JPH066029A - Connecting method of selective printed-wiring and printed-wiring board applicable to the same - Google Patents

Abstract

PURPOSE:To cut down selective printed-wiring cost of conductive connection reducing the manufacturing cost thereof. CONSTITUTION:A selective printed-wirings 10 arranged on a substrate are composed of respective connecting terminal patterns 12a, 12b closely arranged in the tangled state with each other at respective ends of printed-wirings 11a, 11b. During the packaging step, the selective printed-wirings 10 are conduction- connected by conventional reflowing step. That is, a solder paste 13 arranged in specific positions is heated to be melted down so that the parts between respective connecting terminal patterns 12a, 12b closely arranged in the tangled state with each other may be conduction-connected. Accordingly, the selective printed-wirings 10 can be conduction-connected thereby enabling the manufacturing cost thereof to be cut down.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for selectively electrically connecting printed wiring formed on a substrate in a mounting process and a printed wiring board used in the method.

[0002]

2. Description of the Related Art For example, in a remote controller or the like, a common substrate is often used as a substrate that constitutes different products that transmit output signals in different frequency bands. In order to manufacture a finished product having different functions by using the common substrate in this way, printed wiring (selective printed wiring) capable of being selectively conductively connected is formed on the substrate.

A conventional method for selectively electrically connecting printed wirings of this type will be described with reference to FIG. Figure 4 (a)
As shown in, printed wiring 2 formed on substrate 1
a, 2b and 3a, 3b can be selectively used,
A gap is provided between the respective ends, and they are arranged so as to face each other. In the mounting step, the jumper chip 4 is mounted in the gap between the printed wirings 2a, 2b or 3a, 3b according to the specifications of the finished product. The jumper chip 4 is configured, for example, by forming electrodes 6a and 6b on both ends of a substrate 5 made of ceramic or the like, and arranging a conductor layer 7 electrically connecting the electrodes 6a and 6b on the upper or lower surface thereof. ing. The jumper chip 4 is mounted as follows. That is, as shown in FIG. 4B, the selected printed wiring (2a, 2 in FIG.
Place the electrodes 6a and 6b at both ends of the jumper chip 4 on the solder paste arranged at the opposite ends of (selecting b), heat to melt the solder paste, and place the jumper chip 4 at a predetermined position. Solder. Therefore, the printed wirings 2a and 2b on which the jumper chip 4 is mounted are electrically connected, and the other printed wirings 3a and 3b are not electrically connected.

[0004]

However, the conventional example having such a structure has the following problems. That is, in the conventional example, the jumper chip 4 is used to electrically connect the printed wirings that are selectively arranged on the substrate, but due to the cost of the jumper chip 4 used for this conductive connection, However, there is a problem in that the manufacturing cost cannot be reduced even if the substrates forming the products of a plurality of specifications are shared. In particular, if the printed wiring of the board is complicated to improve the function of the product and the number of selected wiring portions is increased accordingly, there is a problem that the number of jumper chips 4 used further increases and the manufacturing cost further increases.

Also, without using the jumper chip 4,
In order to electrically connect between the selected printed wirings, for example, as shown in FIG. 5A, when the end portions of the respective printed wirings 8a and 8b are arranged close to each other and conductive connection is made between them by soldering, There are the following problems. That is, the solder paste 9 is applied between the ends of the printed wirings 8a and 8b.
When heated and arranged, the molten solder 9 diffuses along the printed wirings 8a and 8b, and as shown in FIG. 5B, the solder 9 is separated in the gaps between the printed wirings 8a and 8b. Therefore, the printed wirings 8a and 8b are not electrically connected.

The present invention has been made in view of the above circumstances, and reduces the cost for the conductive connection of the selected printed wirings of the common substrate forming the products of a plurality of specifications, thereby reducing the manufacturing cost. The purpose is to

[0007]

The present invention has the following constitution in order to achieve such an object. That is, the invention according to claim 1 is a method of selectively connecting conductively printed wiring formed on the substrate in a step of mounting a surface mount component on the substrate. Connection terminal patterns that are arranged in close proximity to each other are formed at opposite ends of the above, and the connection terminal patterns that face each other are selectively conductively connected by a conductive paste.

According to the second aspect of the present invention, there is provided a surface mount type printed wiring board, in which the connection ends are arranged close to each other at opposite ends of the selectively connected printed wiring. The terminal patterns are respectively formed.

[0009]

The operation of the present invention is as follows. That is,
According to the first aspect of the present invention, the connection terminal patterns that are arranged close to each other are formed at the opposite ends of the selectively connected printed wirings, and the connection terminal patterns are arranged between the opposite connection terminal patterns. By selectively conductively connecting the conductive paste, the connection terminal patterns are conductively connected by the conductive paste by a well-known reflow method.
Since the connecting terminal patterns are placed close to each other, when the conductive paste is heated, even if the molten conductive paste diffuses along the printed wiring, the ends of the printed wiring are simply brought close to each other. As in the case of the above, the conductive paste is not separated at the portions between the connection terminal patterns, and the printed wirings can be surely conductively connected. That is, since the selective wiring can be easily performed by the known technique, the manufacturing cost can be reduced.

According to the second aspect of the present invention, the connection is arranged in close proximity to each other at the opposite ends of the printed wirings selectively connected to the surface mounting type printed wiring board. Since the terminal patterns are formed respectively, the connection terminal patterns that are conductively connected can be conductively connected with a conductive paste by a known reflow method.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. A method for selectively electrically connecting printed wirings according to an embodiment of the present invention will be described with reference to FIG.

FIG. 1A shows a selective printed wiring 10 arranged on a substrate, which is configured to electrically connect the required selected printed wiring 10 in accordance with the specifications of the finished product. . As shown in the figure, the selected printed wiring 10 has a convex connection terminal pattern 12a and a concave connection terminal pattern 1 at each end of the printed wirings 11a and 11b.
When 2b and 2b are intruded into each other, the distance between them is 0.1
They are arranged close to each other to be about 0.15 mm.

The conductive connection of the selected printed wiring 10 in the mounting process is performed by the well-known reflow method. That is, first, for example, a conductive solder paste 13 is used as shown in FIG.
The solder paste 13 is melted by arranging it at the position shown by the imaginary line in (a) and then heating it, so that the connection terminal patterns 12a and 12b are electrically connected. At this time, the molten solder paste 13 is
a, 11b diffuse along, but each connection terminal pattern 1
Since the gap between 2a and 12b has a recessed shape,
The gap between the connection terminal patterns 12a and 12b is shown in FIG.
As shown in Fig. 1, the solder is not completely separated, and Fig. 1
As shown in (b), each connection terminal pattern 12a, 12
Conductive connection is made between b. Since the solder paste 13 for connecting the selective printed wiring 10 can be formed by screen printing at the same time as the other solder paste applied to connect and arrange other surface mount components on the substrate. It is not necessary to provide a special process for connecting the selective printed wiring 10.

Further, such a connection terminal pattern is not limited to the shape as shown in FIG. 1A, but the connection terminal patterns may be arranged close to each other at each end of the printed wiring. For example, for example, the connection terminal patterns 21a and 21b that enter into the comb tooth shape shown in FIG. 2 and the connection terminal pattern 22 that enter into the spiral shape shown in FIG.
It may have a shape such as a or 22b. Furthermore, FIG.
The conductive connection of the connection terminal pattern having the shape shown in FIG. 3 and FIG. 3 can also be made with the solder paste 13 by the reflow method as described above.

[0015]

As is apparent from the above description, according to the first aspect of the present invention, the connection is provided such that the opposite ends of the selectively connected printed wirings are arranged in close proximity to each other. Since the terminal patterns are respectively formed and the opposing connecting terminal patterns are selectively conductively connected by the conductive paste, the conductive paste can be surely conductively connected between the connecting terminal patterns by a well-known reflow method. Therefore, selective wiring can be easily performed by a well-known technique without using a jumper chip as in the conventional case, so that the manufacturing cost can be reduced.

According to the second aspect of the present invention, the connection is arranged close to each other at the opposite ends of the printed wiring selectively connected to the surface mounting type printed wiring board. Since the terminal patterns are formed respectively, the connection terminal patterns that are conductively connected can be conductively connected by the conductive paste by the known reflow method, and the manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a diagram showing a shape of a connection terminal pattern for selectively conductively connecting printed wirings according to an embodiment of the present invention and a soldered state.

FIG. 2 is a diagram showing a shape of a modified example of the connection terminal pattern according to the present invention.

FIG. 3 is a diagram showing a shape of a modified example of the connection terminal pattern according to the present invention.

FIG. 4 is a diagram for explaining a conventional method for selectively conductively connecting printed wiring.

FIG. 5: simply arranging each end of the selective wiring pattern in close proximity to each other,
It is a figure for demonstrating the problem when soldering.

[Explanation of symbols]

 10 ... Selected printed wiring 11a, 11b ... Printed wiring 12a, 12b ... Connection terminal pattern 13 ... Solder paste 21a, 21b ... Connection terminal pattern 22a, 22b ... Connection terminal pattern

Claims (2)

[Claims] 1. A method of selectively electrically connecting printed wirings formed on a substrate in a step of mounting a surface-mounted component on a substrate, wherein: A method of connecting selected printed wirings, characterized in that connection terminal patterns that are arranged close to each other in a state of being interleaved with each other are formed, and conductive connection is selectively performed between the opposing connection terminal patterns by a conductive paste. 2. A surface mounting type printed wiring board, wherein connection terminal patterns arranged close to each other are formed at opposite ends of a selectively connected printed wiring. And a printed wiring board.