JPH0655277U - Component mounting circuit board - Google Patents

Abstract

(57) [Summary] (Corrected) Positioning marks for positioning when mounting circuit components on a circuit board are formed at accurate positions, and do not interfere with soldering of lead terminals to land electrodes. To do. [Structure] In order to accurately mount the circuit component 2 at a predetermined position on the circuit board 1, positioning marks 5 and 5 are formed to indicate the position where the circuit component 2 is mounted. The positioning marks 5 and 5 are printed as a conductor pattern together with the electrode lands 4 and 4 and are the outermost electrode lands 4 and 4.
It is formed integrally with ... As a result, the positioning marks 5 and 5 are formed at accurate positions with respect to the electrode lands 4 and 4. Further, the positioning marks 5 and 5 are the electrode lands 4,
Since it is made of the same conductor film as 4 ..., It does not become an obstacle when soldering the lead terminals 3, 3 to the land electrodes 4, 4.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a component-mounted circuit board in which circuit components such as semiconductor integrated circuit elements are mounted on a circuit board having a circuit pattern formed on an insulating substrate.

[0002]

[Prior art]

 As shown in FIGS. 5 and 6, the circuit board 1 is made of an alumina-based, epoxy-based, or silicon-resin-based insulating substrate with a conductor material, a resistance material, a dielectric material, an insulating material, and the like. A circuit pattern including the land electrodes 4, 4, ... Is formed by a method such as film printing. On such a circuit board 1, for example, a circuit component 2 is mounted. In the example shown in FIG. 5, the dual in-line package type circuit component 2 in which the lead terminals 3, 3 ... Are led out from both sides of the component body is mounted, and the land electrodes 4 are arranged in two columns on the circuit board 1. 4 are formed. Further, the example shown in FIG. 6 is one in which a single in-line package type circuit component 2 using the connection terminal array 6 is mounted, and the lead electrode 7 of the connection terminal array 6 is mounted on the circuit board 1. Land electrodes 4, 4, ... Are formed in one row in accordance with the interval of 7. Then, cream solder is applied to these land electrodes 4, 4 in advance, the circuit component 2 is mounted, and the lead terminals 3, 3 ... and the lead electrodes 7, 7 ... Put on. Then, the circuit board 1 is sent to a tunnel furnace, the cream solder is reflowed, and the lead terminals 3, 3 ... and the lead electrodes 7, 7 ... Are soldered to the land electrodes 4, 4.

When the circuit component 2 is mounted on the circuit board 1 in this manner, the position where the circuit component 2 is mounted is shown in order to accurately mount the circuit component 2 at a predetermined position on the circuit board 1. The positioning marks 5 ′ and 5 ′ are formed on the circuit board 1. The positioning marks 5 ′ and 5 ′ are usually formed at positions that show the outer contour of the circuit component 2 to be mounted on the circuit board 1. In the conventional circuit board 1, the positioning marks 5 ', 5'are formed by printing an insulating ink on the circuit board 1 and baking it, or by pasting a metal foil on the circuit board 1. Was.

[0004]

[Problems that the device is trying to solve]

 The circuit board 1 of today is highly integrated, and the circuit patterns printed on the circuit board 1 are becoming finer and finer. Under these circumstances, the distance between the outer land electrodes 4 and 4 and the positioning marks 5'and 5'is extremely narrow. Therefore, when the positioning marks 5 ′ and 5 ′ are printed or attached to the circuit board 1, they may overlap the outer land electrodes 4 and 4 and cause a connection failure with the circuit component 2. There is. Therefore, in printing or sticking the positioning marks 5 ', 5'on the circuit board 1, extremely accurate printing and sticking techniques are required, which has been an obstacle to cost reduction of the product.

Further, since the positioning marks 5 ′ and 5 ′ are printed or attached separately from the land electrodes 4, 4, ... It is difficult to avoid misalignment with the land electrodes 4, 4, ... In the process. Therefore, when the circuit component 2 is mounted on the circuit board 1 with reference to the positioning marks 5 ′, 5 ′, the lead terminals 3, 3, ... Of the circuit component 2 and the lead electrodes 7, 7 ... In some cases, the land electrodes 4, 4 ... Are displaced from the mounting position. In view of the above-mentioned problems of the prior art, the present invention can form a positioning mark that indicates a position where a circuit component is mounted on a circuit board at an accurate position with respect to a land electrode, and solder a lead terminal or the like to a land electrode. It is an object of the present invention to provide a component mounting circuit board that does not hinder mounting.

[0006]

[Means for Solving the Problems]

 That is, in order to achieve the above-mentioned object, the present invention mounts the circuit component 2 on the circuit board 1 and attaches the circuit component 2 to the land electrodes 4, 4, ... Formed on the circuit board 1. A component mounting circuit in which a connecting conductor is soldered and a positioning mark 5 is provided on the outside of the land electrodes 4, 4, ... The substrate is characterized in that the positioning mark 5 is formed by a conductor pattern printed together with the land electrodes 4, 4, .... In this case, the positioning mark 5 may be formed integrally with the land electrodes 4 and 4.

[0007]

[Action]

 In the component mounting circuit board according to the present invention, since the positioning marks 5 are formed by the conductor pattern printed together with the land electrodes 4, 4, ..., These positioning marks can be formed without applying a high-level printing technique. The relative positions of 5 and the land electrodes 4, 4 ... Do not change each time they are printed, and it is possible to print with an accuracy almost equal to the error of the printing plate. Therefore, when the positioning mark 5 and the electrode lands 4, 4, ... Are separately formed, they do not overlap each other. Further, even when the positioning mark 5 and the electrode lands 4, 4, ... Are integrally formed, the positioning mark 5 is made of the same conductor film as the electrode lands 4, 4 ,. It does not hinder the soldering of terminals and lead electrodes.

[0008]

【Example】

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, the embodiment of FIGS. 1 and 2 will be described. As described above, the circuit board 1 is made of an insulating material such as an alumina-based material, an epoxy-based material, a silicon resin-based material, a conductive material, a resistance material, a dielectric material, and an insulating material. A circuit pattern including the land electrodes 4, 4, ... Is formed by a thick film printing method using a material or the like. On such a circuit board 1, for example, a circuit component 2 is mounted. In this embodiment, the circuit components 2 of the dual in-line package type in which the lead terminals 3, 3 ... Are led out from both sides of the component body are mounted, and the land electrodes are arranged in two columns on the circuit board 1. 4, 4, ... Are formed.

Further, on the circuit board 1, for the purpose of accurately mounting the circuit component 2 at a predetermined position on the circuit board 1, positioning marks 5, 5 are formed to indicate the position where the circuit component 2 is mounted. To be done. In this embodiment, the positioning marks 5, 5 are printed as a conductor pattern together with the electrode lands 4, 4, ... And are integrally formed with the outermost electrode lands 4, 4 ,. . The positioning marks 5 and 5 are formed at positions corresponding to a pair of corners on the diagonal line of the contour as a position showing the outer contour of the circuit component 2 to be mounted on the circuit board 1. ing. If the positioning marks 5 and 5 are covered with a transparent or semi-transparent protective film, it will be prevented from being oxidized and discolored by high heat during soldering described later. Of course, the positioning marks 5 and 5 may be formed separately from all the electrode lands 4 and 4. In that case, for example, the same shapes as the positioning marks 5'and 5'of the prior art shown in FIG. 5 can be adopted.

As described above, the mounting of the circuit component 2 on the circuit board 1 is performed as follows. That is, cream solder is applied to the land electrodes 4, 4, ... In advance, the circuit component 2 is mounted on the basis of the positioning marks 5, 5, and the lead terminals 3, 3 ,. On top of. Then, the circuit board 1 is sent to a tunnel furnace, the cream solder is reflowed, and the lead terminals 3, 3, ... Are half-bonded to the land electrodes 4, 4 ,. At this time, since the positioning marks 5, 5 and the electrode lands 4, 4, ... Correspond in an accurate position, the land electrodes 4, 4, ... And the lead terminals 3, 3 ,. Can be soldered. Further, the positioning marks 5 and 5 do not hinder the soldering of the lead terminals 3 to the land electrodes 4, 4 ...

Next, the embodiment of FIGS. 3 and 4 will be described. This embodiment is an example in which a single in-line package type circuit component 2 using a connection terminal array 6 is mounted. In this case, the land electrodes 4, 4, ... Are formed in one row on the circuit board 1 in accordance with the distance between the lead electrodes 7, 7 of the connection terminal array 6, and the lead electrodes of the connection terminal array 6 are formed on this. 7 and 7 are soldered.

Also in this embodiment, the positioning marks 5, 5 are printed as conductor patterns together with the electrode lands 4, 4, ... And are formed integrally with the outermost electrode lands 4, 4 ,. Further, the positioning marks 5 and 5 indicate the positions of both ends of the circuit component 2 to be mounted on the circuit board 1, and are formed so as to face each other with the lead lands 4, 4 ... Of course, the positioning marks 5 and 5 may also be formed separately from the electrode lands 4 and 4. In that case, for example, the same shapes as the positioning marks 5'and 5'in FIG. 6 shown as the prior art can be adopted.

[0013]

[Effect of device]

 As described above, according to the present invention, the positioning marks 5 can be printed on the land electrodes 4, 4, ... With high accuracy, and the positioning marks 5 lead to the electrode land 4, 4 ,. It does not hinder the soldering of the terminals 3, 3 and the lead electrodes 7, 7. As a result, the printing of the positioning mark 5 can be simplified, the electronic component 2 can be mounted accurately, and the quality can be improved and the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view of an essential part of a component mounting circuit board according to a first embodiment of the present invention.

FIG. 2 is a plan view of an essential part of the component-mounted circuit board according to the embodiment.

FIG. 3 is a perspective view of an essential part of a component mounting circuit board according to a second embodiment of the present invention.

FIG. 4 is a plan view of a main part of the component mounting circuit board according to the embodiment.

FIG. 5 is a perspective view of a main part of a conventional component mounting circuit board.

FIG. 6 is a perspective view of an essential part of another conventional component-mounted circuit board.

[Explanation of symbols]

 1 circuit board 2 circuit component 3 lead terminal 4 land electrode 5 positioning mark 6 lead array 7 lead electrode

Claims (2)

[Reference number] 0040437-01 [Claims for utility model registration] 1. A circuit component (2) is mounted on a circuit board (1), and the circuit component (4) is formed on the land electrodes (4), (4) ... Formed on the circuit board (1). The connection conductor of 2) is soldered to the outside of the land electrodes (4), (4) ... In the component mounting circuit board on which (5) is formed, the positioning mark (5) has land electrodes (4), (4).
A component-mounting circuit board formed of a conductor pattern printed together with. 2. The component mounting circuit board according to claim 1, wherein the positioning mark (5) is formed integrally with the land electrodes (4), (4).