JPH0651877U - Semiconductor sensor mounting device - Google Patents

Abstract

(57) [Summary] [Purpose] The semiconductor sensor is fixed to the stay and the case by separate fixing means. [Structure] A semiconductor sensor 12 and a relay stay 15 are locked to a mounting stay 14 provided upright on a printed board 13, and when the semiconductor stay 12 is mounted, the semiconductor sensor 12 and the relay stay 15 are locked by the relay stay 15.
And the printed board 13 are electrically connected to each other, and the set screw 1 is attached to the case 16 that houses the printed board 13.
By fixing the semiconductor sensor 12 with 7, the semiconductor sensor 12 for the mounting stay 14 and the case 16 is fixed.
The fixing means of is separate, and the assembly process is simplified.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor mounting device in which a semiconductor sensor is fixed to a mounting stay and a case by separate fixing means.

[0002]

[Prior art]

 A semiconductor sensor mounting device 1 shown in FIG. 3 is a device for assembling a semiconductor sensor 2 such as an acceleration sensor used for collision determination of a vehicle in a case 3 such as a collision determination device. In the acceleration sensor used as the semiconductor sensor 2, a stress strain gauge whose semiconductor piezo resistance changes when stressed and distorted needs to be assembled on the substrate with the pressure receiving surface facing the traveling direction of the vehicle. First, it is premised that the semiconductor sensor 2 is arranged at a predetermined position inside the aluminum case 3 that houses the collision determination device. In the conventional semiconductor sensor mounting device 1, the semiconductor sensor 2 is temporarily fixed on the printed board 4 and the printed board 4 is dipped in a solder bath to be soldered, and then the printed board 4 is assembled in the case 3 The semiconductor sensor 2 and the mounting stay 5 were screwed to the case 3. The mounting stay 5 is made of a plate material bent in an L shape when viewed from the side, and the bottom plate portion 5a is screwed to a predetermined position of the printed board 4. A window (not shown) for inserting the pin terminal 2a extending from the semiconductor sensor 2 in an inverted L shape is formed in the wall portion 5b which is bent at a substantially right angle and extends upward from the bottom plate portion 5a. Before starting the attaching work, the pin terminal 2a is inserted into this window, and in this state, the semiconductor sensor 2 is temporarily fixed to the left and right two places by the screws 6. However, at this time, the tip of the pin terminal 2a must be inserted into a pin hole provided at a predetermined position of the printed board 4.

When the temporary fixing of the semiconductor sensor 2 to the mounting stay 5 is completed in this way, the printed board 4 is then dipped in a solder bath and soldered. As a result, the pin terminals 2a extending from the semiconductor sensor 2 are soldered to the printed circuit formed on the lower surface of the printed board 4. After the soldering is completed, the printed board 4 is assembled at a predetermined position in the case 3 after the set screw 6 for temporarily fixing the semiconductor sensor 2 to the mounting stay 5 is temporarily removed. Then, finally, the set screw 6 is again inserted into the case 3 from the outside of the case 3, and the semiconductor sensor 2 is screwed to the mounting stay 5 as in the case of temporary fixing, while the case 3 is also screwed. And complete the installation.

[0004]

[Problems to be solved by the device]

 The above-mentioned conventional semiconductor sensor mounting device 1 uses the set screw 6 for mounting the semiconductor sensor 2 on the mounting stay 5 and the set screw 6 for fixing the semiconductor sensor 2 to the case 3, so that the assembly process Since it was necessary to screw in two times, that is, temporary fixing and formal fixing, the assembly work was complicated. That is, when the lower surface of the printed board 4 is dipped in the solder bath for soldering, it is necessary to temporarily fix the semiconductor sensor 2 to the mounting stay 5 using the set screw 6, and after the soldering is completed, the semiconductor sensor 2 is temporarily fixed. The set screw 6 used for the above is once removed, the printed board 4 is placed at a predetermined position in the case 3, and the semiconductor sensor 2 and the mounting stay 5 are attached to the case 3 from the outside of the case 3 using the same set screw 6. I had to tighten it together. Therefore, in the conventional semiconductor sensor mounting device 1, it is necessary to screw the same setscrew 6 into the same place twice, that is, temporarily and formally. There was a problem that the set screw 6 had to be removed between the fixings, which made the mounting work very complicated and troublesome.

Further, the semiconductor sensor 2 temporarily fixed to the mounting stay 5 is fixed to the printed board 4 only by the pin terminals 2 a whose ends are soldered to the printed board 4, and the semiconductor sensor 2 is vertically fixed. Although it is held by the mounting stay 5, the semiconductor sensor 2 may not be detached from the mounting stay 5 due to an external force in the lateral direction if it is roughly handled, and the pin terminal 2a may be unnecessarily bent at that time. There is a risk that even if the set screw 6 is inserted from the outside of the case 3 for the formal stop, the semiconductor sensor 2 and the set screw 6 are screwed due to a slight misalignment between the stop screw 6 and the screw hole. However, there was a problem that the semiconductor sensor 2 could not be processed smoothly and could exert an unreasonable force on the semiconductor sensor 2.

[0006]

[Means for Solving the Problems]

 This invention solves the above-mentioned problems, and a semiconductor sensor, a mounting stay for locking the semiconductor sensor, and an electrical connection between the semiconductor sensor and an external circuit locked by the mounting stay. And a fixing means for fixing the semiconductor sensor to a case accommodating the external circuit.

Further, according to this invention, the external circuit is a board circuit provided on a board, the fixing means is a set screw, and the mounting stay has a wall portion standing upright on the board. Locking the semiconductor sensor to the front side wall surface of the wall portion and locking the relay stay to the back side wall surface, and the relay stay has a lead wire whose one end is connected to the pin terminal of the semiconductor sensor. Another feature is that the feedthrough capacitor is held through and the other end of the lead wire is inserted into a predetermined position of the substrate.

[0008]

[Action]

 In this invention, the semiconductor sensor and the relay stay are locked to the mounting stay, and the relay stay mediates the electrical connection between the semiconductor sensor and the external circuit. By fixing the semiconductor sensor with the fixing means, the fixing means of the semiconductor sensor with respect to the mounting stay and the case are separate, and the assembly process is simplified.

[0009]

【Example】

 An embodiment of the present invention will be described below with reference to FIGS. 1 is a perspective view showing an embodiment of a semiconductor sensor mounting device of the present invention, and FIG. 2 is an exploded perspective view of the semiconductor sensor mounting device shown in FIG.

The semiconductor sensor mounting device 11 shown in FIGS. 1 and 2 includes a mounting stay 14 that holds the semiconductor sensor 12 on a print plate 13, and a mounting stay 14 that is fixed to the semiconductor sensor 12 and the printed board. It comprises a relay station 15 which mediates an electrical connection with 13, a set screw 17 for fixing the semiconductor sensor 12 to a case 16 which houses the printed board 13, and the like. The mounting stay 14 is composed of a pair of left and right bottom plate portions 18 having claw portions 18a that are locked at a predetermined position on the printed board 13, and a wall portion 19 that is bent at a substantially right angle from the bottom plate portion 18 and extends upward. Claw portions 19a and 19b for locking the semiconductor sensor 12 and the relay stay 15 are respectively planted at several positions on the front side wall surface and the back side wall surface of the wall portion 19, respectively. Reference numeral 19c is a notch for guiding the pin terminal 12a on the back surface of the semiconductor sensor 12 from the front side to the back side of the wall portion 19. The intermediate stay 15 is composed of a locking plate 20 that is tightly locked to the mounting stay 14 and a holding plate 21 that is bent and formed along the lower edge of the locking plate 20, and is connected to the pin terminal 12 a of the semiconductor sensor 12. The lead wire 22 to which the upper end is connected by soldering penetrates the feedthrough capacitor 23 fixed to the holding plate 21 and is once bent in a crank shape on the way, and then the lower end is inserted through a predetermined position of the print plate 13.

When mounting the semiconductor sensor 12, first, the left and right bottom plate portions 18 of the mounting stay 14 are locked at predetermined positions on the printed board 13 by the claw portions 18a. Next, the semiconductor sensor 12 is retained by being attached to the mounting stay 14 by being locked to the surface 19a of the wall portion 19 protruding from the front side wall surface, and further being retained by being attached to the relay stay 15 by being engaged with the rear side wall surface 19b of the wall portion 19. The stay 14 holds it. However, in that case, the U-shaped tips of the five lead wires 22 held by the holding plate 21 of the intermediate stay 15 receive the five pin terminals 12b extending from the semiconductor sensor 12, and also below the lead wires 22. Alignment is performed so that the edge penetrates a predetermined position of the printed board 13. In the case of the embodiment, since the claw portions 19a and 19b both elastically deform to some extent, the semiconductor sensor 12 and the relay stay 15 are locked by clicking.

In this way, after the semiconductor sensor 12 and the relay stay 15 are locked to the mounting stay 14, the printed board 13 is dipped in a solder bath and soldered. As a result, the lower end of the lead wire 22 is soldered to the printed circuit on the lower surface of the printed board 13, and the semiconductor sensor 12 and the printed board 13 are electrically connected via the lead wire 22 held by the relay station 15. However, the pin terminal 12a and the lead wire 22 are also appropriately soldered by a suitable method. Next, the printed board 13 is placed at a predetermined position in the case 16, the set screw 17 is inserted from the outside of the case 16, and the semiconductor sensor 12 is inserted and screwed to the mounting stay 14. The mounting stay 14 is embedded with a nut 24 that is screwed into the set screw 17, and the semiconductor screw 12 is firmly fixed to the case 16 by tightening the set screw 17 to the nut 24. The external force applied to the case 16 can be reliably transmitted as an acceleration input to the semiconductor sensor 12.

As described above, according to the semiconductor sensor mounting device 11, the semiconductor sensor 12 can be semi-permanently integrated with the mounting stay 14 when the semiconductor sensor 12 is locked to the relay stay 15. When the mounting plate 14 is locked, the print plate 13 can be dipped in a solder bath for soldering, and the claw portions 19a and 19b for locking the semiconductor sensor 12 and the relay stay 15 to the mounting stay 14 are Since the semiconductor sensor 12 and the set screw 17 for fixing the mounting stay 14 to the case 16 are separate from each other, the printed circuit board 13 that has been soldered is placed at a predetermined position in the case 16 as it is, and the set screw 17 is used. The sensor 12 and the mounting stay 14 can be fixed to the case 16, so that the time and effort for releasing the temporary fixing as in the conventional case are eliminated. It is unnecessary and the assembly work is simple, and since the semiconductor sensor 12 does not wobble when the set screw 17 is stopped, it does not adversely affect the electrical connection between the semiconductor sensor 12 and the printed board 13. The installation work can be performed safely.

Further, the mounting stay 14 is provided with a wall portion 19 standing upright on the printed board 13, the semiconductor sensor 12 is locked to the front side wall surface of the wall portion 19, and the relay stay 15 is locked to the back side wall surface. Therefore, the front side wall surface and the back side wall surface of the mounting stay 14 are used for locking the semiconductor sensor 12 and the relay stay 15, respectively, so that a large contact area can be locked, and the locking wall portion 19 is sandwiched. By directly connecting the pin terminal 12a and the lead wire 22 with each other and electrically connecting the semiconductor sensor 12 and the relay stay 15, a working space for soldering can be secured and a reliable connection can be achieved. .

Further, the lead wire 22 having one end connected to the pin terminal 12 a of the semiconductor sensor 12 is held by the feedthrough capacitor 23 provided in the relay stay 15, and the other end of the lead wire 22 is at a predetermined position of the printed board 13. Since it is inserted, the length of the pin terminal 12a extending from the semiconductor sensor 12 may be such that it can be connected to the lead wire 22, and the feedthrough capacitor 23 may flow into the lead wire 22 penetrating the relay stay 15. Since it bypasses the high frequency component that is generated, it is possible to protect the sensor output and suppress unnecessary oscillations, thereby ensuring both proper mechanical support of the semiconductor sensor 12 and proper electrical connection. You can

In the above embodiment, the semiconductor sensor 12 is not limited to the acceleration sensor but may be another sensor such as a temperature sensor or a pressure sensor.

[0017]

[Effect of device]

 As described above, according to the present invention, the semiconductor sensor, the mounting stay that locks the semiconductor sensor, and the mounting stay that is locked to mediate the electrical connection between the semiconductor sensor and the external circuit. Since the relay stay and the fixing means for fixing the semiconductor sensor to the case accommodating the external circuit are provided, the semiconductor sensor can be semi-permanently integrated with the mounting stay when locked to the relay stay. Therefore, when the relay stay is locked to the mounting stay, it can be soldered to an external circuit, and the means for locking the semiconductor sensor or the relay stay to the mounting stay is to fix the semiconductor sensor and the mounting stay to the case. Since it is separate from the fixing means, there is no need to release the temporary fixing, which is only for soldering, as in the past. The assembly work is simple and the semiconductor sensor does not wobble when it is fixed by the fixing means, so the mounting work is safe without adversely affecting the electrical connection between the semiconductor sensor and the external circuit. It has an excellent effect that it can be carried out.

Further, according to this invention, since the external circuit is constituted by the substrate circuit provided on the substrate and the fixing means is constituted by the set screw, the mounting stay is semi-permanently attached when the semiconductor sensor is locked to the relay stay. Therefore, when the relay stay is locked to the mounting station, the board can be dipped in a solder bath for soldering, and the semiconductor sensor and relay stay are locked to the mounting stay. Since the semiconductor sensor and the set screw for fixing the mounting stay to the case are separate means, the board after soldering is placed at a predetermined position in the case as it is, and the semiconductor screw is used by using the set screw. Since the sensor and the mounting stay can be fixed to the case, there is no need to release the temporary fixing as in the past, and the assembling work is simple and the locking screw is used. Since the semiconductor sensor does not wobble when the child is stopped, the mounting work can be safely performed without adversely affecting the electrical connection between the semiconductor sensor and the substrate.

Further, according to this invention, since the mounting stay is provided with the wall portion standing upright on the substrate, the semiconductor sensor is locked to the front side wall surface of the wall part, and the relay stay is locked to the back side wall surface. The front side wall surface and the back side wall surface of the mounting stay are used for locking the semiconductor sensor and the relay stay, respectively, so that a large contact area can be locked, and pin terminals and lead wires can be directly connected with the locking wall portion sandwiched between them. By electrically connecting the semiconductor sensor and the relay stay, a working space for soldering can be secured and a reliable connection can be achieved.

Further, the lead wire, one end of which is connected to the pin terminal of the semiconductor sensor, is held by the feedthrough capacitor provided in the relay stay, and the other end of the lead wire is configured to be inserted through a predetermined position of the substrate. The pin terminals extending from the semiconductor sensor need only be long enough to be connected to the lead wire, and the feedthrough capacitor bypasses the high frequency components that try to flow into the lead wire penetrating the relay stay. It is possible to protect and suppress unnecessary oscillation, and thereby it is possible to reliably perform both proper mechanical support and proper electrical connection of the semiconductor sensor.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a semiconductor sensor mounting device of the present invention.

FIG. 2 is an exploded perspective view of the semiconductor sensor mounting device shown in FIG.

FIG. 3 is a side view showing an example of a conventional semiconductor sensor mounting device.

[Explanation of symbols]

 11 Semiconductor Mounting Device 12 Semiconductor Sensor 13 Printed Circuit Board (External Circuit, Board) 14 Mounting Stay 15 Relay Stay 16 Case 17 Set Screw (Fixing Means) 22 Lead Wire 23 Feedthrough Capacitor

Claims (4)

[Scope of utility model registration request] 1. A semiconductor sensor, a mounting stay for locking the semiconductor sensor, and a mounting stay locked to the mounting stay,
A semiconductor sensor mounting device comprising: a relay stay that mediates electrical connection between the semiconductor sensor and an external circuit; and a fixing unit that fixes the semiconductor sensor to a case that accommodates the external circuit. 2. The mounting device for a semiconductor sensor according to claim 1, wherein the external circuit is a substrate circuit provided on a substrate, and the fixing means is a set screw. 3. The mounting stay has a wall portion that stands upright on the substrate, and the front side wall surface of the wall portion holds the semiconductor sensor, and the back side wall surface holds the relay stay. The mounting device for a semiconductor sensor according to claim 2, wherein the mounting device is a semiconductor sensor. 4. The relay stay holds a lead wire, one end of which is connected to a pin terminal of the semiconductor sensor, through a through capacitor, and the other end of the lead wire is inserted into a predetermined position of the substrate. The mounting device for a semiconductor sensor according to claim 2, wherein: