JPH062797U - Electronic component mounting device - Google Patents

Abstract

(57) [Summary] [Purpose] Eliminates positional deviation of electronic parts when mounting them and mounts them with high accuracy. [Structure] An inside of an air hole 21 of a nozzle 19 for adsorbing an electronic component 13 is formed into a stepped portion having a different diameter, and a vertically movable stepped pin 24 having a different diameter is inserted into the air hole 21. [Effect] Since the pins 24 having different diameters function to hold down the electronic component 13 and narrow the air holes 21, the electronic component 13 can be mounted with high precision.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electronic component mounting apparatus for vacuum-suctioning an electronic component and mounting it on a predetermined position such as a substrate.

[0002]

[Prior art]

 In recent years, when chip-shaped electronic components such as chip resistors and chip capacitors are mounted on a substrate, it is performed that the electronic components are vacuum-sucked by a nozzle and then the nozzle is displaced to a predetermined position to mount the electronic component. There is. FIG. 10 is an explanatory view showing a schematic configuration of this type of electronic component mounting apparatus. In the figure, reference numeral 1 is a base, to which a cartridge 2 and a tray supply device 3 are attached. The cartridge 2 includes a tape reel 4 containing a chip resistor and a chip capacitor, a take-up reel 5 for winding a top tape of the tape reel 4, and the like. Further, the tray supply device 3 is provided with a tray 6 in which electronic components are housed, a lifting motor 7 for moving the tray 6 up and down, and the like. A substrate 8 is placed on the base 1, and the substrate 8 is transported in a direction orthogonal to the paper surface of the drawing. Further, an orthogonal robot 9 is arranged above the base 1, and the orthogonal robot 9 can move in a horizontal direction and a vertical direction as shown by arrows. A suction head 11 having a cylinder 10 is attached to the orthogonal robot 9 and an upper portion thereof. As shown in FIG. 8, a nozzle 12 which is driven up and down by the cylinder 10 is provided below the suction head 11. Has been. The nozzle 12 is in the lowered position, and can vacuum suction the top surface of the electronic component 13 housed in the tray 6 described above.

In the operation of the electronic component mounting apparatus configured as described above, first, the orthogonal robot 9 moves the suction head 11 to just above the tray 6, and when the cylinder 10 is driven at the position, the nozzle 12 is moved. It descends and vacuum-adsorbs the top surface of the electronic component 13. Next, after raising the nozzle 12, the suction head 11 is moved to a predetermined position on the substrate 8 by the orthogonal robot 9, and when the cylinder 10 is driven again at that position, the nozzle 12 holds the electronic component 13 and the substrate 8 is sucked. When the electrode of the electronic component 13 comes into contact with the cream solder previously applied to the substrate 8, the suction of the nozzle 12 is released. After that, by repeating the above operation, a predetermined electronic component is fixed to a predetermined position on the board 8 by cream solder, and the board 8 is transferred to a reflow furnace to melt and solidify the solder, thereby all the board 8 The electronic component 13 is mounted.

[0004]

[Problems to be solved by the device]

 By the way, in the above-described conventional component mounting apparatus, when the electronic component 13 is fixed at a predetermined position as shown in FIG. Since the air is blown out from the hole of the nozzle 12 in this state, the parts are separated from the nozzle. However, for parts that cannot use cream solder and parts to be mounted other than the board, as shown in Fig. 8, the parts to be mounted are provided with recesses according to the outer shape to fix the parts. Therefore, if air is blown from the nozzle to separate the parts, the air pressure at this time blows off the light, thin, short, and small parts.

The present invention has been made in view of the above-mentioned circumstances of the prior art, and an object thereof is to provide an electronic component mounting apparatus capable of stably mounting a light, thin, short and small electronic component. To provide.

[0006]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention is an electronic component supply device for adsorbing electronic components by means of a nozzle that is held by a suction head so that it can be moved up and down. A lower hole portion having a smaller inner diameter and an upper hole portion having a larger inner diameter at a distal end portion are formed to have different diameters, and the air hole has a head and legs loosely fitted so as to be vertically movable. The pins having different diameters are formed such that the diameter of the head portion is larger than the diameter of the pilot hole portion and the length of the leg portion is longer than the pilot hole portion.

[0007]

[Action]

 When the air inside the nozzle is sucked by the pin inside the nozzle, the pin is also sucked, so that the air hole of the nozzle opens and the electronic component is adsorbed by the nozzle. Also, when air is blown into the nozzle, the pin is also pushed to close or squeeze the air hole, so that air is not sent out of the nozzle.

[0008]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. 1 is a sectional view of a suction nozzle provided in an electronic component supply apparatus according to an embodiment of the present invention before component suction, FIG. 2 is a sectional view of the suction head shown in FIG. 1 during component suction, and FIG. 3 is FIG. FIG. 4 is a cross-sectional view of the suction head shown in FIG. 1 when parts are removed, FIG. 4 is a cross-sectional view taken along the line AA of FIG. 1, FIG. It is a principal part sectional view which shows an example. The same parts as those in the conventional example are designated by the same reference numerals, and detailed description thereof will be omitted. In these figures, reference numeral 15 is a suction head attached to the orthogonal robot 9 via a support plate 9a, and a lifting / lowering cylinder 16 of the suction head 15 is attached to the upper part of the suction head 15 via a rod 17. ing. The suction head 15 is composed of a guide 18 for attaching to the support plate 9a and a nozzle 19 for sucking the electronic component 13. As shown in FIG. 1, a tip portion 20 of this nozzle 19 is formed into a tapered cylindrical shape according to the size of an electronic component, and a central portion thereof is processed into a hollow to form an air hole 21 for passing air. . A portion of the air hole 21 near the tip portion 20 is an air outlet and serves as a small hole portion 21a having a small diameter, an intermediate portion has a thicker middle hole portion 21b than the lower hole portion 21a, and an upper portion has a thicker upper hole portion 21c. It is formed in three steps. Further, an intake / exhaust hole 22 communicating from the upper hole portion to the outer periphery is formed, and a hose 23 is connected to the intake / exhaust hole 22. The hose 23 is connected to a vacuum pump (not shown) and an intake / exhaust switching cock. . Further, three stepped pins 24 are loosely fitted in the air hole 21 so as to be vertically movable. Since the leg 24a of the pin 24 is inserted into the lower hole 21a of the air hole 21, the pin 24 is processed into a thin cylinder, and the length thereof is set to be 2 to 3 mm longer than the lower hole 21a. The upper portion of the leg portion 24a becomes the body portion 24b which is inserted into the inner hole portion 21b, and the inner diameter is set to a size capable of sliding in the inner hole portion 21b. The length of the body portion 24b is set to be 1 mm to 2 mm shorter than the inner hole portion 21b, and has a shape in which a part of the outer circumference is cut as a passage hole for air. The head portion 24c continuing above the body portion 24b is set to be thicker than the diameter of the inner hole portion 21b so as to close the inner hole portion 21b. The length of the head portion 24c is set so that it can move up and down inside the upper hole portion 21c.

Next, the operation of the embodiment having the above configuration will be described. First, the orthogonal robot 9 moves the suction head 15 to position the nozzle 19 directly above the electronic component 13 housed in the tray 6. In this case, the state of the nozzle is such that the leg portion 24a of the pin projects 1 mm from the tip portion 20 of the nozzle, as shown in FIG. When the cylinder 16 is lowered in this state, the nozzle 19 at the lower end of the rod 17 is lowered as shown in FIG. 2, so that the tip portion 20 of the nozzle 19 reaches the upper surface of the electronic component 13. At this time, the leg portion 24a of the pin 24 comes into contact with the electronic component 13, so that the leg portion 24a is pushed upward and retracts into the air hole. At this time, when air is sucked in the direction of the arrow of the hose 23 by a vacuum pump (not shown), the inside of the air hole 21 becomes a vacuum, and the electronic component 13 is adsorbed to the tip portion 20 of the nozzle 19. When the rod 17 is raised by the cylinder 16 while the electronic component 13 is sucked in this way, the nozzle 19 also rises while the electronic component 13 is sucked, so that the nozzle 19 is taken out from the tray 6. Next, the orthogonal robot moves the suction head 15 to an arbitrary position on the mounting substrate (not shown), and the cylinder 16 is driven again at that position as shown in FIG. The electronic parts are mounted at predetermined positions. At this time, as shown in FIG. 3 by a vacuum pump (not shown), when air is sent from the hose 23 to the air hole 21 in the direction of the arrow, the pin 24 is pushed down by the air and the leg portion 24a of the pin 24 is moved to the nozzle. The outer surface of the electronic component 13 is pushed out from the tip portion 20 of the electronic component 13 and is pressed down. At the same time, the head portion 24c of the pin 24 closes the inner hole portion 21b of the air hole 21, so that the air is stopped and the air does not blow out from the air hole 21 at the tip of the nozzle. When the cylinder 16 is driven to raise the rod 18 in this state, the nozzle 19 also rises and the mounting of the electronic component 13 is completed. After that, the mounting of electronic components is completed by repeating the above operation. As described above, according to the embodiment, by inserting the pin 24 into the air hole 21, the pressing of the electronic component 13 and the blowing of air can be stopped, so that the electronic component can be stably and accurately mounted. . In the above-mentioned embodiment, the air hole and the pin have a three-stage structure, but the same applies to a combination of the two-stage air hole 25 and the two-stage pin 26 as shown in FIG. Of course, the effect of is shown. Further, as shown in FIG. 7, the same effect can be obtained even when the stepped portion of both the air hole and the pin is formed as an inclined surface.

[00010]

[Effect of device]

 As described above, according to the present invention, the electronic components adsorbed by the nozzle are not blown off by the air even when the nozzle is detached, so that the electronic component can be mounted in a predetermined position accurately and stably. A component mounting device can be provided.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a suction head provided in an electronic component mounting apparatus according to an embodiment of the present invention before component mounting.

FIG. 2 is a cross-sectional view of the suction head shown in FIG. 1 during component suction.

FIG. 3 is a sectional view of the suction head shown in FIG. 1 when parts are separated.

FIG. 4 is a cross-sectional view taken along the line AA of FIG.

FIG. 5 is an explanatory view showing an outline of an electronic component mounting apparatus of the present invention.

FIG. 6 is a cross-sectional view of an essential part showing another embodiment of the present invention.

FIG. 7 is a cross-sectional view of an essential part showing another embodiment of the present invention.

FIG. 8 is a sectional view of a main part of a conventional suction head.

FIG. 9 is an explanatory diagram of a conventional electronic component mounting device when components are removed.

FIG. 10 is an explanatory diagram showing an outline of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 15 suction head 16 cylinder 19 nozzle 20 tip 21 air hole 21a lower hole 21b middle hole 21c upper hole 24 pin 24a leg 24b body 24C head

Claims (1)

[Scope of utility model registration request] 1. An electronic component mounting apparatus for adsorbing a component by a nozzle held by a suction head so as to be able to move up and down And the shape of a pin having a different diameter with a head and a leg that are formed in the air hole with a diameter different from that of the upper hole having a large inner diameter. The electronic component mounting apparatus is characterized in that the diameter is larger than the diameter of the pilot hole portion and the length of the leg portion is longer than that of the pilot hole portion.