JPH067257U - Semiconductor device - Google Patents

Abstract

(57) [Summary] [Purpose] To avoid damage to the leads during ultrasonic cleaning after board mounting. [Structure] The lead 2 is led out from a position below the center (indicated by a chain line in the drawing) of the sealing portion 1 in the height direction (on the side of the substrate). Then, the lead 2 is bent at a substantially right angle in the vicinity of the lead-out portion, and the tip portion thereof is bent again at the lower portion of the sealing portion 1.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor device in which a semiconductor chip is molded with resin, ceramics, or the like, and prevents lead damage during ultrasonic cleaning by setting the lead lead-out position below the center of the sealing portion.

[0002]

[Prior art]

 FIG. 2 is a plan view showing a conventional semiconductor device. A semiconductor chip (not shown) is sealed in a sealing portion 11 made of plastic or ceramics. A plurality of leads 12 are arranged on the side of the sealing portion 11. One end of the lead 12 is arranged in the sealing portion 11 in the vicinity of the semiconductor chip and electrically connected to an electrode provided on the semiconductor chip. Further, the lead 12 in the portion led out from the sealing portion 11 is bent at a substantially right angle in the vicinity of the lead portion, and further, the tip portion is bent so as to be parallel to the surface of the substrate 15.

This semiconductor device is mounted on the board 15 by joining the tips of the leads 12 to the pads provided on the printed board 15 with solder 16.

In the conventional semiconductor device, as shown in FIG. 2, the leads 12 are arranged at the center of the sealing portion 11 in the height direction (indicated by a chain line in the figure), or in FIG. As shown in FIG. 5, the sealing portion 11 is arranged above the center in the height direction (that is, in the direction away from the substrate).

[0005]

[Problems to be solved by the device]

 However, the above-described conventional semiconductor device has the following problems. Immediately after the semiconductor device is mounted, the printed circuit board is ultrasonically cleaned to remove solder flux and the like. In this case, the sealing portion 11 is vibrated by ultrasonic waves, stress concentrates on the lead-out portion side bent portion of the lead 12 (the portion indicated by the arrow in FIG. 2), and the lead 12 may break at this portion. is there.

The present invention has been made in view of the above problems, and an object thereof is to provide a semiconductor device capable of avoiding damage to the lead due to ultrasonic cleaning.

[0007]

[Means for Solving the Problems]

 A semiconductor device according to the present invention is a semiconductor device including a sealing portion in which a semiconductor chip is sealed, and a plurality of leads led out from the sealing portion, wherein the lead is the sealing member. It is characterized in that it is derived from the position on the board mounting side rather than the center in the height direction of the part.

[0008]

[Action]

 In the present invention, the lead is led out from the position on the board mounting side with respect to the center of the sealing portion in the height direction. Therefore, when the semiconductor device according to the present invention is mounted on a printed circuit board, the length of the lead becomes shorter than in the conventional case. As a result, even if the sealing portion vibrates during ultrasonic cleaning, the moment applied to the lead-out side bent portion of the lead becomes smaller than in the conventional case, and lead damage can be avoided.

[0009]

【Example】

 Next, embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a plan view showing a semiconductor device according to an embodiment of the present invention. A semiconductor chip (not shown) is sealed in a sealing portion 1 made of plastic, ceramics or the like, and a plurality of leads 2 are arranged on a side portion of the sealing portion 1. The tip of the lead 2 is arranged in the sealing portion 1 near the semiconductor chip, and the electrode provided on the semiconductor chip is electrically connected to the lead tip.

The lead 2 is led out from a position below the center (indicated by a chain line in the drawing) of the sealing portion 1 in the height direction (on the side of the substrate). The lead 2 is bent at a substantially right angle in the vicinity of the lead-out portion, and its tip portion is bent again at the lower portion of the sealing portion 1.

As in the conventional case, this semiconductor device is mounted on the printed circuit board 5 by joining the tips of the leads 2 to the pads provided on the printed circuit board 5 with the solder 6.

In the present embodiment, the lead 2 is led out from a portion below the center of the sealing portion 1 in the height direction. Therefore, even if the sealing portion 1 vibrates during ultrasonic cleaning, the distance L 1 between the fixed portion (soldered portion) of the substrate 5 and the lead-out side bent portion of the lead 2 is short, The moment applied to the bent portion of the lead 2 is smaller than that of the conventional one. This makes it possible to avoid damage to the lead 2.

[0014]

[Effect of device]

 As described above, in the semiconductor device according to the present invention, the leads are arranged closer to the board mounting side than the center in the height direction of the encapsulation portion, so that the lead is damaged during ultrasonic cleaning. Can be avoided.

[Brief description of drawings]

FIG. 1 is a plan view showing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a plan view showing a conventional semiconductor device.

FIG. 3 is a plan view showing another conventional semiconductor device.

[Explanation of symbols]

1, 11 ... Sealing part, 2, 12 ... Lead, 5, 15 ... Printed circuit board, 6, 16 ... Solder

Claims (1)

[Scope of utility model registration request] 1. A semiconductor device comprising: a sealing portion in which a semiconductor chip is sealed; A semiconductor device, which is derived from a position closer to the board mounting side than the center in the direction.