JPH06251994A - Chip type semiconductor ceramic composite part - Google Patents

Abstract

(57) [Summary] [Structure] A chip-type semiconductor having a semiconductor ceramic substrate 11 having capacitor electrodes 12 on both front and back main surfaces, a resistor 13 on one side, and an external connection electrode 14 on the remaining side. Porcelain composite component 10. [Effect] One chip can have both functions of a capacitor and a resistor, and the product shape can be reduced. Further, since it is a chip type, surface mounting is possible. Further, the size of the chip itself can be secured to secure a sufficient distance between the electrodes, and thus high reliability can be secured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type semiconductor porcelain composite part, and more particularly to a chip-type semiconductor porcelain composite part utilizing a semiconductor porcelain and having both functions of a capacitor and a resistor.

[0002]

2. Description of the Related Art In recent years, in CR composite elements having both functions of a capacitor and a resistor, a small product form capable of surface mounting is desired with the demand for downsizing and thinning of equipment and the development of IC circuits. Is becoming.

In the conventional CR composite element, a chip type capacitor and a chip type resistor are stacked and each electrode is connected, and the whole is resin-molded into one element, which enables surface mounting. A known chip-type CR composite element is known.

As the chip type capacitor, a single layer chip type capacitor as shown in FIGS. 7 and 8 is mainly put into practical use. In the chip type capacitor 20 shown in FIG. 7, the counter electrodes 22 are formed on both the front and back main surfaces of the semiconductor ceramic substrate 21.
Is formed, and external connection electrodes 24 connected to either one of the front and back surfaces of the counter electrode are entirely formed on the front and rear side surfaces. Further, in the chip type capacitor 30 shown in FIG. 8, the counter electrode 22 is formed in substantially the center of the semiconductor porcelain substrate 21 except for a part of both front and back main surfaces, and the external connection electrode is formed similarly to that shown in FIG. 24 are entirely formed on the front and rear side surfaces.

[0005]

DISCLOSURE OF THE INVENTION Chip type CR described above
Also in the composite element, it is desired to further reduce the size of the product, and for that purpose, it is considered to reduce the size of each component. However, chip type capacitors 20, 30
If the size of the device is reduced, the distance between the electrodes 22 becomes shorter, resulting in poor insulation and reduced reliability. Therefore, from the present situation, chip capacitors 20 and 3
It is difficult to reduce the size to 0. Therefore, there is a problem that there is a limit to downsizing the chip-type CR composite element in which two parts, that is, a chip-type capacitor and a chip-type resistor are stacked.

The present invention has been invented in view of the above problems, and is capable of surface mounting, has both functions of a capacitor and a resistor, and has high reliability, and further miniaturization is achieved. Another object is to provide a chip-type semiconductor porcelain composite component.

[0007]

In order to achieve the above object, a chip type semiconductor porcelain composite component according to the present invention has capacitor electrodes on both front and back main surfaces of a semiconductor porcelain substrate and a resistor on one side surface. However, it is characterized by having an electrode for external connection on the remaining side surface.

[0008]

According to the chip type semiconductor porcelain composite component of the present invention, the semiconductor porcelain substrate has the capacitor electrodes on both front and back main surfaces, the resistor on one side surface, and the external connection electrode on the other side surface. Since it has, it has both the function of the capacitor and the resistance. Further, one conventional capacitor chip has both functions, and the product shape can be reduced. Moreover, since it is a chip type, surface mounting is possible.

Further, it is possible to secure a sufficient distance between the electrodes, and therefore high reliability is also secured.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a chip type semiconductor ceramic composite component according to the present invention will be described below with reference to the drawings. 1 (a)-
(D) is a schematic perspective view and a schematic side view, respectively, showing the structure of the chip-type semiconductor porcelain composite component according to the embodiment, and 10 in the figure shows the chip-type semiconductor porcelain composite component. A capacitor electrode 12 is formed on both front and back main surfaces of the semiconductor porcelain substrate 11, a resistor 13 is formed on one side surface, and the remaining side surface is connected to either one of the front and back capacitor electrodes 12, and a resistor is also formed. An external connection electrode 14 connected to the body 13 is formed. Further, grain boundary insulated recesses 15 are formed at the corners of the front and back surfaces where the capacitor electrodes 12 are formed. The chip type semiconductor ceramic composite component 10 thus configured is represented by an equivalent circuit as shown in FIG.
It becomes like (e).

2 to 6 show a manufacturing process of a chip type semiconductor ceramic composite component according to an embodiment.

The chip type semiconductor ceramic composite component according to the embodiment is manufactured as follows. First, a raw material powder for semiconductor porcelain containing strontium titanate as a main component was prepared, and a mixture of binders was press-molded to have a plurality of mutually parallel grooves 15 on the front and back main surfaces.
A sheet-shaped molded body is formed. This sheet-shaped molded body is subjected to binder removal processing in the temperature range of 800 to 1000 ° C. in the atmosphere, and then fired in the reducing atmosphere in the temperature range of 1450 to 1500 ° C. to obtain the semiconductor ceramic substrate 11 (FIG. 2).

Next, the obtained semiconductor porcelain substrate 11 is cut to a desired size along a cutting line shown by a chain line orthogonal to the groove 15 to form a strip-shaped semiconductor porcelain substrate 11 (FIG. 3).

Then, a diffusing agent containing Bi ₂ O ₃ as a main component is applied to both main surfaces thereof, and then 1100 to 125 in air.
Heat treatment is performed in the temperature range of 0 ° C.
Insulate the grain boundaries. Thereafter, a silver paste is printed in a desired shape on the planes of the semiconductor porcelain substrate 11 on both the front and back main surfaces except the grooves 15, and baking is performed in the air at a temperature range of 750 to 860 ° C. to form the capacitor electrode 12. Formed (FIGS. 4A and 4B).

Next, the groove 15 is used as a dividing groove to divide the element into individual bodies (FIG. 5).

Further, a resistance paste is printed on one of the cut surfaces and baked in the temperature range of 600 to 740 ° C. to form the resistor 13 (FIGS. 6A and 6B).

Finally, the remaining sides are shown in FIGS. 1 (a)-(d).
The external connection electrode 14 as shown in 1 is formed, and the chip-type semiconductor ceramic composite component 10 is manufactured.

As described above, in this embodiment, the capacitor electrode 12 and the resistor 13 are formed on the surface of the chip type semiconductor ceramic substrate 11. Since one chip has both functions of a capacitor and a resistor, it can be used as the equivalent circuit of FIG. 1E, and the size of the product can be reduced. Further, since it is a chip type, surface mounting is possible.

Further, after the groove 15 is formed, a grain boundary insulating treatment is performed, and in the subsequent step, the semiconductor porcelain substrate 11 is cut using the groove 15 as a dividing groove. For this reason, there is a recess 15 that has been subjected to grain boundary insulation treatment at the corner of the surface on which the capacitor electrode 12 is formed. As a result, a sufficient distance can be secured between the electrodes, and thus high reliability can be secured.

[0020]

As described above in detail, in the chip-type semiconductor ceramic composite component according to the present invention, the semiconductor ceramic substrate has the capacitor electrodes on both front and back main surfaces, and the resistor on one side surface, Since the external connection electrode is provided on the remaining side surface, one chip can have both functions of a capacitor and a resistor, and the product shape can be reduced.

Further, since it is a chip type, surface mounting is possible.

Further, the size of the chip itself can be secured and the distance between the electrodes can be secured sufficiently, so that high reliability can be secured.

[Brief description of drawings]

1 (a) to 1 (e) show a chip-type semiconductor ceramic composite component according to the present invention, in which (a) and (b) are schematic perspective views, and (c) and (d) are schematic views. Side view, (e) is (c)
2 is a schematic diagram showing the circuit of FIG.

FIG. 2 is a schematic perspective view showing one manufacturing process of the chip-type semiconductor ceramic composite component according to the embodiment.

FIG. 3 is a schematic perspective view showing one manufacturing process of the chip-type semiconductor ceramic composite component according to the example.

4A and 4B are schematic plan views showing one manufacturing process of the chip-type semiconductor ceramic composite component according to the embodiment.

FIG. 5 is a schematic cross-sectional view showing one manufacturing process of the chip-type semiconductor ceramic composite component according to the example.

6A and 6B are a schematic perspective view and a schematic side view showing one manufacturing process of the chip-type semiconductor ceramic composite component according to the embodiment.

FIG. 7 is a schematic perspective view showing a conventional chip type capacitor.

FIG. 8 is a schematic perspective view showing another conventional chip type capacitor.

[Explanation of symbols]

 10 chip type semiconductor porcelain composite component 11 semiconductor porcelain substrate 12 capacitor electrode 13 resistor 14 external connection electrode

Claims (1)

[Claims] 1. A chip-type semiconductor porcelain composite component having capacitor electrodes on both front and back main surfaces of a semiconductor porcelain substrate, a resistor on one side surface, and external connection electrodes on the remaining side surfaces. .