JPH0653697A - Lead component inserting apparatus using pin guide plate - Google Patents

Abstract

PURPOSE:To stabilize an insertion by providing a mechanism for holding leads and an extension pin of an electronic component, and a pin guide plate for guiding the pin to an insertion hole. CONSTITUTION:The lead component inserting apparatus comprises a first holding mechanism 4 for holding leads 1b of an electronic component 1, a push rod for pressing a body of the component 1, a second holding mechanism 5 for holding the pin, and a pin guide plate 11 for guiding the pin to an insertion hole 7a of a circuit board 7. After the mechanism 4 holds the lead 1b of the component 1, the push rod is moved down to be brought into contact with an upper surface of the body 1a of the component 1. Substantially simultaneously, a component guide 20 is brought into contact with a side of the body 1a of the component 1 by controlling operations of the mechanism 4, the rod and the guide 30 as to hold the body 1a. Thus, the component 1 itself is stably held, insertion positioning of the pin into the hole 7a is facilitated, and a stable insertion can be secured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for automatically inserting an electronic component with a lead wire, and more particularly, an extension pin having a linear shape at the tip of the lead wire of an electronic component consisting of a component body and a plurality of lead wires protruding from the body. The lead pin is inserted into the insertion hole of the circuit board with the extension pin as a guide in this state, and the extension pin is separated from the lead wire after the tip of the lead wire is inserted into the insertion hole of the circuit board. The present invention relates to a lead component insertion device configured to eject on the opposite side, and more particularly to a lead component insertion device having a pin guide plate.

[0002]

2. Description of the Related Art Japanese Unexamined Patent Publication No. 59-181691 discloses
As described above, the extension pin is linearly connected to the tip of the lead wire of the electronic component including the component body and the plurality of lead wires protruding from the body, and in this state, the extension pin is used as a guide to form a circuit of the lead wire. A lead component insertion device configured to insert into the insertion hole of the board, insert the tip of the lead wire into the insertion hole of the circuit board, and then eject the extension pin on the opposite side of the board away from the lead wire. It is disclosed.

According to this prior art, since the extension pin is joined to the tip of the lead wire of the electronic component, the electronic component can be inserted without affecting adjacent components on the printed circuit board, and the electronic component can be inserted. Enables high-density mounting,
There is an advantage. It should be noted that, unlike JP-A-63-399999, a lead wire for guiding a lead wire of an electronic component with a guide pin directed upward from the lower side of a circuit board through an insertion hole, unlike the above-mentioned conventional technique. A device for holding an electronic component is disclosed in an electronic component insertion device.

[0004]

However, according to the conventional technique disclosed in Japanese Patent Laid-Open No. 59-181691, a special support / guide is provided for the main body of the electronic component (that is, usually the resin-molded portion). Since no means is provided, the attitude of this electronic component becomes unstable immediately before the insertion into the board insertion hole. Further, according to the above-described conventional technique, the only one that guides the extension pin to the insertion hole of the printed circuit board is the pin chuck that holds the extension pin relatively above them, and the tip of the extension pin is inserted into the board insertion hole. There is a problem in that it is relatively difficult to accurately match them, and the insertion of the extension pin is unstable.

Therefore, according to the present invention, the electronic component itself can be stably held by a simple mechanism, and the extension pin can be easily inserted and positioned in the board insertion hole to ensure the insertion stability. An object of the present invention is to provide a lead wire electronic component automatic insertion device that can be used.

[0006]

In order to solve such a problem, according to the present invention, at the tip of the lead wire of an electronic component consisting of a component body and a plurality of lead wires protruding from the body, By connecting the extension pin in a straight line on the upper side of the circuit board and inserting the extension pin from one end of the extension pin into the insertion hole of the circuit board in this state, the lead wire connected to the other end of the extension pin is inserted. In a lead component insertion device configured to guide and insert into a hole, and after the tip of the lead wire is inserted into the insertion hole of the circuit board, the extension pin is separated from the lead wire and ejected under the board, A component guide capable of laterally holding and releasing the body of the electronic component, a first holding mechanism capable of holding and releasing the lead wire of the electronic component, and pressing the electronic component downward from the upper surface of the body of the electronic component Holds and releases push rod and extension pin A second holding mechanism, comprising a pin guide plate for guiding the extension pin into the insertion hole of the circuit board, the lead parts insertion device having a pin guide plate is provided.

The pin guide plate is composed of a pair of plates that can be opened and closed with each other, and corresponds to the spacing pattern of the insertion holes of the circuit board for guiding the extension pins to the board insertion holes between the pair of plates when closed. It is preferable to define a plurality of guide holes with different intervals. Further, after the first holding mechanism holds the lead wire of the electronic component, the push bar descends and comes into contact with the upper surface of the body of the electronic component at substantially the same time as the component guide comes into contact with the side of the body of the electronic component, and It is preferable to include means for controlling the operation of the first holding mechanism, the push rod and the part guide so as to hold the part.

The pin guide plate is closed at least before the tip of the extension pin is lowered to a position approaching the insertion hole of the circuit board to define the guide hole, and the tip of the extension pin passes through the insertion hole of the circuit board. It is preferable to configure so as to be released after this.

[0009]

According to the present invention, after the first holding mechanism holds the lead wire of the electronic component, the push rod descends and contacts the upper surface of the body of the electronic component. At about the same time, the operation of the first holding mechanism, the push rod, and the component guide is controlled so that the component guide comes into contact with the side of the body of the electronic component and holds the body of the electronic component. As a result, the electronic component itself is stably held, and the extension pin can be easily inserted and positioned in the board insertion hole, and a stable insertion operation can be ensured.

[0010]

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings. 1 to 3 show a method of inserting an electronic component with leads according to an embodiment of the present invention in the order of steps. The lead wire-equipped electronic component 1 has a plurality of lead wires 1b sandwiched by a tape mount 1c and an adhesive tape at predetermined intervals so as to be parallel to each other, and is continuously held in the longitudinal direction of the tape mount 1c. The mount of the electronic component series is cut almost in the middle of the adjacent electronic components to form an electronic component continuous cutting piece in which the lead wire of one electronic component is fixed to the holding band, and then the lead wire is cut with an appropriate cutter 2. Then tape mount 1c
Is separated from the electronic component 1. At this time, the lead wire 1b is cut into an appropriate length in advance. Incidentally, this point is disclosed in detail in Japanese Patent Laid-Open No. 1-286499, "Method for cutting and bending lead wires".

A first holding mechanism (chuck) 4 holds a plurality of (two in the embodiment) lead wires 1b of the electronic component 1 in accordance with the intervals of the substrate holes 7a to be inserted. At this time, the electronic component 1 is in a vertical posture with the main body 1a in the upper part and the lead wire 1b in the lower part. The extension pin 3 has a diameter such that it can freely pass through the board hole 7a, and the lower end 3a is provided to facilitate insertion into the board hole 7a.
Is tapered, and has a hole or recess 3b into which the tip of the lead wire can be inserted.

The second holding mechanism (chuck) 5 vacuum-adheses the upper portions of the extension pins 3 in a number equal to the number of the lead wires 1b (two in the figure) so as to be parallel to the lead wires 1b. And hold. At this time, extension pin 3 is lead wire 1
b (substrate hole 7a) is held substantially vertically and parallelly at an interval corresponding to the interval of b (substrate hole 7a), and is moved to a corresponding position below the lead wire 1b of the electronic component 1 and above the substrate hole 7a to lead the electronic component 1. The position is close to the line 1b.

After the lead wire 1b is held by the first holding mechanism (chuck) 4, the push rod 6 descends and contacts the upper surface of the body 1a of the electronic component. An elastic body (not shown) such as rubber is provided on the contact surface of the push rod 6 in order to reduce the impact of the contact at this time.
Is provided. Further, the operation of the component guide 20 is started at substantially the same time as the operation of the push rod 6, and the electronic component 1 is chucked and held from both sides of the component body 1a. Similarly, an elastic body (not shown) such as rubber is also provided at the contact portion of the component guide 20 with the component body 1a in order to reduce the impact of the contact at this time.

The extension pin 3 is inserted into the insertion hole 7 of the printed circuit board 7.
The pin guide plate 11 that guides to a comes to a predetermined position, that is, a position near the insertion hole 7a of the printed board 7, and stands by. The pin guide plate 11 has a plurality of guide holes corresponding to the pattern of the insertion holes 7a of the printed board 7 as described later. The tip of the extension pin 3 is guided by the pin guide plate 11 and inserted into the substrate hole 1b while holding the lead wire 1b and the extension pin 3 in a state of being brought close to each other.

The tip of the extension pin 3 reaches the extension pin holding / recovering portion (clinch portion having the extension pin collecting function) 8 waiting on the lower side, and further reaches the air ejection port 8a described later to be inserted. The electronic component 1 and the extension pin 3 are lowered by the chucks 4 and 5 until the chucks 4 and 5. The lead wire 1b and the extension pin 3 are held by the chucks 4 and 5, respectively, but there is a push rod 6 above the electronic component 1, and the push rod 6, the electronic component body 1a, the lead wire 1b, and the bottom extend from the top. It becomes pin 3 and each is lined up vertically. When descending in this way,
The lower end of the extension pin 3 first passes through the substrate hole 7a, and then the pin tip reaches the air ejection port 8a of the extension pin holding / recovering unit 8 coexisting in the clinch portion and enters into it (( In the drawings of the embodiments, the structure of the crink portion for preventing the tip of the lead wire 1b from coming off from the bent substrate 7 is omitted). In this state, the chucks 4 and 5 are located so as not to interfere with the adjacent component 1d mounted on the printed circuit board 7. At this time, the extension pin 3 receives a force that is lifted upward by ejecting pressure air from the clinch portion 8 side, and the tip of the lead wire 1b comes into contact with the upper end of the extension pin 3 and enters the upper end hole 3b. At this point, the holding of the lead wire 1b and the extension pin 3 is released. The parts guide 20 is also opened. Even if the holding is released in this way, it is sandwiched between the push rod 6 on the upper part of the component and the extension pin 3 which receives an upward force,
The push rod 6, the electronic component body 1a, the lead wire 1b, and the extension pin 3 on the lowermost side are formed from the top. At this time, the extension pin 3 is movable in its longitudinal direction, but the substrate hole 7a and the air ejection port 8a act so as to be restrained in the direction of the sagging.

In the above state, the push rod 6 on the upper part of the electronic component 1
Then, the electronic component 1 and the extension pin 3 are supported by the lifting force of the air blown from the clinch portion 8 on the lower side of the substrate, and the electronic component 1 is lowered by the push rod 6 while maintaining the supported state. After inserting the lead wire 1b into the board hole 7a, the extension pin 3 is recovered by the clinch portion 8. That is, the injection of the pressure air is stopped when the lead wire 1b is inserted into the substrate hole 7a. Alternatively, in order to quickly remove the pressure and make the recovery of the extension pin 3 smooth, air may be temporarily made a negative pressure to perform the suction action. The extension pin 3 falls below the clinch portion 8 and is collected.

As described above, one cycle of the insertion process of the electronic component 1 with a lead wire is completed, but the extension pin is recovered after use and circulated for reuse. The operations of the above-mentioned members are automatically performed in conjunction with each other. 4 is a schematic perspective view of the lead component insertion mechanism according to the present invention, and FIG. 5 is a schematic perspective view showing the operation of the lead component insertion mechanism shown in FIG.

As shown, a lead wire 1a of the electronic component 1
Holding mechanism (chuck) 4 for holding / releasing and second holding mechanism (vacuum chuck) for holding / releasing extension pin 3
5 is carried by the head block 10 and opens and closes like scissors, holds the lead wire or extension pin when closed, and releases the lead wire or extension pin when opened. The pin guide plate 11 that guides the extension pin 3 to the board insertion hole 7a is composed of a pair of plates that can be opened and closed as shown by arrows, and when closed, guides the extension pin 3 to the board insertion hole 7a between these plates. For this purpose, each has a semicircular groove that defines a plurality of guide holes 11a having intervals corresponding to the interval pattern of the insertion holes 7a of the circuit board 7.

The component guide 20 is composed of a pair of members that open and close in cooperation with each other for holding the electronic component body 1a by chucking from both sides. Since the push rod 6 and the component guide 20 directly contact the upper surface or the periphery of the component body formed by resin molding or the like, an elastic body (rubber or the like) is provided to soften the impact and prevent damage to the contacting portion. (Not shown) can be provided. Further, the push rod 6 can be replaced with one having a different shape, size, etc. according to the form of the electronic component 1.

[0020]

As described above, according to the present invention, since the lead wire of the electronic component is held by the first holding mechanism and the main body is held by the component guide, the electronic component is stabilized during the inserting operation. Can be held. Further, the pin guide plate facilitates the insertion and positioning of the extension pin into the board insertion hole, and a stable insertion operation can be ensured.

[Brief description of drawings]

FIG. 1 shows a first step and a second step in a lead component insertion device according to the present invention.

FIG. 2 shows a third step and a fourth step in the lead component insertion apparatus according to the present invention.

FIG. 3 shows a fifth step and a sixth step in the lead component insertion apparatus according to the present invention.

FIG. 4 is a schematic perspective view of a lead component insertion mechanism according to the present invention.

5 is a schematic perspective view showing the operation of the lead component insertion mechanism shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic component 1b ... Lead wire 3 ... Extension pin 4 ... 1st holding | maintenance mechanism (lead chuck) 5 ... 2nd holding | maintenance mechanism (pin chuck) 7 ... Printed circuit board 8 ... Extension pin holding / recovery mechanism (clinch part) 10 ... Chuck block 11 ... Pin guide plate 11a ... Guide hole 20 ... Parts guide

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[Procedure amendment]

[Submission date] September 24, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 1

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction content]

[0006]

In order to solve such a problem, according to the present invention, at the tip of the lead wire of an electronic component consisting of a component body and a plurality of lead wires protruding from the body, By connecting the extension pin in a straight line on the upper side of the circuit board and inserting the extension pin from one end of the extension pin into the insertion hole of the circuit board in this state, the lead wire connected to the other end of the extension pin is inserted. In a lead component insertion device configured to guide and insert into a hole, and after the tip of the lead wire is inserted into the insertion hole of the circuit board, the extension pin is separated from the lead wire and ejected under the board, A first holding mechanism capable of holding and releasing the lead wire of the electronic component, a push rod for pressing the electronic component downward from the upper surface of the body of the electronic component, and a second holding mechanism capable of holding and releasing the extension pin, Guide the extension pin to the insertion hole of the circuit board Comprising a down guide plate,
A lead component insertion device having a pin guide plate is provided.

Claims (4)

[Claims] 1. An extension pin on the upper side of a circuit board (7) at the tip of the lead wire of an electronic component (1) consisting of a component body (1a) and a plurality of lead wires (1b) protruding from the body. (3) is connected in a straight line, and by inserting the extension pin from one end of the extension pin into the insertion hole (7a) of the circuit board in this state, the lead wire connected to the other end of the extension pin is inserted into the insertion hole. A lead component insertion device configured to guide and insert the lead wire into the insertion hole of the circuit board, and then eject the extension pin from the lead wire at the lower side of the board to provide an electronic component. A component guide (20) capable of laterally holding and releasing the main body (1a) of (1), and a first holding mechanism (4) capable of holding and releasing the lead wire (1b) of the electronic component.
And a push rod (6) for pressing the electronic component downward from the upper surface of the body (1a) of the electronic component, and an extension pin (3).
A lead having a pin guide plate, which comprises a second releasable holding mechanism (5) and a pin guide plate (11) for guiding the extension pin (3) into the insertion hole (7a) of the circuit board (7). Parts insertion device. 2. The pin guide plate (11) comprises a pair of plates that can be opened and closed with each other, and guides the extension pin (3) to the board insertion hole (7a) between the pair of plates when closed. , A plurality of guide holes (11a) having intervals corresponding to the interval pattern of the insertion holes (7a) of the circuit board (7)
The lead component insertion device according to claim 1, wherein 3. The first holding mechanism (4) holds the lead wire (1b) of the electronic component, and then the push rod (6) descends to come into contact with the upper surface of the body (1a) of the electronic component at substantially the same time. The component guide (20) operates the first holding mechanism (4), the push rod (6), and the component guide (20) so as to contact the side of the body (1a) of the electronic component (1) and hold the electronic component. The lead component insertion device according to claim 1, further comprising means for controlling. 4. The pin guide plate (11) is closed at least before the tip of the extension pin (3) descends to a position approaching the insertion hole (7a) of the circuit board (7), and the guide hole (11a) is closed. ), And the tip of the extension pin (3) is released after passing through the insertion hole (7a) of the circuit board (7).