JPH0788355A - Microcapsule - Google Patents
MicrocapsuleInfo
- Publication number
- JPH0788355A JPH0788355A JP25643293A JP25643293A JPH0788355A JP H0788355 A JPH0788355 A JP H0788355A JP 25643293 A JP25643293 A JP 25643293A JP 25643293 A JP25643293 A JP 25643293A JP H0788355 A JPH0788355 A JP H0788355A
- Authority
- JP
- Japan
- Prior art keywords
- org
- microcapsule
- resin
- polymer
- core material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003094 microcapsule Substances 0.000 title claims abstract description 23
- 229920000620 organic polymer Polymers 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000011162 core material Substances 0.000 claims abstract description 20
- 125000000524 functional group Chemical group 0.000 claims abstract description 5
- 239000010419 fine particle Substances 0.000 claims description 37
- 150000002896 organic halogen compounds Chemical class 0.000 claims description 11
- 150000003606 tin compounds Chemical class 0.000 claims description 4
- 239000000839 emulsion Substances 0.000 abstract description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 11
- 239000003795 chemical substances by application Substances 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 239000002131 composite material Substances 0.000 abstract description 6
- 239000002002 slurry Substances 0.000 abstract description 4
- 238000013019 agitation Methods 0.000 abstract description 3
- 239000011342 resin composition Substances 0.000 abstract description 2
- 231100000419 toxicity Toxicity 0.000 abstract description 2
- 230000001988 toxicity Effects 0.000 abstract description 2
- 229910052736 halogen Inorganic materials 0.000 abstract 3
- 150000002367 halogens Chemical class 0.000 abstract 3
- 230000001133 acceleration Effects 0.000 abstract 1
- 239000000701 coagulant Substances 0.000 abstract 1
- 230000001112 coagulating effect Effects 0.000 abstract 1
- 238000002407 reforming Methods 0.000 abstract 1
- 239000002775 capsule Substances 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 239000002245 particle Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000003756 stirring Methods 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- -1 derivative of sodium sulfonate Chemical class 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 7
- 239000012736 aqueous medium Substances 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 6
- 229910052794 bromium Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011258 core-shell material Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000001878 scanning electron micrograph Methods 0.000 description 4
- 125000005372 silanol group Chemical group 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 230000004931 aggregating effect Effects 0.000 description 3
- 239000008119 colloidal silica Substances 0.000 description 3
- WUOBERCRSABHOT-UHFFFAOYSA-N diantimony Chemical compound [Sb]#[Sb] WUOBERCRSABHOT-UHFFFAOYSA-N 0.000 description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- CWZPGMMKDANPKU-UHFFFAOYSA-L butyl-di(dodecanoyloxy)tin Chemical compound CCCC[Sn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O CWZPGMMKDANPKU-UHFFFAOYSA-L 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 239000011362 coarse particle Substances 0.000 description 2
- 238000010556 emulsion polymerization method Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 2
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 2
- 235000019353 potassium silicate Nutrition 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- LXOFYPKXCSULTL-UHFFFAOYSA-N 2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound CC(C)CC(C)(O)C#CC(C)(O)CC(C)C LXOFYPKXCSULTL-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- FRQQKWGDKVGLFI-UHFFFAOYSA-N 2-methylundecane-2-thiol Chemical compound CCCCCCCCCC(C)(C)S FRQQKWGDKVGLFI-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 1
- AUEXTLUUHCZFSX-UHFFFAOYSA-N alumane;silane Chemical compound [AlH3].[SiH4] AUEXTLUUHCZFSX-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229920001429 chelating resin Polymers 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- AFCAKJKUYFLYFK-UHFFFAOYSA-N tetrabutyltin Chemical compound CCCC[Sn](CCCC)(CCCC)CCCC AFCAKJKUYFLYFK-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- IXSPLXSQNNZJJU-UHFFFAOYSA-N trimethyl(silyloxy)silane Chemical compound C[Si](C)(C)O[SiH3] IXSPLXSQNNZJJU-UHFFFAOYSA-N 0.000 description 1
- VXYADVIJALMOEQ-UHFFFAOYSA-K tris(lactato)aluminium Chemical compound CC(O)C(=O)O[Al](OC(=O)C(C)O)OC(=O)C(C)O VXYADVIJALMOEQ-UHFFFAOYSA-K 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Landscapes
- Manufacturing Of Micro-Capsules (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、有機ハロゲン化合物、
官能基を有するハロゲン化樹脂または有機錫化合物(以
下、「有機ハロゲン化合物等」と称する。)を内包する
マイクロカプセル体に関するものである。本発明のマイ
クロカプセル体は、樹脂または樹脂組成物(以下、単に
「樹脂」と称する。)の改質または硬化促進を目的とす
る配合剤として好適に用いられる。The present invention relates to an organic halogen compound,
The present invention relates to a microcapsule body containing a halogenated resin having a functional group or an organic tin compound (hereinafter referred to as "organic halogen compound or the like"). The microcapsule body of the present invention is suitably used as a compounding agent for the purpose of modifying or accelerating curing of a resin or a resin composition (hereinafter, simply referred to as “resin”).
【0002】[0002]
【従来の技術】樹脂の改質等を目的に有機ハロゲン化合
物等の配合、例えば難燃性を上げるための臭素化エポキ
シ樹脂またはシリコーン樹脂の硬化剤としてジn−ブチ
ル錫ジラウレートの配合が試みられている。2. Description of the Related Art Blending of organic halogen compounds and the like for the purpose of modifying resins, for example, blending of di-n-butyltin dilaurate as a curing agent for brominated epoxy resins or silicone resins for increasing flame retardancy has been attempted. ing.
【0003】しかしながら、一般に有機ハロゲン化合物
等は、樹脂に対する相溶性および分散性が著しく悪く、
またこれら化合物等は反応性が大きく、かつ制御するこ
とは困難であるため、加工上の取扱いが困難で、樹脂中
で不均一な反応を生じるという欠点を有する。更に例え
樹脂中にうまく配合できたとしても、これら化合物は毒
性および腐食性の大きなものが多く、通常の環境下で樹
脂から容易に放出することを防止する必要があった。However, in general, organic halogen compounds and the like have remarkably poor compatibility and dispersibility with resins,
Further, since these compounds and the like have high reactivity and are difficult to control, they are disadvantageous in that they are difficult to handle in processing and cause nonuniform reaction in the resin. Furthermore, even if it could be successfully incorporated into a resin, many of these compounds were highly toxic and corrosive, and it was necessary to prevent them from being easily released from the resin under a normal environment.
【0004】一方、有機ハロゲン化合物等は、一般に撥
水性が高いため水中に微粉末状に分散し難く、これら化
合物等を内包するマイクロカプセル体の製造は困難であ
った。またこれら化合物等の多くは親油性が大きく、例
えカプセル化に成功したとしても通常の壁膜では容易に
浸透し、外部に放出されるという問題があり、実質的に
これら化合物を内包するマイクロカプセル体は得られて
いなかった。On the other hand, organic halogen compounds and the like generally have high water repellency and therefore are difficult to disperse in fine powder form in water, and it has been difficult to produce microcapsules containing these compounds and the like. In addition, many of these compounds and the like have a large lipophilicity, and even if they are successfully encapsulated, they have the problem that they easily penetrate into the normal wall membrane and are released to the outside. The body was not obtained.
【0005】[0005]
【発明が解決しようとする課題】解決しようとする課題
は、有機ハロゲン化合物等は、樹脂に配合した場合の相
溶性や分散性が悪く、また反応を制御することが困難で
あったため、不均一な反応を生じ易く、加工の工程上取
扱いが困難であること、並びに、例え樹脂に配合したと
しても、これら化合物は、樹脂から容易に放出されると
いうことである。The problem to be solved is that organic halogen compounds and the like have poor compatibility and dispersibility when blended with a resin, and it is difficult to control the reaction. That is, the reaction is likely to occur and the handling is difficult in the processing step, and these compounds are easily released from the resin even when incorporated into the resin.
【0006】[0006]
【課題を解決するための手段】本発明者は上記課題を解
決すべく鋭意検討した結果、無機質微粒子を表面に担持
した微粒子状有機重合体の集合体からなる皮膜を用いる
ことにより、有機ハロゲン化合物等をマイクロカプセル
化できることを見出し本発明を完成するに至った。Means for Solving the Problems As a result of intensive studies to solve the above problems, the present inventor has found that an organic halogen compound can be obtained by using a film composed of an aggregate of finely divided organic polymers carrying inorganic fine particles on the surface. The inventors have found that they can be microencapsulated, and have completed the present invention.
【0007】本発明のマイクロカプセル体の技術的要素
を以下に説明する。 (1)有機重合体 本発明で用いる有機重合体としては、従来知られた熱可
塑性樹脂および熱硬化性樹脂を使用できるが、水中で容
易に乳化するものが好ましい。このような有機重合体と
しては、例えばアクリロニトリル−ブタジエンゴム、ア
クリルゴム、スチレン−ブタジエンゴムまたはエチレン
−酢酸ビニルゴム;或いは塩化ビニル系樹脂、塩化ビニ
リデン系樹脂、フッ素系樹脂、シリコーン重合体または
スチレン−アクリル酸共重合体等が挙げられる。The technical elements of the microcapsule body of the present invention will be described below. (1) Organic Polymer As the organic polymer used in the present invention, conventionally known thermoplastic resins and thermosetting resins can be used, but those which are easily emulsified in water are preferred. Examples of such an organic polymer include acrylonitrile-butadiene rubber, acrylic rubber, styrene-butadiene rubber or ethylene-vinyl acetate rubber; or vinyl chloride resin, vinylidene chloride resin, fluorine resin, silicone polymer or styrene-acryl. Examples thereof include acid copolymers.
【0008】無機質微粒子を表面に担持した微粒子状有
機重合体は、例えば上記有機重合体を構成する単量体を
通常の方法で乳化重合し、得られた微粒子状有機重合体
の表面に無機質微粒子を担持させて得ることができる。
この際、微粒子状重合体の表面と無機質微粒子間に充分
な親和力を有することが必要である。例えば、微粒子状
重合体の表面に無機質微粒子としてコロイダルシリカを
担持させるためには、微粒子状重合体の表面にシラノー
ル基を存在させることが必要となる。上記のように表面
を変性させた微粒子状有機重合体の製法は、種々ある
が、コア−シェル型エマルジョン重合法によって得たも
のは、乳化状態での安定性が高く、またカプセル化の際
の成膜性が良く好ましい。The fine-particle organic polymer having the fine inorganic particles supported on the surface thereof is obtained by, for example, emulsion-polymerizing a monomer constituting the above-mentioned organic polymer by a usual method, and the fine-particle organic polymer obtained has inorganic fine particles on the surface thereof. Can be carried to obtain.
At this time, it is necessary to have a sufficient affinity between the surface of the fine particle polymer and the inorganic fine particles. For example, in order to support colloidal silica as inorganic fine particles on the surface of the fine particle polymer, it is necessary to allow silanol groups to exist on the surface of the fine particle polymer. There are various methods for producing a finely divided organic polymer having a surface modified as described above, but those obtained by the core-shell type emulsion polymerization method have high stability in an emulsified state, and when encapsulated. The film-forming property is good, which is preferable.
【0009】コア−シェル型エマルジョン重合法は、予
めコアとなる有機重合体のエマルジョンを生成し、次に
該エマルジョン中に、シェルとなる重合体の原料である
単量体を添加し、共重合させて得ることができる。コア
となる有機重合体のエマルジョンの生成のために使用さ
れる界面活性剤としては、アニオン系界面活性剤、特に
スルホン酸ナトリウムまたは硫酸ナトリウムの誘導体を
用いると分子量が大きい有機重合体を得ることができ好
ましい。またコアとなる有機重合体の粒径は、0.05
〜1.0μmが好ましい。またコアとなる有機重合体成
分は、得られるコア−シェル型重合体の内、10〜90
重量%含まれることが好ましく、より好ましくは50〜
90重量%である。10重量%未満では、マイクロカプ
セル体の皮膜とした際に有機重合体自体の特性が十分発
揮されず好ましくない。In the core-shell type emulsion polymerization method, an emulsion of an organic polymer serving as a core is formed in advance, and then a monomer as a raw material of a polymer serving as a shell is added to the emulsion to carry out copolymerization. You can get it. As a surfactant used for forming an emulsion of an organic polymer serving as a core, an anionic surfactant, particularly a derivative of sodium sulfonate or sodium sulfate can be used to obtain an organic polymer having a large molecular weight. It is possible and preferable. The particle size of the core organic polymer is 0.05
˜1.0 μm is preferable. The organic polymer component serving as the core is 10 to 90 out of the resulting core-shell type polymer.
It is preferably contained by weight%, more preferably 50 to
90% by weight. If it is less than 10% by weight, the characteristics of the organic polymer itself are not sufficiently exhibited when it is formed into a microcapsule film, which is not preferable.
【0010】シェルとなる重合体の原料である単量体と
しては、アクリロニトリル、メタクリロニトリル、N
−ビニルピロリドンまたはN−ビニルカプロラクタム;
アクリルオキシ基、メタクリルオキシ基またはビニル
オキシ基を有するアルコキシシラン;並びにスチレ
ン、ビニルトルエン、メチル(メタ)アクリレートまた
はエチル(メタ)アクリレート等の他のビニル基を有す
る単量体の3成分を組み合わせて用いると、重合体粒子
の安定なエマルジョンが形成され易く好ましい。Monomers which are the raw materials of the shell polymer are acrylonitrile, methacrylonitrile, N
-Vinylpyrrolidone or N-vinylcaprolactam;
Used in combination with three components of an alkoxysilane having an acryloxy group, a methacryloxy group or a vinyloxy group; and another monomer having a vinyl group such as styrene, vinyltoluene, methyl (meth) acrylate or ethyl (meth) acrylate. It is preferable that a stable emulsion of polymer particles is easily formed.
【0011】アクリルオキシ基、メタクリルオキシ基ま
たはビニルオキシ基を有するアルコキシシランの具体例
としては、γ−アクリルオキシプロピルトリメトキシシ
ラン、γ−メタクリルオキシプロピルトリメトキシシラ
ン、γ−(メタ)アクリルオキシプロピルトリス(トリ
メチルシロキシ)シラン、ビニルトリメトキシシラン、
ビニルトリス(メトキシエトキシ)シランまたはビニル
トリクロロシラン等が挙げられる。Specific examples of the alkoxysilane having an acryloxy group, a methacryloxy group or a vinyloxy group include γ-acryloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane and γ- (meth) acryloxypropyltris. (Trimethylsiloxy) silane, vinyltrimethoxysilane,
Examples thereof include vinyltris (methoxyethoxy) silane and vinyltrichlorosilane.
【0012】表面を変性させた微粒子状有機重合体の他
の製造方法としては、有機重合体のエマルジョンを生成
し、これにシラン系カップリング剤、チタネート系カッ
プリング剤またはアルミニウム系シランカップリング剤
を添加し反応させる方法がある。Another method for producing a surface-modified fine-particle organic polymer is to produce an emulsion of an organic polymer, and add a silane coupling agent, titanate coupling agent or aluminum silane coupling agent to the emulsion. There is a method of adding and reacting.
【0013】(2)無機質微粒子 本発明で用いられる無機質微粒子は、径が50mμ以下
のものが好ましく、また超微粒子状粉末を水中に分散せ
しめたコロイド状の形態であると、前記の表面を変性さ
せた微粒子状有機重合体の表面に担持し易いので更に好
ましい。このような無機質微粒子としては、コロイダル
シリカ、アルミナゾル、ジルコニアゾル、酸化アンチモ
ンゾル、酸化スズゾル、径が50mμ以下のシリカまた
はアルミナ粉末等が挙げられる。(2) Inorganic fine particles The inorganic fine particles used in the present invention preferably have a diameter of 50 mμ or less, and when they are in a colloidal form in which ultrafine particle powder is dispersed in water, the surface is modified. It is more preferable because it can be easily supported on the surface of the finely divided organic polymer. Examples of such inorganic fine particles include colloidal silica, alumina sol, zirconia sol, antimony oxide sol, tin oxide sol, silica or alumina powder having a diameter of 50 mμ or less.
【0014】表面を変性させた微粒子状有機重合体の表
面に無機質微粒子を担持させる方法は、例えば前記の無
機質微粒子を直接または水系媒体に分散させて、前記の
有機重合体エマルジョン中に攪拌下に徐々に添加する方
法が好ましい。この際系を40〜60℃に加温すると担
持が容易に行われるので好ましい。The method of supporting the inorganic fine particles on the surface of the finely divided organic polymer whose surface has been modified is, for example, by dispersing the inorganic fine particles directly or in an aqueous medium and stirring in the organic polymer emulsion. A method of gradually adding is preferable. At this time, it is preferable to heat the system to 40 to 60 ° C. because loading is easily performed.
【0015】有機重合体エマルジョンと無機質微粒子の
併用割合は、最終のマイクロカプセル体の皮膜に求めら
れる特性に応じて調整されるが、エマルジョン中の有機
重合体成分と無機質成分の合計量の、2〜98重量%が
有機重合体成分であるのが一般的であり、好ましくは2
0〜90重量%である。2重量%未満では、皮膜におけ
る有機重合体の性能が表れず、98重量%を超えると、
マイクロカプセル化時に、微粒子状有機重合体の分散性
が悪くなり好ましくない。The combined ratio of the organic polymer emulsion and the inorganic fine particles is adjusted according to the properties required for the final microcapsule film, but it is 2 in the total amount of the organic polymer component and the inorganic component in the emulsion. It is general that about 98% by weight is the organic polymer component, preferably 2
It is 0 to 90% by weight. If it is less than 2% by weight, the performance of the organic polymer in the film does not appear, and if it exceeds 98% by weight,
The dispersibility of the fine particle organic polymer during microencapsulation is not preferable, which is not preferable.
【0016】微粒子状有機重合体の表面に無機質微粒子
が担持されたことは、例えば粘着性の高い有機重合体の
場合には、無機質微粒子担持前後の有機重合体エマルジ
ョンからフィルムを形成させて、その粘着性の大幅な減
少を測定することにより、確認することができる。The fact that the inorganic fine particles are supported on the surface of the fine particle organic polymer means that, for example, in the case of an organic polymer having high adhesiveness, a film is formed from an organic polymer emulsion before and after the inorganic fine particles are supported, and It can be confirmed by measuring a significant decrease in tackiness.
【0017】(3)芯材 本発明で芯材として用いられる有機ハロゲン化合物等と
しては、フッ素、塩素、臭素またはヨウ素を分子内に有
する化合物;官能基を有するフッ素樹脂または臭素化エ
ポキシ樹脂等の官能基を有するハロゲン化樹脂またはそ
の前駆体;テトラブチル錫等のアルキル化錫化合物、ジ
ブチル錫ジラウレート等のエステル化錫化合物が挙げら
れる。これらの芯材として用いられる物質は、水系媒体
中で微粒子状となるものならば、液状物または粉末を問
わない。(3) Core Material The organic halogen compound or the like used as the core material in the present invention is a compound having fluorine, chlorine, bromine or iodine in the molecule; a fluorine resin having a functional group, a brominated epoxy resin or the like. Examples thereof include halogenated resins having a functional group or precursors thereof; alkylated tin compounds such as tetrabutyltin and esterified tin compounds such as dibutyltin dilaurate. The substance used as the core material may be liquid or powder as long as it becomes fine particles in the aqueous medium.
【0018】水に対する溶解度が小さい液状物は、水系
媒体中で微粒子滴状に分散させて使用することができ
る。水に対する溶解度の小さな粉末状化合物は、カプセ
ル化工程で水系媒体に直接加えると分散性が悪いので、
該化合物を一度塩基性ゾルまたは水ガラス等の媒体中に
加えて、これを混練するかまたは粉砕処理して、内部に
該化合物を微粒子状に分散させたものを得、これをカプ
セル化工程で水系媒体中に添加すると、該化合物は容易
に水系媒体中に微粉末状に分散することができる。具体
的にはアルミナゾル、水ガラスまたは乳酸アルミゾル中
に分散させた後、ボールミルで混練処理することにより
微粒子化することができる。この際、陽性に荷電したア
ルミナゾルは、カプセル化工程において、負に帯電され
ている微粒子状有機重合体同士を凝固させる凝集剤とし
ての作用も有する。A liquid substance having a low solubility in water can be used by dispersing it in the form of fine particles in an aqueous medium. Powdery compounds with low solubility in water have poor dispersibility when added directly to the aqueous medium during the encapsulation process.
The compound is once added to a medium such as a basic sol or water glass, and this is kneaded or pulverized to obtain a dispersion of the compound in the form of fine particles, which is subjected to an encapsulation process. When added to the aqueous medium, the compound can be easily dispersed in the aqueous medium in the form of fine powder. Specifically, it can be made into fine particles by dispersing in an alumina sol, water glass or aluminum lactate sol and then kneading with a ball mill. At this time, the positively charged alumina sol also acts as an aggregating agent for solidifying the negatively charged fine particle organic polymers in the encapsulation step.
【0019】(4)カプセル化方法 上記の芯材を水性媒体中に分散させ、微粒子状有機重合
体を凝集させる凝集剤、特に好ましくは陽性に荷電した
アルミナゾルを添加し、続いて高攪拌下に、無機質微粒
子を表面に担持した有機重合体のエマルジョンを少量ず
つ添加する。(4) Encapsulation method The above core material is dispersed in an aqueous medium, and an aggregating agent for aggregating the particulate organic polymer, particularly preferably a positively charged alumina sol, is added, followed by high agitation. Then, an emulsion of an organic polymer carrying inorganic fine particles on the surface is added little by little.
【0020】必要に応じて両性イオン交換体等の脱イオ
ン剤を添加して攪拌を続けると、有機重合体と無機微粒
子の複合皮膜が芯材に形成され、マイクロカプセル体ス
ラリーが得られる。この際有機重合体の成膜温度が高い
ときには加温した方がよい。脱イオン剤の使用は、複合
皮膜の形成が徐々に進行してカプセル化が容易になると
同時に、生成したスラリー状カプセル体の、芯材と皮膜
の界面付近から溶出性イオン化合物を除去できるため、
カプセル体からの芯材の溶出が更に防止することができ
好ましい方法である。If necessary, a deionizing agent such as an amphoteric ion exchanger is added and stirring is continued to form a composite film of an organic polymer and inorganic fine particles on the core material to obtain a microcapsule slurry. At this time, it is better to heat when the film forming temperature of the organic polymer is high. The use of a deionizing agent, the formation of the composite film gradually progresses to facilitate encapsulation, and at the same time, the generated slurried capsule body can remove the leaching ionic compound from the vicinity of the interface between the core material and the film,
This is a preferred method because the elution of the core material from the capsule body can be further prevented.
【0021】上記スラリー状カプセル体中に、微粒子状
酸化アンチモンを存在させておくと、得られた微粉末状
カプセル体の粉塵爆発を防止することができ、取扱上安
全である。By allowing fine particulate antimony oxide to exist in the slurry capsule body, it is possible to prevent dust explosion of the obtained fine powder capsule body, which is safe in handling.
【0022】該スラリーをろ過して粗粒子を除いてから
スプレー乾燥機にかけると、微粉末状のマイクロカプセ
ル体が得られる。When the slurry is filtered to remove coarse particles and then applied to a spray drier, fine powdery microcapsule bodies are obtained.
【0023】[0023]
【作用】本発明のマイクロカプセル体は、無機質微粒子
を表面に担持した有機重合体のエマルジョンを、凝集剤
を用いて凝集させつつ、芯材をカプセル化して得られる
もので、この方法により初めて有機ハロゲン化合物等を
芯材とする実用的なカプセル体を得ることができた。ま
た本発明のマイクロカプセル体は、有機ハロゲン化合物
等を無機質および有機重合体よりなる緻密な複合皮膜で
覆っているため、これにより他の樹脂中に容易に分散さ
れ、かつ芯材の浸透および溶出が防止されているもので
ある。The microcapsule body of the present invention is obtained by encapsulating a core material while agglomerating an emulsion of an organic polymer carrying inorganic fine particles on the surface with a flocculant, and by using this method, A practical capsule body having a halogen compound or the like as a core material could be obtained. Further, since the microcapsule body of the present invention covers the organic halogen compound and the like with a dense composite film composed of an inorganic substance and an organic polymer, it is easily dispersed in another resin, and permeates and elutes the core material. Are prevented.
【0024】[0024]
【実施例】以下、実施例を挙げて、本発明を更に詳しく
説明する。 実施例1 (シラノール基を有するコア−シェル型エマルジョンの
合成)2リットル内容積のステンレス製オートクレーブ
に、純水1000cc、レベノールWZ(ポリオキシエ
チレンアルキルフェニルエーテル硫酸ナトリウムの26
重量%水溶液、花王(株)製)19.2g、過硫酸カリ
ウム2.5g、第3級ドデシルメルカプタン1.0g、
ブチルアクリレート250gおよびブタジエン250g
を仕込み、プロペラ型攪拌翼で350rpmの攪拌下、
50℃にて15時間反応を行い、その後レベノールWZ
19.2g、過硫酸カリウム0.5g、スチレン60
g、アクリロニトリル30gおよびNUCシランモノマ
ーA−171(ビニルトリメトキシシラン、日本ユニカ
ー(株)製)10gを仕込み、更に70℃で5時間乳化
重合を続けた。EXAMPLES The present invention will be described in more detail with reference to examples. Example 1 (Synthesis of core-shell type emulsion having silanol group) 1000 cc of pure water and Lebenol WZ (26 of sodium polyoxyethylene alkylphenyl ether sulfate) were placed in a stainless steel autoclave having an internal volume of 2 liters.
Wt% aqueous solution, manufactured by Kao Corporation) 19.2 g, potassium persulfate 2.5 g, tertiary dodecyl mercaptan 1.0 g,
Butyl acrylate 250 g and butadiene 250 g
Was charged with stirring with a propeller type stirring blade at 350 rpm,
The reaction is carried out at 50 ° C for 15 hours, and then Lebenol WZ
19.2 g, potassium persulfate 0.5 g, styrene 60
g, 30 g of acrylonitrile and 10 g of NUC silane monomer A-171 (vinyltrimethoxysilane, manufactured by Nippon Unicar Co., Ltd.) were added, and emulsion polymerization was continued at 70 ° C. for 5 hours.
【0025】得られたエマルジョンはブチルアクリレー
ト/ブタジエン共重合体ゴム粒子をコアとして、シェル
部分にシラノール基を有するスチレン/アクリロニトリ
ル共重合体が形成されたもので、固形分は36重量%で
あった。The obtained emulsion was obtained by forming a styrene / acrylonitrile copolymer having silanol groups in the shell portion with butyl acrylate / butadiene copolymer rubber particles as the core, and the solid content was 36% by weight. .
【0026】(臭素化エポキシ樹脂の微粒子状分散液の
調製)臭素化エポキシ樹脂BREN−S(エポキシ当量
285g/eq.、臭素含有量35.3重量%、軟化点
83.5℃、日本化薬(株)製)400gとアルミナゾ
ル200(陽性に荷電した粒径30〜100mμのアル
ミナゾル、濃度10重量%、日産化学工業(株)製)1
000gを5リットル磁性ボールミル中に仕込み、室温
下300rpmにて12時間湿式粉砕して分散液を得
た。(Preparation of fine particle dispersion of brominated epoxy resin) Brominated epoxy resin BREN-S (epoxy equivalent: 285 g / eq., Bromine content: 35.3% by weight, softening point: 83.5 ° C., Nippon Kayaku Co., Ltd.) 400 g and Alumina sol 200 (positively charged alumina sol having a particle size of 30 to 100 mμ, concentration 10% by weight, manufactured by Nissan Chemical Industries, Ltd.) 1
000 g was placed in a 5 liter magnetic ball mill and wet pulverized at 300 rpm at room temperature for 12 hours to obtain a dispersion liquid.
【0027】(無機質微粒子の担持)前記の表面にシラ
ノール基を有する有機重合体エマルジョン660gを1
リットルビーカーに仕込み、プロペラ型攪拌翼で200
rpmの攪拌下、消泡剤として、2,4,7,9−テト
ラメチル−5−デシン−4,7ジオール 2gを添加
し、次にスノーテックスUP(固形分20重量%、径5
〜20mμ、長さ40〜300mμの細長い形状のコロ
イド状シリカの水性ゾル。日産化学工業(株)製)23
0gを徐々に添加して、40〜45℃にて1時間攪拌を
続けて調製液を得た。(Support of Inorganic Fine Particles) One 660 g of an organic polymer emulsion having a silanol group on the surface is used.
Charge into a liter beaker and use a propeller-type stirring blade for 200
With stirring at rpm, 2 g of 2,4,7,9-tetramethyl-5-decyne-4,7 diol was added as an antifoaming agent, and then Snowtex UP (solid content 20% by weight, diameter 5
An aqueous sol of elongated colloidal silica having a length of ˜20 mμ and a length of 40 to 300 μm. Nissan Chemical Industries, Ltd.) 23
0 g was gradually added, and stirring was continued at 40 to 45 ° C. for 1 hour to obtain a preparation liquid.
【0028】(マイクロカプセル体の合成)12リット
ル混合槽に純水5.8リットルと上記の臭素化エポキシ
樹脂の微粒子状分散液650gを仕込み、室温下、プロ
ペラ型攪拌翼で400rpmの攪拌下、上記の無機質微
粒子を表面に担持したラテックスポリマー890gを1
時間かけて添加した。次に純水610cc、平均粒径
1.2〜1.6μmの三酸化二アンチモン粉末61.4
gおよびイオン交換樹脂アンバーライトIRN−150
(スルホン酸および第4級アミン基を有するカチオンお
よびアニオンの混合型イオン交換体。粒径0.40〜
1.19mmのビーズ状。オルガノ(株)製)280g
を投入して50℃にて3時間攪拌を続けた。(Synthesis of Microcapsule Body) A 12-liter mixing tank was charged with 5.8 liters of pure water and 650 g of the fine particle dispersion of the above-mentioned brominated epoxy resin, and the mixture was stirred at room temperature with a propeller-type stirring blade at 400 rpm. 1 part of 890 g of the latex polymer having the above-mentioned inorganic fine particles supported on its surface
Added over time. Then, pure water 610 cc, diantimony trioxide powder 61.4 having an average particle size of 1.2 to 1.6 μm
g and ion exchange resin Amberlite IRN-150
(Mixed ion exchanger of cation and anion having sulfonic acid and quaternary amine group. Particle size 0.40
1.19 mm bead shape. Organo Co., Ltd.) 280g
Was added and stirring was continued at 50 ° C. for 3 hours.
【0029】得られたスラリー状混合物を80メッシュ
のろ布に通して粗粒子を除去した後、そのままディスク
型スプレー乾燥機に通して乾燥したところ、粒径3〜1
5μmの臭素化エポキシ樹脂33重量%を内包し、ブタ
ジエン共重合体、シリカ、アルミナおよび三酸化二アン
チモンよりなる複合皮膜67重量%を有する微粉末状マ
イクロカプセル体を得た。このマイクロカプセルの粒子
構造の500倍の走査型電子顕微鏡写真を添付する。The resulting slurry-like mixture was passed through a 80-mesh filter cloth to remove coarse particles, and then passed through a disc-type spray dryer to be dried, whereby a particle size of 3 to 1 was obtained.
A fine powdery microcapsule body containing 33% by weight of a 5 μm brominated epoxy resin and 67% by weight of a composite film consisting of a butadiene copolymer, silica, alumina and diantimony trioxide was obtained. Attached is a scanning electron micrograph (magnification: 500) of the particle structure of this microcapsule.
【0030】(カプセル体の熱水により溶出される臭素
の測定)得られたカプセル体1.0gと純水40ccを
テフロン製耐圧型湿式分解ルツボ(商品名「ユニシー
ル」、実容積110cc、耐圧350kg/cm2、(株)ア
コム製)に仕込み、シールし、120℃×200時間加
熱を続けた。加熱後、25℃まで冷却して濾過後、溶出
液中の臭素の含有量を測定したところ、当該カプセル体
に含まれる臭素化エポキシ樹脂量に対して5ppmの臭
素が溶出していた。(Measurement of Bromine Eluted by Hot Water in Capsule Body) 1.0 g of the obtained capsule body and 40 cc of pure water were put into a Teflon pressure-resistant wet decomposition crucible (trade name "Uniseal", actual volume 110 cc, pressure resistance 350 kg). / cm 2 , manufactured by Acom Co., Ltd.), sealed and heated at 120 ° C. for 200 hours. After heating and cooling to 25 ° C. and filtration, the content of bromine in the eluate was measured. As a result, 5 ppm of bromine was eluted with respect to the amount of brominated epoxy resin contained in the capsule body.
【0031】当該カプセル体の代わりに上記の臭素化エ
ポキシ樹脂BREN−Sそのものを用いて(0.33
g)、同様な実験を行ったところ、80ppmの臭素が
溶出した。The above brominated epoxy resin BREN-S itself was used in place of the capsule body (0.33
g), when a similar experiment was conducted, 80 ppm of bromine was eluted.
【0032】実施例2 (ジn−ブチル錫ジラウレートを内包するカプセル体の
合成)ジn−ブチル錫ジラウレートを内包するカプセル
体を次のようにして合成した。実施例1で用いた臭素化
エポキシ樹脂の微粒子状分散液の代わりに、次のジn−
ブチル錫ジラウレートの微粒子状分散液を調製した。1
2リットル内容積の混合槽に、純水5.8リットル、メ
トローズ90SH4000(メトキシヒドロキシプロピ
ルセルロース、信越化学工業(株)製)5.3g、ジn
−ブチル錫ジラウレート186gおよびアルミナゾル2
00 186gを仕込み、室温下、プロペラ型攪拌翼で
400rpmの攪拌下、30分間攪拌を続け、分散液を
調製した。Example 2 (Synthesis of capsule containing di-n-butyltin dilaurate) A capsule containing di-n-butyltin dilaurate was synthesized as follows. Instead of the fine particle dispersion of brominated epoxy resin used in Example 1, the following di-
A fine particle dispersion of butyltin dilaurate was prepared. 1
In a 2 liter internal volume mixing tank, 5.8 liters of pure water, 5.3 g of Metroses 90SH4000 (methoxy hydroxypropyl cellulose, manufactured by Shin-Etsu Chemical Co., Ltd.), di-n
186 g of butyltin dilaurate and alumina sol 2
00 186 g was charged, and stirring was continued at room temperature with a propeller-type stirring blade at 400 rpm for 30 minutes to prepare a dispersion liquid.
【0033】次に、実施例1で得た無機質微粒子を表面
に担持した有機重合体のエマルジョン890gを5分間
かけて除々に添加した。以降の操作は実施例1と全く同
様にして、粒径5〜30μmのジn−ブチル錫ジラウレ
ート33重量%を内包し、ブタジエン共重合体、シリ
カ、アルミナおよび三酸化二アンチモンよりなる複合皮
膜67重量%を有する、微粉末状マイクロカプセル体を
得た。このマイクロカプセルの粒子構造の5000倍の
走査型電子顕微鏡写真を添付する。Next, 890 g of an emulsion of an organic polymer having the inorganic fine particles obtained in Example 1 supported on its surface was gradually added over 5 minutes. Subsequent operations are exactly the same as in Example 1, including 33% by weight of di-n-butyltin dilaurate having a particle size of 5 to 30 μm, and containing butadiene copolymer, silica, alumina and diantimony trioxide composite film 67. A finely powdered microcapsule body with a weight percentage was obtained. Attached is a scanning electron micrograph of 5000 times the particle structure of the microcapsules.
【0034】(シリコーン樹脂に対する硬化促進剤とし
てのポットライフ評価)カネカ サイリルSAT200
(シリコーン−アクリル樹脂、鐘淵化学工業(株)製)
100g、実施例2で得られたカプセル3.03g(ジ
n−ブチル錫ジラウレートとして1.0gを内包)およ
び純水0.5gをステンレス容器に仕込み、ディスパー
で2000rpmにて10分間混合したところ、きれい
にカプセル体は分散された。これを室温下1週間放置し
たが増粘は認められなかった。一方、更に120℃で3
0分間加熱したところ、完全に硬化した。(Evaluation of pot life as a curing accelerator for silicone resin) Kaneka Cyril SAT200
(Silicone-acrylic resin, manufactured by Kanegafuchi Chemical Industry Co., Ltd.)
100 g, 3.03 g of the capsule obtained in Example 2 (including 1.0 g as di-n-butyltin dilaurate) and 0.5 g of pure water were charged in a stainless steel container and mixed with a disper at 2000 rpm for 10 minutes, The capsule bodies were dispersed well. This was left at room temperature for 1 week, but no increase in viscosity was observed. Meanwhile, at 120 ℃ 3
When heated for 0 minutes, it was completely cured.
【0035】他方該カプセル体を使用する代わりに、ジ
n−ブチル錫ジラウレート1.0gを使用し、他は上記
と同様に行ったところ、室温下1日後には殆ど硬化して
いた。On the other hand, 1.0 g of di-n-butyltin dilaurate was used instead of using the capsule body, and the same procedure as described above was performed except that it was almost cured after 1 day at room temperature.
【0036】[0036]
【発明の効果】本発明のマイクロカプセル体は、樹脂に
対する相溶性および分散性に優れ、また芯材である有機
ハロゲン化合物等の毒性、腐食性または化学反応促進性
を通常の環境下で充分に抑制することができ、使用の条
件、例えば高温時において、難燃性または重合触媒とし
ての効果を初めて発揮せしめるものである。INDUSTRIAL APPLICABILITY The microcapsule body of the present invention is excellent in compatibility and dispersibility with respect to a resin, and has sufficient toxicity, corrosiveness or chemical reaction accelerating property of an organic halogen compound as a core material under a normal environment. It can be suppressed and, for the first time, exhibits flame retardancy or an effect as a polymerization catalyst under the conditions of use, for example, at a high temperature.
【図1】実施例1で得たマイクロカプセルの粒子構造の
500倍の走査型電子顕微鏡写真である。FIG. 1 is a scanning electron micrograph (magnification: 500) of the particle structure of the microcapsules obtained in Example 1.
【図2】実施例2で得たマイクロカプセルの粒子構造の
5000倍の走査型電子顕微鏡写真である。FIG. 2 is a scanning electron micrograph (magnification: 5000) of the particle structure of the microcapsules obtained in Example 2.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 C08L 101/00 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location C08L 101/00
Claims (1)
ロゲン化樹脂または有機錫化合物を芯材とし、無機質微
粒子を表面に担持した微粒子状有機重合体の集合体から
なる皮膜を有するマイクロカプセル体。1. A microcapsule body having a film made of an aggregate of fine particle organic polymers having an organic halogen compound, a halogenated resin having a functional group or an organic tin compound as a core material, and supporting inorganic fine particles on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25643293A JPH0788355A (en) | 1993-09-20 | 1993-09-20 | Microcapsule |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25643293A JPH0788355A (en) | 1993-09-20 | 1993-09-20 | Microcapsule |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0788355A true JPH0788355A (en) | 1995-04-04 |
Family
ID=17292584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25643293A Pending JPH0788355A (en) | 1993-09-20 | 1993-09-20 | Microcapsule |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0788355A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007137916A (en) * | 2005-11-14 | 2007-06-07 | Honda Motor Co Ltd | Thermal storage microcapsule and manufacturing method thereof |
| US7794836B2 (en) | 2002-09-04 | 2010-09-14 | Southwest Research Institute | Microencapsulation of oxygen or water sensitive materials |
| JP2011225882A (en) * | 2011-05-09 | 2011-11-10 | Toyota Motor Corp | Thermally conductive insulating resin molding |
-
1993
- 1993-09-20 JP JP25643293A patent/JPH0788355A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7794836B2 (en) | 2002-09-04 | 2010-09-14 | Southwest Research Institute | Microencapsulation of oxygen or water sensitive materials |
| JP2007137916A (en) * | 2005-11-14 | 2007-06-07 | Honda Motor Co Ltd | Thermal storage microcapsule and manufacturing method thereof |
| JP2011225882A (en) * | 2011-05-09 | 2011-11-10 | Toyota Motor Corp | Thermally conductive insulating resin molding |
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