JPH06320892A - Information card and manufacture thereof - Google Patents

Abstract

PURPOSE:To delete the number of components for constituting an information card and to simplify manufacture and assembling. CONSTITUTION:An information card is formed of a module board 1 which places various components 2 such as an IC, etc., and a front surface frame 4 and a rear surface frame 5 respectively adhered to front and rear surface sides of the board 1 to reduce number of the components and to delete assembling man-hour. The frames 4, 5 are molded integrally with resin with peripheral frames 6, 9 extended along a periphery of the board 1, reinforcing frames 7, 10 extended between the frames 6, 9, and panels 8 covering the frames 6, 9 and the frames 7, 10. The panels are reinforced with reinforcing members to be reduced in thickness, and formed of resin to reduce its weight.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an information card such as an IC card, and more particularly to an information card with a reduced number of constituent parts.

[0002]

2. Description of the Related Art The structure of a conventional card of this type is shown in a partially exploded perspective view of FIG. 5 and a longitudinal sectional view of an assembled state in FIG. Module board 3 composed of printed wiring board
Various ICs and electronic components 32 are mounted on the connector 1, and a connector 33 is mounted on one side thereof by soldering or the like. On one side surface of this module substrate 31, various mounted components 32 are mounted.
A thick plate-shaped frame 34 having windows and recesses for protecting the above is covered and integrated with screws 35. The other side surface of the module substrate 31 is covered with a thin plate-like spacer 36 for insulating and protecting the circuit wiring, and is attached by a double-sided adhesive sheet (not shown). On top of that, the frame 3
Surface cover 37 in which a metal plate is processed so as to cover the surface of 4
By using a double-sided adhesive sheet (not shown), and
A back cover 38 made of a metal plate is attached in the same manner so as to cover the other surface of the six spacers.

[0003]

In the structure of this conventional information card, in addition to the module substrate 31, the frame 34, the spacer 36, the front surface cover 37, the rear surface cover 38, and the double-sided adhesive sheet (not shown) are used as the components. Since it is required, there is a problem that the number of parts increases. Moreover, in order to assemble this, the module substrate 31 is attached to the frame 3
4 needs to be fixed with screws 35, and the spacer 36 and the covers 37 and 38 on the front and back surfaces need to be attached to each other with a double-sided adhesive sheet, resulting in a large number of assembling steps, resulting in high cost.

On the other hand, in the case of manufacturing such an information card, for example, in the case of manufacturing an information card in which the ICs mounted on the module board 31 and the electronic parts 32 are different, the design of the windows and recesses is changed according to the module board. Frame 3
It is sufficient to form only the spacer 4 and the spacer 36, and the covers 37 and 38 on the front and back sides can use common parts for various information cards, which is an advantage that parts can be shared. However, although the frame 34 and the spacer 36 are formed by molding a resin material,
7 and 38 are thin plates, while using a metal plate to secure the necessary strength, it is necessary to manufacture them separately from the frame and spacers, which causes the manufacturing process to become complicated. In addition, it causes an increase in card weight. By the way, since the thickness of the information card is specified to be 3.3 mm or less by the standard, it is necessary to form the front and back covers with a thickness of about 0.1 mm, and secure the necessary strength for these front and back covers. In order to do so, the fact is that each cover must be formed of a metal material. It is an object of the present invention to provide an information card and a method of manufacturing the same that reduce the number of parts and simplify the manufacturing and assembly.

[0005]

The information card of the present invention comprises:
It is composed of a module board on which various parts such as ICs are mounted, and a front surface frame and a back surface frame which are adhered to the front surface side and the back surface side of the module board to cover the module board, respectively. A peripheral frame part extending along the peripheral frame part, a reinforcing frame part extending between the peripheral frame parts, and a panel part covering the peripheral frame part and the reinforcing frame part are integrally formed of a resin material. . Here, an opening is provided on one side of the peripheral frame portion, recesses are formed at both ends facing the opening, and ear portions projecting at both ends of the connector mounted on the module board are formed in the recesses. It may be configured to be fitted. Further, in the method for manufacturing an information card of the present invention, when manufacturing the front frame and the back frame in which the peripheral frame portion, the reinforcing frame portion, and the panel portion are integrally molded with a resin material, a molding metal for resin molding these frames is used. The mold has a core structure, the reinforcing frame portion is molded by this core, and this core can be replaced with a core having a different structure.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a partially exploded perspective view of an embodiment of the present invention.
An IC is mounted on the module substrate 1 composed of a printed wiring board.
And a component 2 such as various electronic components are mounted, and an elongated connector 3 along the width direction of the module substrate 1 is mounted on one side thereof by soldering or the like. The connector 3 is integrally formed with ears 3a protruding outward at both ends thereof, and these ears 3a are adapted to be fitted into recesses provided in front and back frames, which will be described later. A front surface frame 4 is covered on one side surface of the module substrate 1, and a back surface frame 5 is covered on the other side surface thereof. The front surface frame 4 and the back surface frame 5 are integrally formed of a resin material. .

The surface frame 4 has a peripheral frame portion 6 formed in a U shape along the periphery of the module substrate 1, a reinforcing frame portion 7 extending between the peripheral frame portions 6, and these peripheral frame portions. 6
And a surface panel portion 8 formed on the entire surface including the reinforcing frame portion 7, which are integrally formed by resin molding. Here, it goes without saying that the reinforcing frame portion 7 functions as a rib for reinforcing the front panel 8, but at a location where it does not interfere with the mounting component 2 mounted on the module substrate 1 and the connector 3. The peripheral frame portion 6 and the reinforcing frame portion 7 are formed to form a space for receiving the mounting component 2 and the connector 3. Further, at both ends of the opened portion on one side of the peripheral frame portion 6, concave portions 6a into which the surface side portions of the ear portions 3a of the connector 3 are fitted are formed, respectively. The back frame 5 is also formed in substantially the same manner as the front frame 4, and the peripheral frame part 9, the reinforcing frame part 10, and the back panel part 11 are integrally formed of resin,
Recesses 9a into which the back side portions of the ears 3a of the connector 3 are fitted are formed at both open ends of the peripheral frame 9 on one side.

[0008] The front and back frames 4, 4 having such a configuration
5 is covered on the front surface side and the back surface side of the module substrate 1, respectively, and then adhered to the front surface and the back surface of the module substrate 1 by double-sided adhesive sheets (not shown) arranged in the peripheral frame portions 6 and 9, respectively. An information card is completed by forming the outer cover of the module substrate 1. FIG. 2 is a vertical sectional view of the completed information card. Therefore, in this information card, the components are the module substrate 1, the surface frame 4,
Since there are three points on the back frame 5, the number of parts can be significantly reduced. Further, when assembling it, it is only necessary to attach the frames 4 and 5 to the module substrate 1, and the number of assembling steps can be greatly reduced.

In the assembled information card, the ears 3a provided at both ends of the connector 3 are fitted in the recesses 6a and 9a of the frames 4 and 5, respectively, so that both ends of the connector 3 are connected to the frames 4 and 5. Hold firmly by 5 and connector 3
Further, it is possible to prevent the operating force for attaching and detaching an external connector (not shown) from affecting the module substrate 1 via the connector 3. Further, the bonded frames 4 and 5 cover the front surface side and the back surface side of the module substrate 1 to form the outer cover of the card, and the peripheral frame portions 6 and 9 and the reinforcing frame portions 7 and 10 provided respectively. Functioning as a rib of each panel portion 8 and 11, the strength can be increased even when each panel portion 8 and 11 is thinly made of a resin material, and the conventional cover made of a metal material is used. The weight can also be reduced in comparison.

On the other hand, in this configuration, when configuring an information card using different module boards, that is, configuring an information card using module boards in which the types of mounting components to be mounted and the arrangement thereof are different, for example, 3 shows an example of the front surface frame 4A having a different configuration, the peripheral frame portion 6 and the front surface panel 8 are common, and only the reinforcing frame portion 7A may be formed to be different front surface frame 4A. In this case,
As shown in FIG. 4, a part of a molding die 21 for resin-molding the surface frame 4A is constituted by a core 22, and the reinforcing frame 7A is molded by the core 22. It is possible to form a surface frame which is different only in the reinforcing frame portion simply by exchanging the child 22 with one having a different structure. This also applies to the back frame.

Therefore, various front and back frames used for various information cards can be manufactured by using the same molding die, and the manufacturing can be simplified and the cost can be reduced. It is needless to say that the specific examples of the module substrate and the front and back frames are appropriately changed according to the information card to be manufactured.

[0012]

As described above, according to the present invention, the front surface frame and the rear surface frame are bonded to the front surface and the rear surface side of the module substrate, respectively. Further, since the panel portion is integrally formed of resin, the number of parts can be reduced and the number of assembling steps can be reduced. Further, the front frame and the rear frame can be formed by integrally molding the panel portion as a cover with resin, which enables weight reduction. Furthermore, the mold for molding the front surface frame and the rear surface frame has a core structure, and by molding the reinforcing frame portion with this core, the molds can be shared when manufacturing frames of information cards of different types, It is possible to realize simplification of manufacturing and cost reduction.

[Brief description of drawings]

FIG. 1 is a partially exploded perspective view of an embodiment of an information card of the present invention.

FIG. 2 is a vertical sectional view of the information card of FIG. 1 in an assembled state.

FIG. 3 is a perspective view of a surface frame used for different information cards.

FIG. 4 is a schematic perspective view in which a part of a mold for molding a surface frame is disassembled.

FIG. 5 is a partially exploded perspective view of a conventional information card.

6 is a vertical cross-sectional view of the information card of FIG. 5 in an assembled state.

[Explanation of symbols]

 1 Module Board 2 Mounted Components 3 Connector 4 Front Frame 5 Back Frame 6,9 Peripheral Frame 7,10 Reinforcement Frame 8 Front Panel 11 Back Panel

Claims (3)

[Claims] 1. A module substrate on which various components such as an IC are mounted, and a front frame and a back frame which are adhered to the front and back sides of the module substrate to cover the module substrate, respectively. The frame includes a peripheral frame portion extending along the periphery of the module board, a reinforcing frame portion extending between the peripheral frame portions, and a panel member covering the peripheral frame portion and the reinforcing frame portion. An information card characterized by being integrally molded with. 2. An opening is provided on one side of the peripheral frame portion,
The information card according to claim 1, wherein recesses are formed at both ends facing the opening, and ears protruding from both ends of a connector mounted on the module board are fitted into the recesses. 3. A module substrate on which various components such as ICs are mounted, and a front frame and a back frame which are adhered to the front and back sides of the module substrate to cover the module substrate, respectively. The frame includes a peripheral frame portion extending along the periphery of the module board, a reinforcing frame portion extending between the peripheral frame portions, and a panel member covering the peripheral frame portion and the reinforcing frame portion. At the time of manufacturing the information card integrally molded with, the molding die for resin-molding the front surface frame and the back surface frame has a core structure, and the reinforcing frame portion is molded by this core, and the core has a different structure. A method for manufacturing an information card, characterized in that the core can be replaced.