JPH0645396A - Film carrier semiconductor device - Google Patents

Abstract

PURPOSE:To provide a film carrier semiconductor device in which its cost can be reduced, and quality at the time of mounting and after mounting can be improved. CONSTITUTION:Leads 3b protruding into a device hole 10b of a film carrier tap 1b is connected directly to an aluminum electrode pad 8b of a semiconductor chip 7b. A surface of the chip outside a line for connecting an outer periphery of the pad 8b of the chip 7b is covered with a heat resistant insulation film 1b. Thus, its cost can be reduced, and deformation of the lead 3b, contact of the lead with the chip can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier semiconductor device, and more particularly to a bumpless film carrier semiconductor device manufacturing method.

[0002]

2. Description of the Related Art A conventional method of manufacturing a semiconductor device by a film carrier method is a sprocket hole 2 for carrying and positioning as shown in a plan view of FIG. 5 and a sectional view of FIG.
a and a metal foil of copper or the like on an insulating film of polyimide or the like having a device hole 10a which is an opening portion into which the semiconductor chip 7a is inserted, and the metal foil is etched to form a lead 3a having a desired shape and for electrical selection. The film carrier tape 1a having the pads 5a formed thereon and the semiconductor chip 7a having the bumps 11a, which are metal projections, previously provided on the electrode terminals are prepared. Inner lead bonding is performed with 11a by a thermocompression bonding method or a eutectic method, and electrical selection and a bias test are performed in the state of the film carrier tape to complete the film carrier semiconductor device.

In the method of manufacturing the film carrier semiconductor device as described above, the bonding can be performed at one time regardless of the number of leads, so that the speed is fast, and since the film carrier tape is used, the assembling such as bonding and the automation of the electric sorting operation are performed. However, it has advantages such as excellent mass productivity.

[0004]

In the conventional film carrier semiconductor device described above, it is necessary to form bumps on the electrodes of the semiconductor chip, and the bump formation for forming the bumps is performed mainly in the wafer state by the electrolytic plating method. It has the disadvantage of high cost.

In addition, in recent semiconductor devices, the number of leads is remarkably increased with the increase in the capability thereof, and the leads for inner lead bonding are thin and thin. Due to lead deformation, contact between adjacent leads or contact between adjacent leads may occur. However, there is a drawback that contact between the lead and the semiconductor chip edge is likely to occur.

[0006]

A film carrier semiconductor device of the present invention comprises a lead formed on one surface of a film carrier tape made of a heat resistant insulating film and a semiconductor arranged on the other surface side of the film carrier tape. The aluminum electrode of the chip is directly bonded through a device hole provided in the film carrier tape, and the surface of the semiconductor chip outside the line connecting the outer circumferences of the aluminum electrode pads of the semiconductor chip is covered with the film carrier tape. It has a structure.

[0007]

According to the above construction, since the lead is directly bonded to the aluminum electrode of the semiconductor chip, it is not necessary to form a bump, and the cost can be reduced.

Further, since the area outside the outer periphery of the aluminum electrode pad of the semiconductor chip is covered with the film carrier tape, the length of the inner lead protruding from the film carrier tape is short, so that lead deformation is unlikely to occur. Become.

Further, since the surface of the semiconductor chip outside the line connecting the outer peripheries of the electrodes of the semiconductor chip is covered with the film carrier tape, edge touch between the lead and the semiconductor chip can be prevented.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a film carrier tape according to an embodiment of the present invention. The film carrier tape 1b is provided with a sprocket hole 2b, a lead 3b, an outer lead hole 4b, an electric selection pad 5b, and a device hole 10b.

The opening area of the device hole 10b is made substantially equal to the area connecting the outer circumferences of the aluminum electrode pads of the semiconductor chip. The inner lead 3b protruding into the device hole is made of copper plated with gold and is thicker than the conventional lead. The length should be such that the tips of the inner leads do not protrude beyond the aluminum electrode pad when joined. For example, if the size of the aluminum electrode pad is 100 μm,
If the thickness of the film carrier tape 1b is 125 μm, it will be about 200 to 300 μm.

FIG. 2 is a sectional view showing a method of manufacturing a film carrier semiconductor device according to an embodiment of the present invention. Figure 2 (A)
The semiconductor chip 7 on the bonding stage 12b
b is placed, and the lead 3b is adjusted so as to be aligned with the aluminum electrode pad 8b of the semiconductor chip 7b. About Figure 2
As shown in (B), use the bonding tool 9b to
The aluminum electrode pad 8b of b and the lead 3b are collectively joined by ultrasonic thermocompression bonding of Au-A to complete the film carrier semiconductor device as shown in FIG. 2 (c).

[0014]

[Embodiment 2] FIG. 3 is a plan view of a film carrier according to a second embodiment of the present invention. In this embodiment, the device hole 1
0b 'is only the portion corresponding to the electrode pad, and is the same as that of the first embodiment except that the chip coat film 6b' is provided by being bitten by the device hole. In this embodiment, since the surface of the semiconductor chip is covered with the film, it can be protected from the external environment.

FIG. 4 shows a method of manufacturing a film carrier semiconductor device according to the second embodiment of the present invention.

[0016]

As described above, according to the present invention, since the leads are directly bonded to the electrodes of the semiconductor chip, it is not necessary to form bumps, and the cost can be reduced.

Further, since the length of the inner lead protruding from the heat resistant insulating film is shortened, lead deformation is less likely to occur.

Further, since the surface of the semiconductor chip outside the line connecting the outer peripheries of the electrodes of the semiconductor chip is covered with the heat resistant insulating film, it is possible to prevent edge touch between the lead and the semiconductor chip.

[Brief description of drawings]

FIG. 1 is a plan view of a film carrier tape of the present invention.

FIG. 2 is a sectional view showing a method of manufacturing a film carrier semiconductor device of the present invention.

FIG. 3 is a plan view of a film carrier tape according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a method of manufacturing a film carrier semiconductor device according to a second embodiment of the present invention.

FIG. 5 is a plan view of a conventional semiconductor device using a film carrier method.

FIG. 6 is a sectional view of a semiconductor device according to a conventional film carrier method.

[Explanation of symbols]

 1a, 1b, 1b 'Film carrier tape 2a, 2b, 2b' Sprocket hole 3a, 3b, 3b 'Lead 4a, 4b, 4b' Outer lead hole 5a, 5b, 5b 'Electrical selection pad 6b' Chip coat film 7a, 7b, 7b 'Semiconductor chip 8b, 8b' Aluminum electrode pad 9b 9b 'Bonding tool 10a, 10b, 10b' Device hole 11a Bump 12b, 12b 'Bonding stage

Claims (4)

[Claims] 1. A film carrier semiconductor device in which a semiconductor chip is connected to a film carrier tape having a sprocket hole for carrying and positioning and a lead protruding into a device hole, and the lead is directly bonded to an aluminum electrode of the semiconductor chip. A film carrier semiconductor device characterized by the above. 2. A semiconductor chip is arranged on the other surface side of a film carrier tape having a sprocket hole for carrying and positioning, a device hole, and a lead projecting into the device hole on one surface, The lead is connected to the electrode pad of the semiconductor chip via the film carrier semiconductor device, and the outer peripheral portion of the surface of the semiconductor chip is covered with the film carrier tape. 3. The film carrier semiconductor device according to claim 2, wherein the electrode pad is an aluminum electrode. 4. The device hole is provided in a portion corresponding to a group of the electrode pads of the semiconductor chip,
The film carrier semiconductor device according to claim 2 or 3, wherein the outer peripheral portion and the central portion of the surface of the semiconductor chip are covered with the film carrier tape.