JPH0630363B2 - Chip parts mounting device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting apparatus for mounting a plurality of types of chip components having different sizes and / or different sizes by mounting heads for mounting chip components on a substrate.

BACKGROUND ART AND PROBLEMS. Chip component mounting device (chip placer) for automatically mounting chip components on a substrate that constitutes an electronic circuit.
In the past, there has been no apparatus that can mount both a square chip and a cylindrical chip in a mixed manner, and a device dedicated to a square chip or a cylindrical chip.

And even if it is a device dedicated to a cylindrical chip, for example,
As shown in the figure, it is necessary to change the coating amount of the adhesive depending on the size, but the conventional device is compatible with only one size. Besides, in the cylindrical chip and the square chip, not only the quantitative problem but also the coating shape (single-point printing, two-point printing) and the kind of adhesive must be changed as shown in FIGS. 1A to 2B. (Note that FIGS. 2A and 2B show the procedure for fixing the chip components using, for example, an ultraviolet curing adhesive.) On the other hand, from the viewpoint of circuit configuration or versatility as a device, these chips are used. There is a need to mount a mixture of parts.

On the other hand, for example, a device for mounting a chip component by a chip component mounting head having a plurality of checking heads has been invented (for example, Japanese Patent Application No. 58-5099), and chip components having different shapes and / or sizes are mixed. It was possible to mount it.

Object of the Invention The present invention, the adhesive corresponding to each of the plurality of types of chip components, a plurality of types of dispenser head that can be applied without fear of damaging the substrate even a little, is provided side by side with the chip component mounting head as described above. A chip component mounting apparatus capable of efficiently mounting a plurality of types of chip components mixed on the substrate.

Means for Solving the Problems The present invention provides a chip component mounting apparatus that mounts a plurality of types of chip components having different shapes and / or sizes on a substrate in a mixed manner by a chip component mounting head. A component supply device disposed near the component mounting position and outside the coordinate plane to supply the plurality of types of chip components to the mounting head at the supply position, and the supplied chip components are mounted on the substrate. In order to do so, a head moving mechanism that moves the mounting head between the supplied position and the mounting position, a chuck provided on the mounting head for gripping the chip component between its claws, and Move the substrate in a plane parallel to the coordinate plane to align the selected position on the substrate with the mounting position of the chip component. The first substrate positioning means is provided near the connecting agent application position existing in the coordinate plane at a predetermined distance from the mount position and outside the coordinate plane, and is used for bonding the chip component. A plurality of types of dispenser heads containing an agent, a dispenser head selection mechanism that freely selects one of the plurality of types of dispenser heads and positions it directly above the coating position, and is subsequently supplied to the substrate. Directly above the coating position, second substrate positioning means for moving the second substrate in a plane parallel to the coordinate plane to align the selected top surface position of the second substrate with the coating position. An adhesive application mechanism for ejecting the adhesive from the dispenser head and applying the adhesive to the second substrate; and a first and second substrate positioning means. A driving means for driving these substrate positioning means while maintaining a constant positional relationship, and the adhesive applying mechanism hooks the upper end of the dispenser head with a flange provided at the lower end of the adhesive applying mechanism. A suspension rod that holds the head in a suspended state, moves forward to its lower position when a downward external force is applied, and returns to its upper position by the elastic force of a compression spring when no load is applied, and this suspension rod at the upper position. And a position regulating means for holding the suspension rod at a predetermined height, and a contact plate projecting from the dispenser head contacts the second substrate while the suspension rod is being lowered by the downward external force. Once the dispenser head has been positioned by, the engagement between the upper end of the dispenser head and the flange of the suspension rod is released. Those of the mounting device of the chip component to be.

Embodiment An embodiment of a chip component mounting apparatus to which the present invention is applied will be described below with reference to the drawings.

(Schematic Description of Entire Device) First, the entire device will be described with reference to FIGS. 3 and 4. Reference numeral (1) is a mounting head for the chip parts, and a pair of chip parts feeders (2) (3) for supplying the chip parts to the checking heads of the mounting head (1) are arranged on both sides of this head. ing. Further, reference numerals (4) and (5) are dispenser heads, and the board parts (6) to which the adhesive is applied by the dispenser heads (4) and (5) and the chip parts are mounted by the mounting heads (1). And the substrate (7) are arranged side by side at a predetermined position on the pair of turntables (9) and (10) on the XY table (8). The pair of turntables 9 and 10 are simultaneously rotatable in the same direction by 90 degrees.
Supplying a new board from the standby station to the turntable (9), moving the board on which the adhesive has been applied to the turntable (10), and carrying out the board on which the chip parts have been mounted to the next process. Is performed by a carrier (not shown) provided on the front side of FIG.

In FIG. 3, reference numeral (12) is a control device storage case in which the control device is stored, reference numeral (13) is the main operation panel, and reference numeral (14) is compressed air to be described later for adjusting the amount of adhesive applied. It is a dispenser setting panel that adjusts the supply time and air pressure of the. Further, in FIG. 4, reference numeral (15) is a sub operation panel such as a manual switch, and reference numeral (16) is a drive motor for each operation of the main mounting device which will be described later and is provided on the control device storage case (12). Reference numeral (17) is a speed reducer provided on the frame and driven by a drive motor (15) via a belt (18). Reference numeral (19) is a rotary drive shaft connected to the output shaft of the speed reducer (18), and reference numeral (20) is a rotary shaft reciprocally rotated from the rotary drive shaft via the cam mechanism (21). , They are supported by a bracket (22) on the frame.

(Schematic Description of Chip Part Mounting Head and Its Operation) Next, the chip part mounting head and its operation will be described with reference to FIGS. 4 to 7B. The mounting head (1) is, as shown in FIG. 6, a holding member (25) at the central portion fixed to the support shaft (24).
And the holding member (25) at a relational position orthogonal to each other.
It is composed of two chucking heads (26) and (27) which can slide up and down without interfering with each other.
The checking heads (26) (27) are as shown in FIG. 7A.
Each has a double structure inside and outside, and a check member on the outside.
At the tip of (28), there is a fixed chuck (32) and a rotary chuck (33).
Are provided, and the chuck claws (30) and (31) at the tips thereof are configured to grasp and hold the chip component (29). A procedure rod (34) slidable with respect to the outer chuck member (28) independently of the chuck member (28) is inserted into the chuck member (28). The rotary check (33) is provided with a check head (2) as described later.
6) It automatically opens when (27) rotates 90 degrees and reaches the component supply position, and conversely, when it receives component supply and starts to rotate to the board (7) side, it closes and the chip component (29 ) Is configured to grab tightly.

Further, as shown in FIG. 6, the support shaft (24) supported by the bearing (35).
Via the links (36) (37) and the like, the rotary shaft (20) (fourth
Fig.), And the rotation of the rotation shaft (20)
It is configured to rotate back and forth by 0 degrees. Accordingly, the checking head (26) rotates in the direction of the double-headed arrow a in FIG. 5, and the checking head (27) rotates in the direction of the double-headed arrow b, respectively.
The board (7) and the chip component supply ports (38) of the chip component feeders (2) and (3) are alternately reciprocally rotated. Further, in FIG. 6, reference numerals (39) and (40) are pressing levers, and the rotary shaft (19) (fourth
(Fig.) Via a cam mechanism and push lever (39)
The chuck member (28) is pushed down by the forward rotation of the push lever (40) against the return spring, and the push rod (34) is further rotated by the forward movement of the pressing lever (40) against the return spring.
Is configured to be pushed down.

On the other hand, as shown in FIG. 4 and FIG.
(2) In each of (3), a plurality of magazines (41), which are divided according to shape and size and store chip parts, are radially provided in a radial direction, and a rotary drive device (42). Thus, the desired magazine (41) is moved to a predetermined position and positioned. Then, the chip part descending from the magazine (41) through the supply pipe (43) is moved by the turning lever (44) which is interlocked with the rotating shaft (19) or the rotating shaft (20). It is configured so as to be supplied from the component supply port (38) via the 45) between the chucking claws (30) and (31) of the checking heads (26) and (27).

With the above-mentioned structure, the checking head (27), which has been supplied with the chip parts from the chip part feeder (3) in FIG. 5, rotates 90 degrees and is placed on the substrate (7). When it comes (at the same time, the XY table moves and the desired mount position comes directly under the checking head (27)), the pressing lever (39) first presses the head of the checking member (28). . And the chuck claws (30) (31) at the tip are the substrate (7)
When it is pushed down to the position immediately before contacting with, the pressing lever (40) is actuated to press the head of the push rod (34), so that the chip part (29) is mounted on the substrate (7). (Fig. 7B). Meanwhile, during this period, the chip parts feeder
The checking head (26), which was rotating to the side of (2), is supplied with another chip part, and the checking head (2)
After 7) finishes mounting the above components and is rotated toward the component feeder (3), the chucking head (26) is then moved to the substrate.
(7) Come on and mount the following parts.

As described above, the mounting heads (1) are reciprocally rotated by 90 degrees, so that the chip parts can be alternately mounted. Moreover, the component feeders (2) and (3) have a plurality of magazines according to the shape and size of the chip parts. (41) are arranged, and the desired magazine (41) can be moved to the component supply position. Therefore, the mounting head (1) allows chip components having different shapes and / or sizes to be mixedly mounted.

(Description of Dispenser) Next, the dispenser will be described with reference to FIGS.

As shown in FIGS. 8 to 10, two support plates (49) are provided on the base plate (48), and the support plates (49) are provided.
An L-shaped bearing base (52) is fixed to the stepped portion (51) of the left cutout edge surface (50) in FIG. Two guide rods (54) are slidably inserted left and right into the two sets of slide bearings (53) provided on the bearing stand (52), and the overhang of the upper part of the bearing stand (52) is extended. On one side (55) is the air cylinder (56)
Is installed. The right ends of the two guide rods in FIG. 8 are integrally fixed to the end plate (57), and the left ends thereof are integrally fixed to the L-shaped dispenser holding member (58) (FIG. 9). There is. And the end plate (57) and bearing base
A tension spring (59) is stretched between (52) and the guide rod.
(54) is urged in the direction of arrow e.

In addition, above the two support plates (49), the support plate (49)
A fulcrum shaft (60) is provided between the fulcrum shaft (60), and a movable lever (61) on the front side and a pressing lever (62) on the rear side in FIG. Installed. One end of the bifurcated moving lever (61) is attached to the end plate (57), and the other end is attached to the turning lever (63) provided on the turning shaft (20) (Fig. 4). The elongated holes are connected to each other via mounting pins.

On the other hand, the pressing lever (62) is provided with a tension spring (64) stretched between the pressing lever (62) and the bearing base (52).
2) is rotationally biased in the counterclockwise direction indicated by arrow d. One end of the rotary shaft (1
9) It is pressed by the cam (65) provided in (Fig. 4),
A roller (67) is projectingly provided on the other end via a fulcrum pin (66). A roller (69) is projected at a predetermined position of the pressing lever (62) through a fulcrum pin (68), and a height adjusting bolt (70) above the cylinder rod (70) of the air cylinder (56) is provided. The roller (69) is configured to come into contact with 71).

The Dispenser Heads (4) (5) are as shown in FIG.
Adhesive (73) is put in the inside of a cylindrical container. That is, each of these dispenser heads (4) and (5) has a cylinder (7) having a conical through hole (74) formed in the bottom thereof.
5) and the upper lid (76) and lower lid screwed into this cylinder (75)
(77), and the upper part is suspended by a suspension rod (79) via a cylinder head member (78) interposed between the upper lid (76) and the upper end of the cylinder (75). Further, the lower lid (77) is formed with a discharge port (80) of a predetermined shape, and contact plates are provided on both sides thereof.
(81) is provided, and the lower lid (77) can be easily replaced according to the shape and / or size of the chip part. A pressure plate (82) slidable inside the cylinder (75) is provided inside the cylinder (75).

Further, an air hole (84) is formed in the center of the suspension rod (79), the upper part of which is closed and the lower part has an opening in the base. (85) is formed, and the air pipe (86) is provided in the air inlet (85).
(Fig. 8) is bonded. And hanging rod (79)
The lower part of the through hole (8
7) Slidable inside and the flange at the end
The (88) suspends the dispenser heads (4) and (5) as described above, and is supported slidably up and down in the dispenser holding member (58).

On the other hand, the dispenser holding member (58) is provided with a pressed rod (90) having a pressed portion (89) at its upper end so as to be slidable in parallel with the hanging rod (79) in the vertical direction. .
Then, the pressed rod (90) has a flange (91) (9
2) With the band (93) provided between
It is connected to (79) and slides up and down together with this suspension rod (79). Since the compression spring (94) is fitted between the flange (92) and the dispenser holding member (58), the pressed rod (90) is normally pushed upward. The position of the end plate (95) fixed to the lower end of the rod (90) is regulated by abutting against the lower end surface of the dispenser holding member (58). The end plate (95) is extended to the part of the suspension rod (79), and the suspension rod (79) is the end plate (95).
A compression spring (96) is fitted between the end plate (95) and the cylinder head member (78) of the dispenser heads (4) and (5).

Next, the operation of the dispenser configured as described above will be described mainly with reference to FIG.

When the drive motor (16) (Fig. 4) is started and the rotary shaft (19) starts to rotate, the reciprocating rotary shaft (20) starts reciprocating motion via the cam mechanism (21). As a result Dispenser Head (4)
(5) is moved to the position indicated by the solid line in FIG. 8 by the moving lever (61) while resisting the tension spring (59).
Repeat the motion of returning to the position indicated by the alternate long and short dash line by the urging force of 9). On the other hand, with each turn of the turning shaft (20), the dispenser head (4) or (5) that comes directly under the roller (67) of the pressing lever (62) is attached to the biasing spring (64). By the roller (67) at the tip of the biased pressing lever (62), it is pushed down against the biasing spring (94), and when the pushing lever (62) moves back against the biasing spring (64), The urging spring (94) repeats the returning motion.

Therefore, if the timing between the movement of the moving lever (61) and the movement of the pressing lever (62) is appropriately determined, for example,
In the figure, when the moving lever (61) rotates forward and the dispenser head (4) moves from the position indicated by the one-dot chain line to the position indicated by the solid line, the pressing lever (62) moves forward to the position indicated by the two-dot chain line. Press down on the dispenser head (4). At this time, when the contact plate (81) at the tip of the dispenser head (4) shown in FIG. 11 contacts the substrate (6), only the suspension rod (79) resists the compression spring (96). Since it is pushed down, if the spring constant of the compression spring (96) is set to a small value, the substrate (6) will not be loaded more than the dead weight of the dispenser head (4), which will damage the substrate (6). There is no fear. In addition,
The end plate (95) integrated with the suspension rod (79) and the compression spring (96) interposed between the dispenser heads (4) and (5) are suspended from the suspension head (79). Since it is for imparting stability to the dispenser heads (4) and (5), its spring constant is generally small. Then, a valve (not shown) of the air pipe (86) is opened and compressed air is sent from the air hole (84) to the upper part of the cylinder (75), so that the pressing plate (82) is pressed by this compressed air, The adhesive (73) stored therein is applied onto the substrate (6) through the discharge port (80). The coating amount and coating shape (single-point printing, double-point printing) at this time differ depending on the size and shape of the discharge port, but even with the same size discharge port, the air pressure of the compressed air to be supplied and the supply time are adjusted. By doing so, it is possible to delicately control. When it is not necessary to apply the adhesive by selection, the cylinder rod (76) of the air cylinder (56) rises to a predetermined position, and the height adjusting bolt (71) at the upper end of the cylinder rod (76) moves to the middle of the pressing lever (62). The rollers (69) come into contact with the rollers to form stoppers, which prevent the dispenser heads (4) and (5) from being pushed down. Therefore, no adhesive is applied even when the dispenser heads (4) and (5) are in place.

On the other hand, as described above, the rotary shaft (19) is interlocked with the 90-degree reciprocating rotary motion of the chip component mounting head (1), and the rotary shaft (2
In (0), the pressing of the checking heads (26) and (27) to the board (7) and the mounting movement of the chip parts on the board (7) are linked. Therefore, the movement of the dispenser head (4) (5) can be made to correspond to the movement of the mounting head (1) in a one-to-one manner, so that it can be adapted to the position corresponding to the mounted chip component. The adhesive can be applied in advance.

EFFECTS OF THE INVENTION As described above, according to the present invention, the component supply device for supplying the chip component to the mounting head is arranged near the chip component mounting position determined by the plane coordinates and outside the coordinate plane. Therefore, the device can be made compact by making the structure three-dimensional.

Further, since the component feeder has a structure which occupies a position near the chip component mounting position as described above and supplies the chip component to the mounting head at the supply position, the mounting time per chip component can be shortened. The mounting accuracy can be improved.

Further, since the mounting head is provided with a chuck so that the chip component is grasped between the claws of the chuck,
Even if the shape and / or the size of the mounted chip component is variously changed, it is not necessary to provide a plurality of types of mounting heads unlike the conventional mounting head utilizing the suction action.
Therefore, the structure of the device is simplified.

Further, a plurality of types of dispenser heads for applying an adhesive for adhering the chip component to the substrate are provided on the coordinate plane in the vicinity of the adhesive application position which is a predetermined distance from the chip component mounting position and on the coordinate plane. Since it is provided outside the device, the device can be made compact by the three-dimensional structure.

Also, since the dispenser head contains the adhesive, it is not necessary to move the dispenser head to the adhesive replenishment position in order to replenish the adhesive. Therefore, simplification of the device and improvement of the adhesive application accuracy can be expected.

Also, a plurality of types of dispenser heads occupy positions near the adhesive application position as described above, and
Since one of them is selected and positioned directly above the adhesive application position, the adhesive application time per application can be shortened and the application accuracy can be improved.

Further, the mounting of the chip component and the application of the adhesive are performed not only by positioning the mounting head and the dispenser head at the mounting position of the chip component and the application position of the adhesive, which are fixed points, respectively, but are also selected on the substrate. The mounting position and the adhesive application position of the chip component are also adjusted so as to match the mounting position and the application position, respectively. Therefore, the mounting head and the dispenser head are respectively mounted on the chip component and the adhesive application position. Or it becomes possible to arrange in the vicinity.

Therefore, as will be described later, by moving the mounting head and the dispenser head, which tend to become large in weight, and moving the substrate, which is lighter than these, the mounting accuracy of the chip component and the coating accuracy of the adhesive agent can be improved. Can be increased. That is, considering the mounting head together with the chip component feeder, and considering that the dispenser head requires a plurality of types and each has a built-in adhesive, these masses should be mounted. This is because it tends to increase as the number of types of chip parts increases.

Next, the first substrate positioning means for aligning the selected position on the substrate with the mounting position of the chip component, and the selected position on the second substrate that is subsequently supplied to the substrate are bonded to each other. Since the second substrate positioning means for adjusting to the agent application position is driven by the driving means while keeping the mutual positional relationship constant, a large amount of substrates in which the same chip components are mounted at the same positions are produced. In this case, the information processing required for positioning the substrate can be simplified and the operation of the device can be simplified. Further, it becomes possible to improve the accuracy of selecting the mounting position of the chip component.

Further, the configurations of the chip component mounting head and the dispenser head described above can be easily adapted to a change or an increase in the types of chip components to be mounted. Therefore, the information processing is simple and extremely practical.

In addition, since the height of the suspension rod at the upper position is always maintained at the predetermined height by providing the position regulating means, it becomes easy to accurately apply a downward external force to the suspension rod. It becomes easy to smoothly perform an operation such as application of an adhesive on a substrate that is successively supplied.

Also, since the dispenser head is only suspended by the suspension rod, when applying the adhesive, only the load of the dispenser head is applied to the substrate, and the substrate may be damaged by contact with the contact plate. There is no.

[Brief description of drawings]

FIGS. 1A and 2B are enlarged explanatory views showing that the application amount and the application shape of the adhesive are different depending on the shape and size of the chip part, respectively, for the cylindrical chip and the square chip, of which 2A FIG. 2 and FIG. 2B are explanatory views showing the procedure of fixation when an ultraviolet curing adhesive is used, FIGS. 3 to 1
FIG. 1 shows an embodiment of a chip component mounting apparatus to which the present invention is applied. FIG. 3 is a front view showing the entire apparatus, FIG. 4 is a plan view of FIG. 3, and FIG. The front view showing the relationship between the component mounting head and the component feeder, FIG. 6 is a partial perspective view for explaining the operation of the mounting head, and FIGS. 7A and 7B are partial detailed sectional views of the mounting head tip portion. FIG. 8 is a front view of the chip parts before and after mounting, FIG. 8 is a front view of the dispenser, FIG. 9 is a plan view of FIG. 8, FIG. 10 is a perspective view of a bearing stand, and FIG. 11 is FIG. It is a XI-XI line arrow sectional view. In the reference numerals used in the drawings, (1) ... chip part mounting head (2) (3) ... chip part feeder (4) (5) ... dispenser head (6) (7) ... substrate ( 8) ... XY table (driving means) (9) ... turntable (second substrate positioning means) (10) ... turntable (first substrate positioning means) (20) ... rotating shaft (dispenser) (Selection mechanism) (24) …… Spindle (head moving mechanism) (26) (27) …… Chucking head (29) …… Chip part (30) (31) …… Chuck claw (37) …… Link ( Head moving mechanism) (39) (40) …… Pressing lever (head moving mechanism) (54) …… Guide groove (dispenser selection mechanism) (58) …… Dispenser holding member (position regulation means) (59) …… Pulling Spring (dispenser selection mechanism) (61) …… Movement lever (dispenser selection mechanism) (62) …… Pressing lever (adhesive application mechanism) (63) …… Rotating lever (dispenser selection mechanism) (65) …… cam (adhesive application mechanism) (73) …… adhesive (76) …… upper lid (upper end) (77) …… lower lid (78) …… cylinder Head member (upper end) (79) …… Suspension rod (81) …… Abutment plate (88) …… Flange (90) …… Pressed rod (suspension rod) (94) …… Compression spring (95) ) ... End plate (position control means).

 ─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-57-45993 (JP, A) JP-A-54-144960 (JP, A) JP-A-58-27328 (JP, A) JP-A-56- 91439 (JP, A) Actual development Sho 57-21070 (JP, U)

Claims (1)

[Claims] 1. The shape and / or shape of a chip component mounting head.
Alternatively, in a chip component mounting apparatus that mounts a plurality of chip components of different sizes in a mixed manner on a board, the chip component mounting device may be disposed near the chip component mounting position determined by the plane coordinates and outside the coordinate plane. A component feeder for supplying the chip component to the mounting head in the supply position, and the mounting head for mounting the supplied chip component on the substrate between the supply position and the mounting position. A head moving mechanism for moving, a chuck provided on the mounting head for gripping the chip component between its claws, and a substrate for aligning a selected position on the substrate with a mounting position of the chip component. A first board positioning means for moving the board in a plane parallel to the coordinate plane; A plurality of types of dispenser heads that are provided in the vicinity of the adhesive application position existing in the surface and outside the coordinate plane, and that incorporate a plurality of types of dispenser heads that incorporate an adhesive for bonding the chip components, A dispenser head selection mechanism for freely selecting one from the inside and positioning it directly above the coating position, and for aligning the selected upper surface position of the second substrate subsequently supplied to the substrate with the coating position. A second substrate positioning means for moving the second substrate in a plane parallel to the coordinate plane, and the adhesive is discharged from a dispenser head located directly above the coating position to coat the second substrate. While the relative positional relationship between the adhesive applying mechanism and the first and second substrate positioning means is kept constant, these substrate positioning means are driven. The adhesive applying mechanism is provided with a driving means, the upper end of the dispenser head is hooked by a flange provided at the lower end of the adhesive applying mechanism, and the dispenser head is suspended and held, and when the downward external force is applied, the adhesive is applied to the lower position. And a suspension rod that moves back and returns to its upper position by the elastic force of the compression spring when there is no load, and a position restricting means for holding the suspension rod at a predetermined height at the upper position, When the dispenser head is brought into contact with the second substrate by the contact plate protruding during the lowering of the suspension rod by the downward external force, thereby positioning the dispenser head, thereafter, the dispenser head of the dispenser head is positioned. A chip component mounting device in which the engagement between the upper end portion and the flange of the suspension rod is released.