JPH0373396A - Ic card - Google Patents

Abstract

PURPOSE:To prevent breakdown and malfunction of an electron part by preventing static electricity from charging by a method wherein a circuit substrate on which an electron part is mounted is covered by a resin film having an insulation property and a thermal contraction property, and an armoring of a circuit substrate is integrally formed with a resin in a state in which this resin film is thermally contracted. CONSTITUTION:A thermal contraction tube 4 as a resin film coating all surfaces of a circuit substrate 2 on which electron parts 5 to 8 are mounted has an insulation property, and cylindrical one is applied onto the circuit substrate 2 to be thermally contracted. A complicate irregular surface state on the circuit substrate 2 can be finished to a smooth surface state. Therefore, no void is generated and even though armoring resin 3 is moulded shrinkage due to defect molding is not generated on an armoring surface. Further, since injection gaps 1c, 1d are filled with a thermal contraction tube 4, jutting out or the like of the resin to a connecter contact part can be prevented.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to the tM of an IC card equipped with electronic components such as an IC.
It is related to construction.

[Conventional technology]

FIG. 6 is a perspective view showing a first example of a conventional IC card;
The figure is an exploded perspective view of the same, and FIG. 8 is a sectional view taken along the line ■-■ in FIG. 6. In these figures, (2) is a circuit board, and electronic components such as IC (9 to (8), (12)
, (13) are mounted, and a connector (1) for conducting with an external device is installed.

This circuit board (2) is housed in a base body 00 and a base body (11) that are molded and manufactured from resin, and these base bodies 00 and (11) are bonded to each other with adhesive or the like. It is assembled. Here, in order to have a predetermined thickness dimension as an IC card, the base body α0) and the base body (11) are equipped with electronic components (51 to (8), (12>) mounted on the circuit board (2), A recess-shaped digging part (IOa) at a position corresponding to (13), (10
b), (10c).

(lod) and (lla), (llb), (Il
c) and (I ld) are provided, and electronic components (51 to 6) and the like are accommodated in these spaces.

FIG. 9 is a perspective view showing a second example of a conventional IC card;
Figure O is an exploded perspective view of the same, and Figure 11 is the Xr-X diagram of Figure 9.
It is a sectional view along the I line. <20) and (2)> are panels made of metal plates or foils, and each has a base (1 (1, (111<7)), an adhesive (22) on the outside,
(23) is bonded to the base 001. (15) is a metal spring, which is attached to the base 001. A through hole (1
0e), (Ile) and 5-car panel (20)
, (2)> are electrically connected.

In this way, a metal panel (2
0) and (2)) and are connected by a spring (15) to have the same potential, thereby taking measures against electrostatic charging. That is, since the base aω (11) is an insulator, it is easily charged with ffjl electricity, and the electrical components (51 to 51) such as ICs mounted on the circuit board (■) are easily charged.
f8], (+2), (+31) or add noise to the electrical signal, causing it to malfunction, so by covering these with a panel with the same potential <20), (2)), the above This prevents problems such as.

[Problem to be solved by the invention]

Conventional IC cards are configured as described above, and the base Q
Since the OI and the base (11) are made of resin molded products, the types of electronic components such as ICs that can be mounted differ depending on the type of circuit board (2), and different bases may be used depending on the type of circuit board (2). It was necessary to prepare the spacer and the base (I1> by resin molding. Also, in order to store the circuit board (2),
It requires a pair of bases 00) and (11), and it also requires work to join and assemble these bases <10) and (11> by some method, and this joining may be incomplete and cause problems. There were problems such as:

In addition, as shown in the second example of the prior art, as a countermeasure against static electricity, a metal plate or metal foil panel (201, (2)) that is not easily charged is attached to the surface of the IC card exterior, and a panel (201, (2)) on the front and back is attached. A spring (15) is installed as a contact to bring (20) and (2+) to the same potential. As a result, the 1llI structure was complicated and the assembly work was extremely troublesome.

This invention was made to solve the above-mentioned problems, and does not require multiple types of base material as parts for each type of circuit board, eliminates the work process of joining the bases during assembly, and makes it possible to The purpose of the present invention is to obtain an IC card that eliminates the defects caused by.

Furthermore, the object is to obtain an IC card for static electricity countermeasures with a simple structure that does not require a metal panel, a contactor (spring), or an adhesive for bonding the panel used to prevent static electricity. .

[Means to solve the problem]

The IC card according to the present invention has a circuit board on which electronic components are mounted, covered with a heat-shrinkable resin film, and the outer casing is integrally molded with resin.

In addition, a circuit board on which electronic components are mounted is covered with a heat-shrinkable resin film, and the outer casing is integrally molded with a conductive resin.

In addition, a circuit board on which electronic components are mounted is covered with a heat-shrinkable resin film, a conductive layer is provided on the outer surface of the film, and an exterior is integrally molded with resin on top of the conductive layer.

[For production]

According to the IC card of this invention, the circuit board is integrally molded with the insert, so it can be used with different types of circuit boards by preparing only one type of resin molding mold that matches the external shape of the IC card. In addition, by covering the resin-molded special circuit board with a heat-shrinkable resin film, it prevents molding defects during exterior resin molding.

Furthermore, by integrally molding a conductive resin for the exterior, static electricity can be prevented without complicating the structure.

Further, by providing a conductive shielding layer on the outer surface of the resin film, it is possible to prevent internal electronic components from being destroyed or malfunctioning.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a perspective view of the IC card according to the present embodiment when the assembly is completed, and FIG. 2 is a cross-sectional view taken along the line ■--■ of FIG. 1. In these figures, (11, (2),
(51-(81 is the same as the conventional example shown in FIGS. 6 to 8, so the explanation is omitted.(4) is the electronic component (51-(81)
) is a heat shrink tube as a resin film that covers the entire surface of the circuit board (2) on which the circuit board (2) is mounted, has insulating properties, and has a cylindrical shape as shown in Figure 3 (A). is placed on the circuit board 12) and heat-shrinked.

Next, the operation will be explained. Now, an IC card in the case of integral resin molding without using the heat shrink tube (4) is shown in the sectional view of FIG. 4, and will be explained by comparison with this.

That is, as shown in Fig. 4, if the exterior is resin-molded without using heat shrink tube A), electronic components such as ICs (9 to (a) installed in large numbers on the circuit board (2) and Because the surface has unevenness and narrow gaps caused by soldering, etc., during resin molding, air is trapped in such areas and the exterior resin (3) is not completely filled, resulting in voids (9a).
) to (9g) are generated, and correspondingly, the exterior resin (3)
Sink marks (3c) to (3h), which result in poor molding, occur on the surface of the package, impairing the appearance of the exterior surface. At the same time, due to the fluidity of the resin during molding and the pressure during molding, the press-fit gaps (lc), (l
d) Exterior resin (3) protrudes from 3a).

(3b) is generated and buries the contacts (la) and (lb), causing connection failure and electrical contact failure. However, as shown in Figure 2, by covering the entire surface of the circuit board (■) with a cylindrical heat shrink tube (4) and shrinking it by heating in advance, the complex uneven surface on the circuit board (2) can be removed. The surface can be finished with a smooth surface.Therefore, no voids will occur, and even when the exterior resin (3) is molded, there will be no sink marks due to molding defects on the exterior surface, and the heat shrink tube (4) can be press-fitted. Since the gaps (Ice, (Id)) are closed, it is possible to prevent the resin from spilling out into the connector contact area.

In addition, in the above embodiment, a cylindrical heat shrink tube (4) was shown as the resin film covering the surface of the circuit board (2), but the third embodiment
As shown in Figure (B), a bag-shaped heat shrink tube (4) with one cylindrical end sealed may be used. During heat shrink, the air existing in the bag of the heat shrink tube A] is removed from the connector (1). ) Press-fit gaps (Ice, (Id) of contacts (la), (Ib)
), it has the same effect as when using a cylindrical heat shrink tube (4).

Further, as an IC card according to another embodiment of the present invention,
In the same figure as in Figure 2, the exterior resin (3)
By integrally molding using conductive resin as
Provides antistatic effect. In order to effectively prevent this static electricity, the volume resistivity of the conductive resin is set to 1011ΩCf.
It is preferable to set it to f1 or less.

FIG. 5 is a sectional view showing an IC card according to still another embodiment of the present invention, which is similar to the case of FIG. 2, but with a conductive shielding layer on the outside of the heat shrink tube (4) 16
) is provided. In this example, after heat shrinking the heat shrink tube (4) covering the circuit board (2),
A conductive material is adhered to the entire outer surface to form a shielding layer (16), and then an exterior resin (3) is integrally molded. The locations where the shielding layer (16) is provided have the same potential, so even if the outer surface of the exterior resin (3) is charged, the internal electronic components f51-8) are prevented from being destroyed or malfunctioning.

In this example, the shielding layer (16) was formed on the surface of the heat-shrinkable tube (4) after the heat-shrinkable tube (4) was heat-shrinked. The conductive part of the tube may be used as the shield layer (16).Also, the shield 1 (161) was provided on the entire outer surface of the heat shrink tube (4), but it was not charged electrically without any problem. Partially covered with a shielding layer (except for areas where protection is not required)
16) may be provided.

〔Effect of the invention〕

As described above, according to the present invention, when assembling an IC card, the circuit board is covered with, for example, a heat-shrinkable resin film to make the surface smooth, and then the insert is integrally molded with resin, which improves the appearance. In addition to obtaining an exterior with no molding defects,
Unlike the conventional method, there is no need for many types of bases for each type of circuit board, and the work of joining and assembling the bases can be omitted, which has the effect of eliminating defects caused by the joining work.

In addition, we used conductive resin for the exterior molding, and molded the circuit board covered with a resin film into the insert, which prevents static electricity from being mounted on the circuit board. This has the effect of preventing destruction and malfunction of electronic components such as ICs.

Further, since a shielding layer is provided on the outer surface of the resin film, it is effective to prevent electronic components from being destroyed or malfunctioning due to charging.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an IC card according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line II-II in FIG. 1, and FIG.
The figure is a perspective view of a heat-shrinkable tube used in the IC card shown in FIG. 2, FIG. 4 is a sectional view of an IC card molded with resin without using a heat-shrinkable tube, and FIG. 5 is according to another embodiment of the present invention. A sectional view of an IC card, FIG. 6 is a perspective view showing a first example of a conventional IC card, FIG. 7 is an exploded perspective view thereof, and FIG.
The figure is a sectional view taken along the line ■-■ in Figure 6, Figure 9 is a perspective view showing a second example of a conventional IC card, Figure 1O is an exploded perspective view thereof, and Figure 11 is the same as in Figure 9. It is a sectional view along the XI-XI line. In these figures, (2) is a circuit board, G) is an exterior resin, S] is a heat shrink tube, +51 to (8) are electronic components, and (16) is a shielding layer. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (2)

[Claims] (1) A circuit board equipped with electronic components is provided, the circuit board is covered with a resin film having insulating properties and heat-shrinkable properties, and the exterior of the circuit board is integrated with the resin while the resin film is heat-shrinked. An IC card characterized by being chemically molded. (2) The IC card according to claim 1, wherein the exterior is integrally molded from a conductive resin. (3) The IC card according to claim 1, wherein a conductive shielding layer is provided on the outer surface of the resin film.