JPH0643143Y2 - 半導体ウエハと薄板を接着する接着剤の接着力制御装置 - Google Patents

半導体ウエハと薄板を接着する接着剤の接着力制御装置

Info

Publication number
JPH0643143Y2
JPH0643143Y2 JP1985190304U JP19030485U JPH0643143Y2 JP H0643143 Y2 JPH0643143 Y2 JP H0643143Y2 JP 1985190304 U JP1985190304 U JP 1985190304U JP 19030485 U JP19030485 U JP 19030485U JP H0643143 Y2 JPH0643143 Y2 JP H0643143Y2
Authority
JP
Japan
Prior art keywords
adhesive
container
thin plate
work
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985190304U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62101835U (th
Inventor
栄一 入江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP1985190304U priority Critical patent/JPH0643143Y2/ja
Priority to PH34571A priority patent/PH25206A/en
Priority to EP86117185A priority patent/EP0226949B1/en
Priority to DE8686117185T priority patent/DE3686314T2/de
Priority to US06/940,328 priority patent/US4718967A/en
Priority to KR1019860010635A priority patent/KR900004688B1/ko
Publication of JPS62101835U publication Critical patent/JPS62101835U/ja
Priority to SG1063/92A priority patent/SG106392G/en
Application granted granted Critical
Publication of JPH0643143Y2 publication Critical patent/JPH0643143Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
JP1985190304U 1985-12-12 1985-12-12 半導体ウエハと薄板を接着する接着剤の接着力制御装置 Expired - Lifetime JPH0643143Y2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP1985190304U JPH0643143Y2 (ja) 1985-12-12 1985-12-12 半導体ウエハと薄板を接着する接着剤の接着力制御装置
PH34571A PH25206A (en) 1985-12-12 1986-12-09 Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate
DE8686117185T DE3686314T2 (de) 1985-12-12 1986-12-10 Vorrichtung zur bestimmung der haftkraefte eines klebstoffes zwischen einem halbleiter und seinem substrat.
EP86117185A EP0226949B1 (en) 1985-12-12 1986-12-10 Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate
US06/940,328 US4718967A (en) 1985-12-12 1986-12-11 Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate
KR1019860010635A KR900004688B1 (ko) 1985-12-12 1986-12-12 반도체 웨이퍼와 박판을 접착하는 접착제의 접착력 제어장치
SG1063/92A SG106392G (en) 1985-12-12 1992-10-13 Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985190304U JPH0643143Y2 (ja) 1985-12-12 1985-12-12 半導体ウエハと薄板を接着する接着剤の接着力制御装置

Publications (2)

Publication Number Publication Date
JPS62101835U JPS62101835U (th) 1987-06-29
JPH0643143Y2 true JPH0643143Y2 (ja) 1994-11-09

Family

ID=31143400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985190304U Expired - Lifetime JPH0643143Y2 (ja) 1985-12-12 1985-12-12 半導体ウエハと薄板を接着する接着剤の接着力制御装置

Country Status (1)

Country Link
JP (1) JPH0643143Y2 (th)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850164B2 (ja) * 1977-04-01 1983-11-09 日立化成工業株式会社 表面保護方法

Also Published As

Publication number Publication date
JPS62101835U (th) 1987-06-29

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