JPH06246151A - Microcapsule - Google Patents
MicrocapsuleInfo
- Publication number
- JPH06246151A JPH06246151A JP5956293A JP5956293A JPH06246151A JP H06246151 A JPH06246151 A JP H06246151A JP 5956293 A JP5956293 A JP 5956293A JP 5956293 A JP5956293 A JP 5956293A JP H06246151 A JPH06246151 A JP H06246151A
- Authority
- JP
- Japan
- Prior art keywords
- organic polymer
- weight
- fine particles
- emulsion
- microcapsule
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003094 microcapsule Substances 0.000 title claims abstract description 23
- 229920000620 organic polymer Polymers 0.000 claims abstract description 39
- 239000010419 fine particle Substances 0.000 claims abstract description 35
- 150000004714 phosphonium salts Chemical class 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract 2
- 238000000576 coating method Methods 0.000 claims abstract 2
- 239000011162 core material Substances 0.000 abstract description 17
- 229920005989 resin Polymers 0.000 abstract description 15
- 239000011347 resin Substances 0.000 abstract description 15
- 230000003197 catalytic effect Effects 0.000 abstract description 2
- PUAQLLVFLMYYJJ-UHFFFAOYSA-N 2-aminopropiophenone Chemical compound CC(N)C(=O)C1=CC=CC=C1 PUAQLLVFLMYYJJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000839 emulsion Substances 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000003756 stirring Methods 0.000 description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000002775 capsule Substances 0.000 description 8
- -1 derivative of sodium sulfonate Chemical class 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- BRKFQVAOMSWFDU-UHFFFAOYSA-M tetraphenylphosphanium;bromide Chemical compound [Br-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BRKFQVAOMSWFDU-UHFFFAOYSA-M 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 5
- 230000004931 aggregating effect Effects 0.000 description 5
- 239000012736 aqueous medium Substances 0.000 description 5
- USFRYJRPHFMVBZ-UHFFFAOYSA-M benzyl(triphenyl)phosphanium;chloride Chemical compound [Cl-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 USFRYJRPHFMVBZ-UHFFFAOYSA-M 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- 239000011258 core-shell material Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 125000005372 silanol group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000008119 colloidal silica Substances 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000003444 phase transfer catalyst Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000011362 coarse particle Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010556 emulsion polymerization method Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 2
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 2
- 235000019353 potassium silicate Nutrition 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- LXOFYPKXCSULTL-UHFFFAOYSA-N 2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound CC(C)CC(C)(O)C#CC(C)(O)CC(C)C LXOFYPKXCSULTL-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- FRQQKWGDKVGLFI-UHFFFAOYSA-N 2-methylundecane-2-thiol Chemical compound CCCCCCCCCC(C)(C)S FRQQKWGDKVGLFI-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 1
- AUEXTLUUHCZFSX-UHFFFAOYSA-N alumane;silane Chemical compound [AlH3].[SiH4] AUEXTLUUHCZFSX-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- IKWKJIWDLVYZIY-UHFFFAOYSA-M butyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 IKWKJIWDLVYZIY-UHFFFAOYSA-M 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229920001429 chelating resin Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- JHYNXXDQQHTCHJ-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 JHYNXXDQQHTCHJ-UHFFFAOYSA-M 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000006053 organic reaction Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- IXSPLXSQNNZJJU-UHFFFAOYSA-N trimethyl(silyloxy)silane Chemical compound C[Si](C)(C)O[SiH3] IXSPLXSQNNZJJU-UHFFFAOYSA-N 0.000 description 1
- VXYADVIJALMOEQ-UHFFFAOYSA-K tris(lactato)aluminium Chemical compound CC(O)C(=O)O[Al](OC(=O)C(C)O)OC(=O)C(C)O VXYADVIJALMOEQ-UHFFFAOYSA-K 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Polymerization Catalysts (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、第四ホスホニウム塩を
内包するマイクロカプセル体に関するものである。本発
明のマイクロカプセル体は、低分子化合物、樹脂または
樹脂組成物(以下、「樹脂等」と称する。)と容易に混
合し、これらの縮合反応、酸化反応の触媒または相間移
動触媒として好適に用いられ、円滑な反応およびポット
ライフを高める機能を有する。FIELD OF THE INVENTION The present invention relates to a microcapsule body containing a quaternary phosphonium salt. The microcapsule body of the present invention is easily mixed with a low molecular weight compound, a resin or a resin composition (hereinafter referred to as “resin etc.”), and is suitable as a catalyst for the condensation reaction or oxidation reaction or a phase transfer catalyst. It is used and has the function of enhancing smooth reaction and pot life.
【0002】特に本発明のマイクロカプセル体をエポキ
シ樹脂に配合すると、硬化反応を制御して、低温時には
極力反応を抑え、高温時に急速な反応を起こすことを可
能とし、従って保存安定性が良好で、高温時に高い反応
性を呈するエポキシ樹脂組成物を得ることができる。In particular, when the microcapsule body of the present invention is blended with an epoxy resin, the curing reaction can be controlled to suppress the reaction as much as possible at a low temperature, and a rapid reaction can be caused at a high temperature, so that the storage stability is good. An epoxy resin composition exhibiting high reactivity at high temperature can be obtained.
【0003】[0003]
【従来の技術】第四ホスホニウム塩が、樹脂の縮合反
応、酸化反応の触媒または相間移動触媒として作用する
ことは公知である。しかし第四ホスホニウム塩は、樹脂
等に対する相溶性および分散性が著しく悪く、またこの
化合物は反応性が大きく、かつ制御することは困難であ
るため、加工上の取扱いが困難で、樹脂等の中で不均一
な反応を生じるという欠点を有する。2. Description of the Related Art It is known that quaternary phosphonium salts act as catalysts for resin condensation reactions, oxidation reactions or phase transfer catalysts. However, the quaternary phosphonium salt has a markedly poor compatibility and dispersibility with respect to resins and the like, and since this compound has high reactivity and is difficult to control, it is difficult to handle in processing, However, it has the drawback of producing a non-uniform reaction.
【0004】一方、第四ホスホニウム塩は、前述のとお
り樹脂等に対する相溶性が悪くまた水にも難溶であるた
め、通常の方法では、この化合物を内包するマイクロカ
プセル体の製造は困難であった。On the other hand, since the quaternary phosphonium salt has poor compatibility with resins and the like and is also poorly soluble in water as described above, it is difficult to produce a microcapsule body containing this compound by an ordinary method. It was
【0005】[0005]
【発明が解決しようとする課題】第四ホスホニウム塩
は、樹脂等に配合した場合の相溶性や分散性が悪く、ま
た反応を制御することが困難であったため、不均一な反
応を生じ易く、加工の工程上取扱いが困難であり、これ
が解決しようとする課題である。The quaternary phosphonium salt has poor compatibility and dispersibility when blended with a resin or the like, and it is difficult to control the reaction, so that a heterogeneous reaction easily occurs. It is difficult to handle in the process of processing, and this is a problem to be solved.
【0006】[0006]
【課題を解決するための手段】本発明者は上記課題を解
決すべく鋭意検討した結果、無機質微粒子を表面に担持
した微粒子状有機重合体の集合体による皮膜を用いるこ
とにより、第四ホスホニウム塩をマイクロカプセル化で
きることを見出し本発明を完成するに至った。Means for Solving the Problems As a result of intensive studies to solve the above-mentioned problems, the present inventor has found that a quaternary phosphonium salt is formed by using a film made of an aggregate of finely divided organic polymers carrying inorganic fine particles on the surface. The inventors have found that they can be microencapsulated and have completed the present invention.
【0007】本発明のマイクロカプセル体の要素を以下
に説明する。 (1)有機重合体 本発明で用いる有機重合体としては、従来知られた熱可
塑性樹脂および熱硬化性樹脂を使用できるが、水中で容
易に乳化するものが好ましい。このような有機重合体と
しては、例えばアクリロニトリル−ブタジエンゴム、ア
クリルゴム、スチレン−ブタジエンゴムまたはエチレン
−酢酸ビニルゴム;或いは塩化ビニル系樹脂、塩化ビニ
リデン系樹脂、フッ素系樹脂、シリコーン重合体または
スチレン−アクリル酸共重合体等が挙げられる。The elements of the microcapsule body of the present invention will be described below. (1) Organic Polymer As the organic polymer used in the present invention, conventionally known thermoplastic resins and thermosetting resins can be used, but those which are easily emulsified in water are preferred. Examples of such an organic polymer include acrylonitrile-butadiene rubber, acrylic rubber, styrene-butadiene rubber or ethylene-vinyl acetate rubber; or vinyl chloride resin, vinylidene chloride resin, fluorine resin, silicone polymer or styrene-acryl. Examples thereof include acid copolymers.
【0008】無機質微粒子を表面に担持した微粒子状有
機重合体は、例えば上記有機重合体を構成する単量体を
通常の方法で乳化重合し、得られた微粒子状有機重合体
の表面に無機質微粒子を担持させて得ることができる。
この際、微粒子状重合体の表面と無機質微粒子間に充分
な親和力を有することが好ましい。例えば、微粒子状重
合体の表面に無機質微粒子としてコロイダルシリカを担
持させるためには、微粒子状重合体の表面にシラノール
基を存在させることにより、表面を変性すると良い。上
記のように表面を変性させた微粒子状有機重合体の製法
は、種々あるが、コア−シェル型エマルジョン重合法に
よって得たものは、乳化状態での安定性が高く、またカ
プセル化の際の成膜性が良く好ましい。The fine-particle organic polymer having the fine inorganic particles supported on the surface thereof is obtained by, for example, emulsion-polymerizing a monomer constituting the above-mentioned organic polymer by a usual method, and the fine-particle organic polymer obtained has inorganic fine particles on the surface thereof. Can be carried to obtain.
At this time, it is preferable that the surface of the fine particle polymer and the inorganic fine particles have a sufficient affinity. For example, in order to support colloidal silica as inorganic fine particles on the surface of the fine particle polymer, the surface of the fine particle polymer may be modified by the presence of silanol groups. There are various methods for producing a finely divided organic polymer having a surface modified as described above, but those obtained by the core-shell type emulsion polymerization method have high stability in an emulsified state, and when encapsulated. The film-forming property is good, which is preferable.
【0009】コア−シェル型エマルジョン重合法は、予
めコアとなる有機重合体のエマルジョンを生成し、次に
該エマルジョン中に、シェルとなる重合体の原料である
単量体を添加し、共重合させて得ることができる。コア
となる有機重合体のエマルジョンの生成のために使用さ
れる界面活性剤としては、アニオン系界面活性剤、特に
スルホン酸ナトリウムまたは硫酸ナトリウムの誘導体を
用いると分子量が大きい有機重合体を得ることができ好
ましい。またコアとなる有機重合体の粒径は、0.05
〜1.0μmが好ましい。コアとなる有機重合体成分
は、得られるコア−シェル型重合体の内、10〜90重
量%含まれることが好ましく、より好ましくは50〜9
0重量%である。10重量%未満では、マイクロカプセ
ル体の皮膜とした際に有機重合体自体の特性が十分発揮
されず好ましくない。In the core-shell type emulsion polymerization method, an emulsion of an organic polymer serving as a core is formed in advance, and then a monomer as a raw material of a polymer serving as a shell is added to the emulsion to carry out copolymerization. You can get it. As a surfactant used for forming an emulsion of an organic polymer serving as a core, an anionic surfactant, particularly a derivative of sodium sulfonate or sodium sulfate can be used to obtain an organic polymer having a large molecular weight. It is possible and preferable. The particle size of the core organic polymer is 0.05
˜1.0 μm is preferable. The organic polymer component serving as the core is preferably contained in an amount of 10 to 90% by weight, more preferably 50 to 9 of the obtained core-shell type polymer.
It is 0% by weight. If it is less than 10% by weight, the characteristics of the organic polymer itself are not sufficiently exhibited when it is formed into a microcapsule film, which is not preferable.
【0010】シェルとなる重合体の原料である単量体と
しては、アクリロニトリル、メタクリロニトリル、N
−ビニルピロリドンまたはN−ビニルカプロラクタム;
アクリルオキシ基、メタクリルオキシ基またはビニル
オキシ基を有するアルコキシシラン;並びにスチレ
ン、ビニルトルエン、メチル(メタ)アクリレートまた
はエチル(メタ)アクリレート等の他のビニル基を有す
る単量体の3成分を組み合わせて用いると、重合体粒子
の安定なエマルジョンが形成され易く好ましい。Monomers which are the raw materials of the shell polymer are acrylonitrile, methacrylonitrile, N
-Vinylpyrrolidone or N-vinylcaprolactam;
Used in combination with three components of an alkoxysilane having an acryloxy group, a methacryloxy group or a vinyloxy group; and another monomer having a vinyl group such as styrene, vinyltoluene, methyl (meth) acrylate or ethyl (meth) acrylate. It is preferable that a stable emulsion of polymer particles is easily formed.
【0011】アクリルオキシ基、メタクリルオキシ基ま
たはビニルオキシ基を有するアルコキシシランの具体例
としては、γ−アクリルオキシプロピルトリメトキシシ
ラン、γ−メタクリルオキシプロピルトリメトキシシラ
ン、γ−(メタ)アクリルオキシプロピルトリス(トリ
メチルシロキシ)シラン、ビニルトリメトキシシラン、
ビニルトリス(メトキシエトキシ)シランまたはビニル
トリクロロシラン等が挙げられる。Specific examples of the alkoxysilane having an acryloxy group, a methacryloxy group or a vinyloxy group include γ-acryloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane and γ- (meth) acryloxypropyltris. (Trimethylsiloxy) silane, vinyltrimethoxysilane,
Examples thereof include vinyltris (methoxyethoxy) silane and vinyltrichlorosilane.
【0012】表面を変性させた微粒子状有機重合体の他
の製造方法としては、有機重合体のエマルジョンを生成
させ、これにシラン系カップリング剤、チタネート系カ
ップリング剤またはアルミニウム系シランカップリング
剤を添加し反応させる方法がある。Another method for producing a surface-modified fine particle organic polymer is to produce an emulsion of an organic polymer, and add a silane coupling agent, titanate coupling agent or aluminum silane coupling agent to the emulsion. There is a method of adding and reacting.
【0013】(2)無機質微粒子 本発明で用いられる無機質微粒子は、径が50μm以下
であれば使用できるが、超微粒子状粉末を水中に分散せ
しめたコロイド状の形態であると、前記の表面を変性さ
せた微粒子状有機重合体の表面に担持し易いので好まし
い。このような無機質微粒子としては、コロイダルシリ
カ、アルミナゾル、ジルコニアゾル、酸化アンチモンゾ
ル、酸化スズゾル、径が50μm以下のシリカまたはア
ルミナ粉末等が挙げられる。(2) Inorganic Fine Particles The inorganic fine particles used in the present invention can be used as long as the diameter is 50 μm or less. However, when they are in a colloidal form in which ultrafine powder is dispersed in water, It is preferable because it can be easily supported on the surface of the modified fine particle organic polymer. Examples of such inorganic fine particles include colloidal silica, alumina sol, zirconia sol, antimony oxide sol, tin oxide sol, silica having a diameter of 50 μm or less, or alumina powder.
【0014】微粒子状有機重合体の表面に無機質微粒子
を担持させる方法は、例えば前記の無機質微粒子を直接
または水系媒体に分散させ、好ましくは上記のように表
面を変性した前記の有機重合体のエマルジョン中に攪拌
下に徐々に添加する方法が好ましい。この際系を40〜
60℃に加温すると担持が容易に行われるので好まし
い。The method of supporting the inorganic fine particles on the surface of the fine particle organic polymer is, for example, an emulsion of the above organic polymer in which the above inorganic fine particles are directly or dispersed in an aqueous medium and the surface is modified as described above. A method of gradually adding it with stirring is preferred. At this time, the system is 40 ~
It is preferable to heat to 60 ° C. because loading is easily performed.
【0015】有機重合体エマルジョンと無機質微粒子の
併用割合は、最終のマイクロカプセル体の皮膜に求めら
れる特性に応じて調整されるが、エマルジョン中の有機
重合体成分と無機質成分の合計量の、2〜98重量%が
有機重合体成分であるのが一般的であり、好ましくは2
0〜90重量%である。2重量%未満では、皮膜におけ
る有機重合体の性能が表れず、98重量%を超えると、
マイクロカプセル化時に、微粒子状有機重合体の分散性
が悪くなり好ましくない。The combined ratio of the organic polymer emulsion and the inorganic fine particles is adjusted according to the properties required for the final microcapsule film, but it is 2 in the total amount of the organic polymer component and the inorganic component in the emulsion. It is general that about 98% by weight is the organic polymer component, preferably 2
It is 0 to 90% by weight. If it is less than 2% by weight, the performance of the organic polymer in the film does not appear, and if it exceeds 98% by weight,
The dispersibility of the fine particle organic polymer during microencapsulation is not preferable, which is not preferable.
【0016】微粒子状有機重合体の表面に無機質微粒子
が担持されたことは、例えば粘着性の高い有機重合体の
場合には、無機質微粒子担持前後の有機重合体エマルジ
ョンからフィルムを形成させて、それらの粘着性の大幅
な減少の有無を測定することにより確認することができ
る。The fact that the inorganic fine particles are supported on the surface of the fine particle organic polymer means that, for example, in the case of an organic polymer having high tackiness, a film is formed from an organic polymer emulsion before and after supporting the inorganic fine particles, and It can be confirmed by measuring the presence or absence of a significant decrease in the tackiness of.
【0017】(3)芯材 本発明で芯材として用いられる第四ホスホニウム塩は、
下記で表される化合物である。 R4 P+ X- ここで、Rは、アルキル基、フェニル基またはこれらを
骨格に有する誘導体を、Xは、ハロゲン原子を表す。(3) Core Material The quaternary phosphonium salt used as the core material in the present invention is
It is a compound represented below. R 4 P + X − Here, R represents an alkyl group, a phenyl group or a derivative having these in the skeleton, and X represents a halogen atom.
【0018】具体例としては、テトラブチルホスホニウ
ムブロマイド、テトラフェニルホスホニウムブロマイ
ド、エチルトリフェニルホスホニウムブロマイド、ブチ
ルトリフェニルホスホニウムブロマイドおよびベンジル
トリフェニルホスホニウムクロライド等が挙げられる。
これらの中では、テトラフェニルホスホニウムブロマイ
ドおよびベンジルトリフェニルホスホニウムクロライド
が樹脂等に対する反応性が高いので好ましい。Specific examples include tetrabutylphosphonium bromide, tetraphenylphosphonium bromide, ethyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide and benzyltriphenylphosphonium chloride.
Of these, tetraphenylphosphonium bromide and benzyltriphenylphosphonium chloride are preferred because of their high reactivity with resins and the like.
【0019】第四ホスホニウム塩は、水に対する溶解度
が極めて小さい微粉末状化合物であるため、カプセル化
工程で水系媒体に直接加えると分散性が悪いが、該化合
物を一度塩基性ゾルまたは水ガラス等の媒体中に加え
て、これを混練するかまたは粉砕処理して、内部に該化
合物を微粒子状に分散させたものを得、これをカプセル
化工程で水系媒体中に添加すると、該化合物は容易に水
系媒体中に微粉末状に分散することができる。具体的に
はアルミナゾル、水ガラスまたは乳酸アルミゾル中に分
散させた後、ボールミルで混練処理することにより微粒
子化することができる。この際、陽性に荷電したアルミ
ナゾルは、カプセル化工程において、負に帯電されてい
る微粒子状有機重合体同士を凝固させる凝集剤としての
作用も有する。Since the quaternary phosphonium salt is a fine powdery compound having extremely low solubility in water, it has poor dispersibility when directly added to an aqueous medium in the encapsulation process, but the compound is once added to a basic sol or water glass. In the medium, the compound is kneaded or pulverized to obtain a dispersion of the compound in the form of fine particles, which is easily added to the aqueous medium in the encapsulation step. It can be dispersed as a fine powder in an aqueous medium. Specifically, it can be made into fine particles by dispersing in an alumina sol, water glass or aluminum lactate sol and then kneading with a ball mill. At this time, the positively charged alumina sol also acts as an aggregating agent for solidifying the negatively charged fine particle organic polymers in the encapsulation step.
【0020】(4)カプセル化方法 上記の芯材を水性媒体中に分散させ、微粒子状有機重合
体を凝集させる凝集剤、特に好ましくは陽性に荷電した
アルミナゾルを添加し、続いて高攪拌下に、無機質微粒
子を表面に担持した有機重合体のエマルジョンを少量ず
つ添加する。(4) Encapsulation method The above core material is dispersed in an aqueous medium, and an aggregating agent for aggregating the particulate organic polymer, particularly preferably a positively charged alumina sol, is added, and subsequently, under high agitation. Then, an emulsion of an organic polymer carrying inorganic fine particles on the surface is added little by little.
【0021】必要に応じて両性イオン交換体等の脱イオ
ン剤を添加して攪拌を続けると、有機重合体と無機微粒
子の複合皮膜が芯材に形成され、マイクロカプセル体ス
ラリーが得られる。この際有機重合体の成膜温度が高い
ときには加温した方がよい。脱イオン剤の使用は、複合
皮膜の形成が徐々に進行してカプセル化が容易になると
同時に、生成したスラリー状カプセル体の、芯材と皮膜
の界面付近から溶出性イオン化合物を除去できるため、
カプセル体からの芯材の溶出が更に防止することができ
好ましい方法である。If necessary, a deionizing agent such as an amphoteric ion exchanger is added and stirring is continued to form a composite film of an organic polymer and inorganic fine particles on the core material to obtain a microcapsule slurry. At this time, it is better to heat when the film forming temperature of the organic polymer is high. The use of a deionizing agent, the formation of the composite film gradually progresses to facilitate encapsulation, and at the same time, the generated slurried capsule body can remove the leaching ionic compound from the vicinity of the interface between the core material and the film,
This is a preferred method because the elution of the core material from the capsule body can be further prevented.
【0022】上記スラリー状カプセル体中に、微粒子状
酸化アンチモンを存在させておくと、得られた微粉末状
カプセル体の粉塵爆発を防止することができ、取扱上安
全である。When fine particle antimony oxide is allowed to exist in the slurry capsule body, dust explosion of the obtained fine powder capsule body can be prevented, which is safe in handling.
【0023】該スラリーをろ過して粗粒子を除いてから
スプレー乾燥機にかけると、微粉末状のマイクロカプセ
ル体が得られる。When the slurry is filtered to remove coarse particles and then applied to a spray drier, fine powdery microcapsule bodies are obtained.
【0024】[0024]
【作用】本発明のマイクロカプセル体は、無機質微粒子
を表面に担持した有機重合体のエマルジョンを、凝集剤
を用いて凝集させつつ、芯材をカプセル化して得られる
もので、この方法により初めて第四ホスホニウム塩を芯
材とする実用的なカプセル体を得ることができた。また
本発明のマイクロカプセル体は、第四ホスホニウム塩を
無機質および有機重合体よりなる緻密な複合皮膜で覆っ
ているため、これにより樹脂等中に容易に分散され、ま
た通常の環境下で触媒機能を充分に抑制することができ
る。The microcapsule body of the present invention is obtained by encapsulating the core material while aggregating an emulsion of an organic polymer having inorganic fine particles supported on its surface with an aggregating agent. A practical capsule body having a tetraphosphonium salt as a core material could be obtained. Further, since the microcapsule body of the present invention covers the quaternary phosphonium salt with a dense composite film composed of an inorganic and an organic polymer, it is easily dispersed in a resin or the like, and has a catalytic function under a normal environment. Can be sufficiently suppressed.
【0025】本発明のマイクロカプセル体は、その皮膜
を構成する有機重合体のガラス転移点(Tg点)以上に
加熱することにより、該重合体が軟化し膨張し、これに
よって芯材である第四ホスホニウム塩が外部に開放さ
れ、触媒としての機能を発揮すると考えられる。該重合
体のTg点を調整することにより、該カプセル体を樹脂
等と混合する際の熱ロールによる温度程度では、皮膜が
破壊されることがないようにできる。The microcapsule body of the present invention is softened and expanded by heating above the glass transition point (Tg point) of the organic polymer forming the film, and as a result, it is the core material. It is considered that the tetraphosphonium salt is opened to the outside and exerts a function as a catalyst. By adjusting the Tg point of the polymer, it is possible to prevent the film from being destroyed at about the temperature of the heat roll when the capsule is mixed with the resin or the like.
【0026】[0026]
【実施例】以下、実施例を挙げて、本発明を更に詳しく
説明する。 実施例1 (シラノール基を有するコア−シェル型エマルジョンの
合成)2リットル内容積のステンレス製オートクレーブ
に、純水1000cc、レベノールWZ(ポリオキシエ
チレンアルキルフェニルエーテル硫酸ナトリウムの26
重量%水溶液、花王(株)製)19.2g、過硫酸カリ
ウム2.5g、第3級ドデシルメルカプタン1.0g、
ブチルアクリレート250gおよびブタジエン250g
を仕込み、プロペラ型攪拌翼で350rpmの攪拌下、
50℃にて15時間反応を行い、その後レベノールWZ
19.2g、過硫酸カリウム0.5g、スチレン60
g、アクリロニトリル30gおよびNUCシランモノマ
ーA−171(ビニルトリメトキシシラン、日本ユニカ
ー(株)製)10gを仕込み、更に70℃で5時間乳化
重合を続けた。EXAMPLES The present invention will be described in more detail with reference to examples. Example 1 (Synthesis of core-shell type emulsion having silanol group) 1000 cc of pure water and Lebenol WZ (26 of sodium polyoxyethylene alkylphenyl ether sulfate) were placed in a stainless steel autoclave having an internal volume of 2 liters.
Wt% aqueous solution, manufactured by Kao Corporation) 19.2 g, potassium persulfate 2.5 g, tertiary dodecyl mercaptan 1.0 g,
Butyl acrylate 250 g and butadiene 250 g
Was charged with stirring with a propeller type stirring blade at 350 rpm,
The reaction is carried out at 50 ° C for 15 hours, and then Lebenol WZ
19.2 g, potassium persulfate 0.5 g, styrene 60
g, 30 g of acrylonitrile and 10 g of NUC silane monomer A-171 (vinyltrimethoxysilane, manufactured by Nippon Unicar Co., Ltd.) were added, and emulsion polymerization was continued at 70 ° C. for 5 hours.
【0027】得られたエマルジョンはブチルアクリレー
ト/ブタジエン共重合体ゴム粒子をコアとして、シェル
部分にシラノール基を有するスチレン/アクリロニトリ
ル共重合体が形成されたもので、固形分は36重量%で
あった。The resulting emulsion was a styrene / acrylonitrile copolymer having silanol groups in the shell portion, with butyl acrylate / butadiene copolymer rubber particles as the core, and the solid content was 36% by weight. .
【0028】(テトラフェニルホスホニウムブロマイド
の微粒子状分散液の調製)テトラフェニルホスホニウム
ブロマイド300g、アルミナゾル200(陽性に荷電
した粒径30〜100μmのアルミナゾル、濃度10重
量%、日産化学工業(株)製)380gおよび純水10
00gを内容積5リットルの磁性ボールミル中に仕込
み、室温下300rpmにて12時間湿式粉砕して分散
液を得た。(Preparation of fine particle dispersion of tetraphenylphosphonium bromide) 300 g of tetraphenylphosphonium bromide, alumina sol 200 (positively charged alumina sol having a particle size of 30 to 100 μm, concentration 10% by weight, manufactured by Nissan Chemical Industries, Ltd.) 380g and pure water 10
A magnetic ball mill having an internal volume of 5 liters was charged with 00 g, and wet pulverized at room temperature at 300 rpm for 12 hours to obtain a dispersion liquid.
【0029】(無機質微粒子の担持)前記の表面にシラ
ノール基を有する有機重合体エマルジョン660gを1
リットルビーカーに仕込み、プロペラ型攪拌翼で200
rpmの攪拌下、消泡剤として、2,4,7,9−テト
ラメチル−5−デシン−4,7ジオール 2gを添加
し、次にスノーテックスUP(固形分20重量%、径5
〜20μm、長さ40〜300μmの細長い形状のコロ
イド状シリカの水性ゾル。日産化学工業(株)製)23
0gを徐々に添加して、40〜45℃にて1時間攪拌を
続けて調製液を得た。(Support of Inorganic Fine Particles) One 660 g of an organic polymer emulsion having a silanol group on the surface is used.
Charge into a liter beaker and use a propeller-type stirring blade for 200
With stirring at rpm, 2 g of 2,4,7,9-tetramethyl-5-decyne-4,7 diol was added as an antifoaming agent, and then Snowtex UP (solid content 20% by weight, diameter 5
An aqueous sol of elongated colloidal silica having a length of 20 μm and a length of 40 to 300 μm. Nissan Chemical Industries, Ltd.) 23
0 g was gradually added, and stirring was continued at 40 to 45 ° C. for 1 hour to obtain a preparation liquid.
【0030】(マイクロカプセル体の合成)内容積12
リットルの混合槽に純水8リットルと上記のテトラフェ
ニルホスホニウムブロマイドの微粒子状分散液1440
gを仕込み、室温下、プロペラ型攪拌翼で400rpm
の攪拌下、上記の無機質微粒子を表面に担持した有機重
合体エマルジョン381gを1時間かけて添加した。次
にイオン交換樹脂アンバーライトIRN−150(スル
ホン酸および第4級アミン基を有するカチオンおよびア
ニオンの混合型イオン交換体。粒径0.40〜1.19
mmのビーズ状。オルガノ(株)製)390gを投入し
て50℃にて3時間攪拌を続けた。(Synthesis of Microcapsule Body) Internal Volume 12
In a liter mixing tank, 8 liters of pure water and 1440 of the fine particle dispersion of tetraphenylphosphonium bromide.
g at a temperature of 400 rpm with a propeller-type stirring blade at room temperature.
With stirring, 381 g of the organic polymer emulsion having the above-mentioned inorganic fine particles supported on the surface was added over 1 hour. Next, ion exchange resin Amberlite IRN-150 (mixed ion exchanger of cation and anion having sulfonic acid and quaternary amine group. Particle size 0.40 to 1.19).
mm beads. 390 g of Organo Co., Ltd. was added and stirring was continued at 50 ° C. for 3 hours.
【0031】得られたスラリー状混合物を80メッシュ
のろ布に通して粗粒子を除去した後、そのままディスク
型スプレー乾燥機に通して乾燥したところ、粒径1〜1
2μmのテトラフェニルホスホニウムブロマイド62.
7重量%を内包し、ブタジエン共重合体、シリカおよび
アルミナよりなる複合皮膜37.3重量%を有する微粉
末状マイクロカプセル体を得た。The obtained slurry-like mixture was passed through a 80-mesh filter cloth to remove coarse particles, and then passed through a disc-type spray dryer to be dried.
2 μm tetraphenylphosphonium bromide 62.
A fine powder microcapsule body containing 7% by weight and having a composite film of 37.3% by weight made of a butadiene copolymer, silica and alumina was obtained.
【0032】(エポキシ樹脂組成物の調製)エポキシ当
量190、軟化点80℃のエポキシ樹脂100重量部、
硬化剤としてフェノール当量130、軟化点80℃のフ
ェノールノボラック樹脂50重量部、無機充填剤として
粒径3〜120μmの球形溶融シリカ150重量部およ
び上記マイクロカプセル体1.6重量部を配合後、80
〜90℃の熱ロールで3分間溶融混合し、冷却、粉砕し
た。(Preparation of Epoxy Resin Composition) Epoxy equivalent 190, 100 parts by weight of epoxy resin having a softening point of 80 ° C.,
80 parts by weight of a phenol equivalent of 130 as a curing agent, 50 parts by weight of a phenol novolac resin having a softening point of 80 ° C., 150 parts by weight of spherical fused silica having a particle diameter of 3 to 120 μm as an inorganic filler, and 1.6 parts by weight of the above microcapsule body,
The mixture was melt-mixed for 3 minutes with a hot roll at ˜90 ° C., cooled, and ground.
【0033】(硬化試験)得られた粉砕物をJSR型キ
ュラストメーターにかけて100℃における硬化開始時
間、190℃における硬化開始時間および硬化完了時間
を測定した結果を表1に示す。(Curing Test) The obtained pulverized product was subjected to a JSR type curast meter to measure the curing start time at 100 ° C., the curing start time at 190 ° C. and the curing completion time. The results are shown in Table 1.
【0034】比較例1〜3 当該カプセル体の代わりに上記のテトラフェニルホスホ
ニウムブロマイドそのものを、上記のエポキシ樹脂10
0重量部に対して、1、2および3重量部使用し、他は
同じ条件で同様な実験を行った結果を表1に示す。Comparative Examples 1 to 3 Instead of the capsule body, the above tetraphenylphosphonium bromide itself was used, and the above epoxy resin 10 was used.
Table 1 shows the results of carrying out similar experiments under the same conditions except that 1, 2 and 3 parts by weight were used with respect to 0 parts by weight.
【0035】実施例2 実施例1で用いたテトラフェニルホスホニウムブロマイ
ドの代わりに、ベンジルトリフェニルホスホニウムクロ
ライドを同量使用し、他は実施例1と同じ条件でカプセ
ル化を行なったところ、粒径3〜15μmのベンジルト
リフェニルホスホニウムクロライド62.2重量%を内
包し、ブタジエン共重合体、シリカおよびアルミナより
なる複合皮膜37.8重量%を有する、微粉末状マイク
ロカプセル体を得た。当該マイクロカプセル体を実施例
1と同様に評価した結果を表1に示す。Example 2 The same amount of benzyltriphenylphosphonium chloride was used in place of the tetraphenylphosphonium bromide used in Example 1, and the encapsulation was performed under the same conditions as in Example 1 except that the particle size was 3 A fine powdery microcapsule body was obtained which contained 62.2% by weight of benzyltriphenylphosphonium chloride having a particle size of ˜15 μm and had a composite film of 37.8% by weight made of a butadiene copolymer, silica and alumina. The results of evaluating the microcapsule body in the same manner as in Example 1 are shown in Table 1.
【0036】比較例4〜6 当該カプセル体の代わりに上記のベンジルトリフェニル
ホスホニウムクロライドそのものを、上記のエポキシ樹
脂100重量部に対して、1、2および3重量部使用
し、他は同じ条件で同様な実験を行った結果を表1に示
す。Comparative Examples 4 to 6 Benzyltriphenylphosphonium chloride itself was used instead of the capsule body in an amount of 1, 2 and 3 parts by weight based on 100 parts by weight of the epoxy resin, and the other conditions were the same. The results of similar experiments are shown in Table 1.
【0037】[0037]
【表1】 [Table 1]
【0038】[0038]
【発明の効果】本発明のマイクロカプセル体は、樹脂等
に対する相溶性および分散性に優れ、また芯材である第
四ホスホニウム塩の化学反応促進性を、通常の環境下で
充分に抑制することができ、ポットライフ性を向上さ
せ、使用の条件、例えば高温時において、縮合反応、酸
化反応の触媒または相間移動触媒としての効果を初めて
発揮せしめるものである。本発明のマイクロカプセル体
は、各種有機反応の工業的利用性を著しく高めることが
できるものである。INDUSTRIAL APPLICABILITY The microcapsule body of the present invention is excellent in compatibility and dispersibility with respect to resins and the like, and sufficiently suppresses the chemical reaction accelerating property of the core quaternary phosphonium salt under a normal environment. Therefore, the pot life is improved, and the effect as a catalyst for a condensation reaction or an oxidation reaction or a phase transfer catalyst can be exhibited for the first time under the conditions of use, for example, at a high temperature. INDUSTRIAL APPLICABILITY The microcapsule body of the present invention can remarkably enhance the industrial utility of various organic reactions.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C08G 59/68 NKK 8416−4J ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location C08G 59/68 NKK 8416-4J
Claims (1)
有機重合体による皮膜で、第四ホスホニウム塩を被覆し
てなるマイクロカプセル体。1. A microcapsule body obtained by coating a quaternary phosphonium salt with a film made of a particulate organic polymer having inorganic fine particles supported on the surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5956293A JPH06246151A (en) | 1993-02-24 | 1993-02-24 | Microcapsule |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5956293A JPH06246151A (en) | 1993-02-24 | 1993-02-24 | Microcapsule |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06246151A true JPH06246151A (en) | 1994-09-06 |
Family
ID=13116812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5956293A Pending JPH06246151A (en) | 1993-02-24 | 1993-02-24 | Microcapsule |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06246151A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022007673A (en) * | 2020-06-26 | 2022-01-13 | 昭和電工マテリアルズ株式会社 | Method for producing sealing resin composition, sealing resin composition, method for producing electronic component device, and electronic component device |
-
1993
- 1993-02-24 JP JP5956293A patent/JPH06246151A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022007673A (en) * | 2020-06-26 | 2022-01-13 | 昭和電工マテリアルズ株式会社 | Method for producing sealing resin composition, sealing resin composition, method for producing electronic component device, and electronic component device |
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