JPH0648831Y2 - 基板冷却装置用パッド - Google Patents

基板冷却装置用パッド

Info

Publication number: JPH0648831Y2
Authority: JP; Japan
Prior art keywords: substrate; pad; laminate; front surface; cooling plate
Prior art date: 1985-02-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP2626985U

Other languages

English (en)

Japanese (ja)

Other versions

JPS61145276U (2

Inventor

和行駒形

清小松

宗治小宮

Original Assignee

日本真空技術株式会社

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-02-27

Filing date

1985-02-27

Publication date

1994-12-12

1985-02-27 Application filed by 日本真空技術株式会社 filed Critical 日本真空技術株式会社

1985-02-27 Priority to JP2626985U priority Critical patent/JPH0648831Y2/ja

1986-09-08 Publication of JPS61145276U publication Critical patent/JPS61145276U/ja

1994-12-12 Application granted granted Critical

1994-12-12 Publication of JPH0648831Y2 publication Critical patent/JPH0648831Y2/ja

2000-02-27 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

239000000758 substrate Substances 0.000 title claims description 34
238000001816 cooling Methods 0.000 title claims description 25
239000002184 metal Substances 0.000 claims description 19
229910052751 metal Inorganic materials 0.000 claims description 19
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
229910052799 carbon Inorganic materials 0.000 claims description 12
239000010408 film Substances 0.000 description 12
229920001971 elastomer Polymers 0.000 description 6
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
229910052802 copper Inorganic materials 0.000 description 3
229910052710 silicon Inorganic materials 0.000 description 3
239000010703 silicon Substances 0.000 description 3
229920000049 Carbon (fiber) Polymers 0.000 description 2
239000000498 cooling water Substances 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
229920002379 silicone rubber Polymers 0.000 description 2
238000007740 vapor deposition Methods 0.000 description 2
CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
239000004917 carbon fiber Substances 0.000 description 1
239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
239000002826 coolant Substances 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
230000000694 effects Effects 0.000 description 1
230000020169 heat generation Effects 0.000 description 1
238000005468 ion implantation Methods 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
238000000034 method Methods 0.000 description 1
230000000704 physical effect Effects 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
239000010409 thin film Substances 0.000 description 1

Landscapes

Crystals, And After-Treatments Of Crystals (AREA)

JP2626985U 1985-02-27 1985-02-27 基板冷却装置用パッド Expired - Lifetime JPH0648831Y2 (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP2626985U JPH0648831Y2 (ja)	1985-02-27	1985-02-27	基板冷却装置用パッド

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2626985U JPH0648831Y2 (ja)	1985-02-27	1985-02-27	基板冷却装置用パッド

Publications (2)

Publication Number	Publication Date
JPS61145276U JPS61145276U (2)	1986-09-08
JPH0648831Y2 true JPH0648831Y2 (ja)	1994-12-12

Family

ID=30522118

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2626985U Expired - Lifetime JPH0648831Y2 (ja)	1985-02-27	1985-02-27	基板冷却装置用パッド

Country Status (1)

Country	Link
JP (1)	JPH0648831Y2 (2)

1985
- 1985-02-27 JP JP2626985U patent/JPH0648831Y2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JPS61145276U (2)	1986-09-08

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