two chip type capacitor elements 15 and 16 onto the surface of an insulating substrate 11 in such a way as to connect both ends of both chip type capacitors 15 and 16 to a circuit pattern 18, mounting holes 20 and 21 are bored, in such a way that they pierce the board from surface to rear, in the section where both chip type capacitors 15 and 16 are to be fixed, out of the insulating substrate. And, after setting both chip type capacitors 15 and 16 in both these mounting holes 20 and 21, respectively, both ends of both these chip capacitor elements 15 and 16 are soldered or electrically connected by conductive paste to the circuit pattern 18. Hereby, the maximum thickness dimension can be made small, and a network resistor fitted with a capacitor can be downsized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a plurality of thick-film type resistance elements connected in parallel or in series with one insulating substrate, and in parallel or in series with the resistance elements. The present invention relates to the structure of a network resistor with a capacitor, in which one or a plurality of chip-type capacitor elements to be connected are mounted.

[0002]

2. Description of the Related Art Conventionally, a network resistor with a capacitor of this type has a plurality of thick film type resistance elements 2, 3, 4 on the upper surface of one insulating substrate 1, as shown in FIGS. And a plurality of chip type capacitor elements 5 and 6 are mounted, and each of these thick film type resistor elements 2, 3 is formed.
4 and each chip type capacitor element 5, 6 and each external lead terminal 7 mounted on the side surface of the insulating substrate 1 are connected by a circuit pattern 8 formed on the surface of the insulating substrate 1. There is. Reference numeral 9 indicates a heat-resistant synthetic resin protective film that covers the entire surface.

[0003]

However, in the conventional network resistor with a capacitor, each chip-type capacitor element 5, 6 is mounted on the upper surface of the insulating substrate 1 as described above, and then both ends thereof are mounted. Since the chip type capacitor elements 5 and 6 are fixed to the circuit pattern 8 on the upper surface of the insulating substrate 1 by soldering or the like, the chip type capacitor elements 5 and 6 project from the upper surface of the insulating substrate 1. However, there is a problem that the maximum thickness dimension of the whole network resistor with a capacitor is increased by the height dimension of each of the chip type capacitor elements 5 and 6, and the network resistor with a capacitor becomes large.

It is a technical object of the present invention to provide a structure of a network resistor with a capacitor which can solve this problem.

[0005]

In order to achieve this technical object, the present invention provides a plurality of thick film type resistance elements on one insulating substrate and one or a plurality of chip type capacitors. In a network resistor with a capacitor formed by fixing elements, the chip-type capacitor element is fitted and mounted in a mounting hole formed in the insulating substrate.

[0006]

[Operation] A chip-type capacitor element fixed to an insulating substrate on which a plurality of thick-film resistance elements are formed is inserted into the mounting hole formed in the insulating substrate as described above, thereby Since the height dimension of the type capacitor element can overlap the thickness dimension of the insulating substrate, the height of the chip type capacitor element protruding from the surface of the insulating substrate is significantly reduced, or Almost nothing can be done.

[0007]

Therefore, according to the present invention, a network resistor with a capacitor, in which a plurality of thick film type resistance elements are formed on a single insulating substrate and chip type capacitor elements are fixed, the whole of which is provided. The maximum thickness of the capacitor can be greatly reduced, and the miniaturization of the network resistor with the capacitor can be achieved.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show a first embodiment. In the figure, reference numeral 11 indicates an insulating substrate made of ceramic or the like, and one side surface of the insulating substrate 11 is provided with a plurality of external lead terminals 1.
7 are fixed along the longitudinal direction at an appropriate pitch, and a plurality of thick film type resistance elements 12, 13, 14 are formed on the surface of the insulating substrate 11, and each thick film resistance element is formed. Between the resistive elements 12, 13, 14 and the thick film resistive elements 12, 13, 14 and the external lead terminals 1
A circuit pattern 18 for connecting with 7 is formed.

When the two chip type capacitor elements 15 and 16 are fixed to the surface of the insulating substrate 11 so that both ends of the chip type capacitor elements 15 and 16 are connected to the circuit pattern 18, The front surface of the insulating substrate 11 penetrates through the mounting holes 20 and 21 in which the two chip-type capacitor elements 15 and 16 are fixedly attached so that the two chip-type capacitor elements 15 and 16 can be fitted. The chip-type capacitor elements 15 and 16 are fitted into the mounting holes 20 and 21, respectively, and the both ends of the chip-type capacitor elements 15 and 16 are connected to the circuit pattern 18 respectively. Soldering (solder portion is indicated by reference numeral 22 at the time of this soldering) to or by electrically connecting with a conductive paste. . Reference numeral 19 indicates a heat-resistant synthetic resin protective film that covers the entire surface.

As described above, the mounting hole 20,
21 is provided, and both chip-type capacitor elements 15 and 16 are fitted into the mounting holes 20 and 21, respectively, so that the height dimension of both chip-type capacitor elements 15 and 16 can be made equal to the thickness of the insulating substrate 11. Since they can overlap with each other, the height of the chip-type capacitor elements 15 and 16 protruding from the surface of the insulating substrate 11 can be significantly reduced.

In this case, the thickness dimension of the insulating substrate 11 is set to be substantially equal to or larger than the height dimension of both chip type capacitor elements 15 and 16, or the height dimension of both chip type capacitor elements 15 and 16 is set. Is substantially equal to or smaller than the thickness of the insulating substrate 11, so that both chip-type capacitor elements 15 and 16 can be prevented from protruding from the surface of the insulating substrate 11.

Both chip type capacitor elements 15,
When fixing 16 to the mounting holes 20 and 21 of the insulating substrate 11, a heat resistant tape 23 is attached to the back surface of the insulating substrate 11 as shown by a chain double-dashed line in the figure, and in this state, It is sufficient to fit both chip-type capacitor elements 15 and 16 into both the mounting holes 20 and 21, and then solder them, and then peel and remove the tape 23. Capacitor element 1
It is also possible to fix the components 5 and 16 in the mounting holes 20 and 21 with a heat-resistant adhesive.

4 and 5 show a second embodiment. The second embodiment is applied to a surface mount type network resistor with a capacitor. That is, a plurality of terminal electrodes 17 for surface bonding are formed on the side surface of the insulating substrate 11a.
While forming a, a plurality of thick film resistance elements 12a and 13a are formed on the upper surface of the insulating substrate 11a, and these thick film resistance elements 12a and 13a are connected to the respective terminal electrode portions 17a. When forming the circuit pattern 18a and further fixing the two chip-type capacitor elements 15a and 16a, to the portion of the insulating substrate 11a to which both the chip-type capacitor elements 15a and 16a are fixed,
The mounting holes 20a and 21a are formed, and both mounting holes 20a and 21a are
21a, each of the two chip type capacitor elements 15
After fitting a and 16a, both ends of both chip type capacitor elements 15a and 16a are connected to the circuit pattern 1
8a is electrically connected by soldering or conductive paste. Note that reference numeral 19a
A blade and a protective film such as glass formed by coating on the surface of the insulating substrate 11a are shown.

Also in this case, the projecting height of both chip type capacitor elements 15a and 16a from the insulating substrate 11a can be reduced or eliminated to reduce the size of the network resistor with a surface mount type capacitor. It can be achieved.

[Brief description of drawings]

FIG. 1 is a perspective view of a network resistor with a capacitor according to a first exemplary embodiment of the present invention.

FIG. 2 is an enlarged sectional view taken along line II-II of FIG.

FIG. 3 is an enlarged sectional view taken along line III-III in FIG.

FIG. 4 is a perspective view of a network resistor with a capacitor according to a first exemplary embodiment of the present invention.

5 is an enlarged sectional view taken along line VV of FIG.

FIG. 6 is a perspective view of a conventional network resistor with a capacitor.

7 is a sectional view taken along line VII-VII of FIG.

8 is a sectional view taken along line VIII-VIII of FIG.

[Explanation of symbols]

 11 Insulating Substrate 12, 13, 14 Thick Film Resistor 15, 16 Chip Capacitor Element 17 External Lead Terminal 18 Circuit Pattern 19 Protective Film 20, 21 Mounting Hole

Claims (1)

[Claims] 1. A network resistor with a capacitor, comprising a plurality of thick film type resistance elements formed on one insulating substrate and one or a plurality of chip type capacitor elements fixed to each other, wherein the chip type Condenser element,
A structure of a network resistor with a capacitor, wherein the structure is fitted in a mounting hole formed in the insulating substrate and mounted.