JPH067263U - Chip LED - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] A chip LED in which a recessed portion on a substrate on which an LED chip is to be mounted can be easily formed in a short time and with high accuracy in depth. provide. [Structure] A substrate 11, an LED chip 13 mounted in a recess 12 provided in the center of the substrate, and an LE on the substrate.
Surface mount type chip LED10 including a resin mold portion 14 formed of transparent resin so as to cover the D chip.
In, the substrate 11 is a first substrate layer 11a without holes.
And the second substrate layer 11b having a through hole in the shape of a recess, which is laminated and laminated on the first substrate layer, and the chip LED 10 is configured.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a thin surface mount type chip LED having an LED chip mounted on a substrate.

[0002]

[Prior art]

 Conventionally, such a surface-mounted chip LED is configured as shown in FIG. 4, for example. In FIG. 4, the chip LED 1 has an LED chip 3 mounted on the surface of a substrate 2 made of glass epoxy resin and fixed by die bonding or the like, and the upper surface of the LED chip 3 and the surface of the substrate 2 are fixed. A structure in which a resin molding part 5 is molded with a transparent resin so as to cover the LED chip 3 from above the substrate 2 after connecting with a bonding pad 4 provided in an adjacent region by a bonding wire 4. Has been done. However, since the LED chip 3 and the bonding wire 4 project above the substrate 2 in the chip LE D1 configured in this way, the entire chip LED 1 becomes relatively thick, so that the mounting space is large. There was a problem of becoming.

Therefore, a chip LED 1'having a thin structure as shown in FIG. 5 is also known. That is, in FIG. 5, a chip LED 1'is provided with a recess 2a in the central region of the surface of a substrate 2 made of glass epoxy resin or the like, and the LED chip 3 is placed in the recess 2a to The LED chip 3 is fixed by bonding or the like, and the upper surface of the LED chip 3 and a bonding pad provided in an adjacent region of the surface of the substrate 2 are connected by a bonding wire 4, and then the LED chip 3 is mounted on the substrate 2. Is formed by molding the resin mold portion 5 with a transparent resin so as to cover the.

According to the chip LED 1 ′ configured as above, since the LED chip 3 is placed in the recessed portion 2 a provided on the substrate 2, the upper surface of the LED chip 3 is the substrate 2 The level difference with respect to the surface is reduced, or the height is almost the same. Therefore, when the upper surface of the LED chip 3 and the bonding pad provided in the area adjacent to the surface of the substrate 2 are connected by wire bonding, this bonding wire is not much above the surface of the substrate 2. Does not stick out. Thus, the entire chip LED 1'can be configured to be relatively thin, and since the LED chip 3 is located in the recess 2a on the substrate 2, the light emitted from the LED chip 3 can be obtained. Is reflected by the side wall of the recessed portion 2a, so that it travels upward and the luminous efficiency is also improved.

[0005]

[Problems to be solved by the device]

 By the way, in the chip LED 1 ′ having such a configuration, when the recessed portion 2 a is provided in the central area of the surface of the substrate 2, a hole is drilled in the central area of the surface of the substrate 2 using a drill or the like. By performing the opening, the concave portion 2a is formed by so-called counterboring.

However, since the thickness of the substrate 2 is normally about 0.5 mm due to the thinning, it is impossible to accurately process the depth of the recessed portion 2a by the spot facing by drilling. there were. Further, it is more difficult to provide the recessed portion 2a having a complicated shape.

In view of the above points, the present invention has a low cost because the concave portion on the substrate on which the LED chip is to be mounted is formed simply and in a short time and with high precision in depth. It is an object to provide a chip LED as manufactured.

[0008]

[Means for Solving the Problems]

 In order to achieve the above object, a chip LED according to the present invention is formed of a substrate, an LED chip placed in a recess provided in the center of the substrate, and a transparent resin formed on the substrate so as to cover the LED chip. A second resin layer having a through hole in the form of a recess formed by laminating the first substrate layer without holes and the first substrate layer on the first substrate layer. It is characterized in that it is composed of a substrate layer of.

[0009]

[Action]

 According to the above configuration, the concave portion provided in the center of the surface of the substrate is defined by the through hole provided in the second substrate layer by bonding the first substrate layer and the second substrate layer together. Since the depth of the recess is determined by the thickness of the second substrate layer, the recess can be formed with high accuracy and the recess can be processed with respect to the second substrate layer. Since it suffices to open the through hole without adjusting the working depth by means of machining, the work can be completed easily and in a short time. Therefore, even when processing a recess having a complicated shape, the processing can be easily performed.

[0010]

【Example】

 Hereinafter, the present invention will be described in detail based on the embodiments shown in the drawings. FIG. 1 shows an embodiment of a chip LED according to the present invention. A chip LED 10 is mounted on a substrate 11 made of glass epoxy or the like and a recess 12 formed in the center of the substrate 11 and a die. The LED chip 13 is fixed by bonding or the like, and the upper surface of the LED chip 13 is connected to a bonding pad or the like provided in an area adjacent to the surface of the substrate 11 by a bonding wire. And a resin mold portion 14 formed of a transparent resin so as to cover 13 and on both sides of the substrate 11, an anode as an extraction electrode formed of a conductive pattern formed on the substrate 11 and the like. 15 and a cathode 16 are provided.

The above-mentioned configuration is similar to that of the conventional chip LED 1 ′ shown in FIG. 5, but in the chip LED 10 according to the present invention, the substrate 11 is the lower first substrate layer 11 a. , And a second substrate layer 11b laminated and laminated on the first substrate layer 11a. The first substrate layer 11a is formed without a hole, and the second substrate layer 11b is formed with a through hole in the shape of the recess 12. Therefore, when the first substrate layer 11a and the second substrate layer 11b are bonded together, the recess 12 defined near the center of the surface of the substrate 11 is equal to the thickness of the second substrate layer 11b. Will have depth. For example, when a substrate having a thickness of 0.2 mm is used for the first substrate layer 11a and a substrate having a thickness of 0.3 mm is used for the second substrate layer 11b, the depth of the recess 12 is The depth is exactly the same as the thickness of the second substrate layer 11b, that is, 0.3 mm 2.

The first substrate layer 11a and the second substrate layer 11b are adapted to be adhered by, for example, applying an adhesive between them.

The surface mount LED 10 according to the present invention is configured as described above, and since the LED chip 13 is placed in the recess 12 of the substrate 11, the upper surface of the LED chip 13 is The level difference with respect to the surface of the substrate 11 is reduced or becomes almost the same height. Therefore, when the upper surface of the LED chip 13 and the bonding pad provided in the adjacent region of the surface of the substrate 11 are connected by wire bonding, this bonding wire is not much above the surface of the substrate 11. Do not stick out. Therefore, the entire chip LED 10 can be configured to be relatively thin, and the depth of the recess 12 can be defined with high accuracy.

Thus, the light emitted upward from the LED chip 13 is directly emitted from the resin mold portion 14 to the outside, and the light emitted laterally from the LED chip 13 is recessed in the substrate 11. It is reflected by hitting the side wall of the portion 12, that is, the side wall of the second substrate layer 11b, and then goes upward to emit from the resin mold portion 14 to the outside.

FIG. 3 shows another embodiment of the chip LED according to the present invention. The chip LED 20 is a chip LED which constitutes an LED array used for a line-shaped light source or the like. A recess 22 extending in one direction is provided in the recess 22, and the LED chips 23 are mounted in a line in the recess 22. Here, the substrate 21 is similarly composed of a lower first substrate layer 21a having no holes and a second substrate layer 21b having a through hole corresponding to the upper recess 22. Therefore, since the recessed portion 22 is obtained by processing the through hole in the second substrate layer 21b, the recessed portion 22 can be easily processed even in the elongated shape as shown in the drawing.

[0016]

[Effect of device]

 As described above, according to the present invention, the recess formed in the center of the surface of the substrate is bonded to the first substrate layer and the second substrate layer, and the through hole provided in the second substrate layer is formed. Since the depth is defined by the above, the depth of the recess is determined by the thickness of the second substrate layer, so that the recess is formed with high precision. In addition, the recessed part can be processed simply by opening a through hole without adjusting the processing depth of the second substrate layer, which means that the work can be completed easily and in a short time. Even when processing a recess having a complicated shape, the processing can be easily performed, and the manufacturing cost can be reduced. Thus, according to the present invention, the concave portion on the substrate on which the LED chip is to be mounted can be formed easily in a short time and with high accuracy in terms of depth, and thus can be manufactured at low cost. Chip LEDs are provided.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of a chip LED according to the present invention.

FIG. 2 is a schematic cross-sectional view of the chip LED of FIG.

FIG. 3 is a perspective view of an essential part showing another embodiment of the chip LED according to the present invention.

FIG. 4 is a schematic sectional view showing an example of a conventional chip LED.

FIG. 5 is a schematic sectional view showing another example of a conventional chip LED.

[Explanation of symbols]

 10 chip LED 11 board | substrate 11a 1st board | substrate layer 11b 2nd board | substrate layer 12 recessed part 13 LED chip 14 resin mold part 20 chip LED 21 board | substrate 21a 1st board | substrate layer 21b 2nd board | substrate layer 22 recessed part 23 LED chip

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Toshiharu Mikawa, Toshiharu Mikawa 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd. (72) Naofumi Nomura 1149, Tohocho, Midori-ku, Yokohama, Kanagawa Prefecture (72) Inventor, Ito Tata Keio 1034-1 Tetsumachi, Midori-ku, Yokohama-shi, Kanagawa Prefecture

Claims (1)

[Scope of utility model registration request] 1. A substrate, a LED chip placed in a recessed portion provided in the center of the substrate, and a resin mold part formed of a transparent resin so as to cover the LED chip on the substrate. In the surface-mounted chip LED, the substrate is a first substrate layer having no holes, and a second substrate layer having a through hole in the shape of a recessed portion which is laminated and laminated on the first substrate layer. A chip LED, comprising: