JPH0680890B2 - Board connection method - Google Patents
Board connection methodInfo
- Publication number
- JPH0680890B2 JPH0680890B2 JP58180128A JP18012883A JPH0680890B2 JP H0680890 B2 JPH0680890 B2 JP H0680890B2 JP 58180128 A JP58180128 A JP 58180128A JP 18012883 A JP18012883 A JP 18012883A JP H0680890 B2 JPH0680890 B2 JP H0680890B2
- Authority
- JP
- Japan
- Prior art keywords
- connecting portion
- connection
- substrate
- holes
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は、フレキシブル基板とリジツト基板とを半田付
けにより電気的に接続する方法に関する。Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for electrically connecting a flexible substrate and a rigid substrate by soldering.
近年、機器の小型化に伴ない基板収納スペースあるいは
基板上への部品実装密度等の理由から、例えば90度の傾
きを保つよう基板を曲げて使用する必要性が生じてき
た。そこで、フレキシブル基板を用いてその曲げに対応
するようにすることが考えられた。しかし、一般にフレ
キシブル基板は材料として用いられるフイルムが高価で
あると共に、単純な形状で大型な基板を形成するには不
適であるので、フレキシブル基板のみで全体の基板を構
成することは問題であつた。In recent years, it has become necessary to bend the board so as to keep the inclination of 90 degrees, for example, because of the space for housing the board or the density of mounting the parts on the board as the device becomes smaller. Therefore, it has been considered to use a flexible substrate to cope with the bending. However, in general, a flexible substrate is expensive as a material and is not suitable for forming a large substrate with a simple shape, so that it is a problem to configure the entire substrate with only the flexible substrate. .
そこで、曲げを必要とする部分の基板のみフレキシブル
基板で構成し、曲げを必要としない部分をリジツト基板
で構成し、双方の基板を接続する方法が考えられた。リ
ジツト基板はガラスエポキシ、紙エポキシ、紙フエノー
ル、セラミツク等の硬質部材から成る硬質基板である。Therefore, a method has been considered in which only the portion of the substrate that needs to be bent is made of a flexible substrate, and the portion that does not need to be bent is made of a rigid substrate, and both the substrates are connected. The rigid substrate is a hard substrate made of a hard material such as glass epoxy, paper epoxy, paper phenol, ceramics.
従来のこの種の接続方法による基板接続は第１図に示す
ようなものである。１はフレキシブル基板、２はリジツ
ト基板である。フレキシブル基板１には補強板４を介し
て抵抗、コンデンサ等の電気部品５が実装されており、
リジツト基板２には直接電気部品６が実装されている。
これら基板1,2は半田３により電気的に接続されると共
に固定されている。この両基板1,2の接続構造を詳細に
示したのが第２図である。The conventional board connection by this kind of connection method is as shown in FIG. Reference numeral 1 is a flexible board, and 2 is a rigid board. Electrical components 5 such as resistors and capacitors are mounted on the flexible substrate 1 via a reinforcing plate 4,
The electric component 6 is directly mounted on the rigid board 2.
These substrates 1 and 2 are electrically connected and fixed by a solder 3. FIG. 2 shows the connection structure of the two substrates 1 and 2 in detail.
フレキシブル基板１にはその端部のカバーコート10が除
去され銅はくパターン７が露出されて第１の接続部が形
成されている。又リジツト基板２にはその端部にそのリ
ジツト基板２に設けられソルダレジスト12で保護された
銅はくパターンと接続されるランド８が設けられ、その
ランド８が第２の接続部として形成されている。そし
て、これら第１及び第２の接続部が半田９によつて電気
的に接続されると共に機械的に接続される。ところで、
フレキシブル基板１の第１の接続部の接続長t2は、リジ
ツト基板２の第２の接続部の接続長t3よりも短くなつて
いる。これは、両接続部の重なり合わない第２の接続部
の一部分（余剰部）（接続長t1＝t3−t2）で両基板1,2
を半田接続したときの余剰半田を吸収するためであるか
らである。又、この余剰半田は組立者が組立て時に基板
1,2間の接続を確認するのに役立つている。On the flexible substrate 1, the cover coat 10 at the end thereof is removed and the copper foil pattern 7 is exposed to form a first connection portion. Further, the rigid substrate 2 is provided at its end with a land 8 connected to the copper foil pattern provided on the rigid substrate 2 and protected by the solder resist 12, and the land 8 is formed as a second connecting portion. ing. Then, the first and second connecting portions are electrically connected and mechanically connected by the solder 9. by the way,
The connection length t 2 of the first connecting portion of the flexible substrate 1 is shorter than the connection length t 3 of the second connecting portion of the rigid substrate 2. This is a part (excess part) (connection length t 1 = t 3 −t 2 ) of the second connection part where both connection parts do not overlap with each other.
This is because it absorbs excess solder when soldering is performed. In addition, this excess solder is used by the assembler when assembling the board.
It is useful to check the connection between 1 and 2.
しかしながら、このような従来の接続方法によると余剰
半田が流れ込む余剰部の接続長t1を長くしないと半田付
け時にこの余剰半田が隣接する接続部の余剰半田と接触
あるいは結合していわゆるブリツジを形成してしまう。
このようなブリツジ形成を防止するために余剰部の接続
長t1を長くする必要、つまり第２の接続部を長くする必
要がある。よつて、リジツト基板２の端部の広い部分を
この第２の接続部として使用せねばならず、リジツト基
板２の電気部品の実装部分が減り、実装効率が低下して
しまつた。又、両基板1,2を半田によりのみ接続してい
るので、何らかの外力によりその接続が断すること及び
接続部の銅はくパターンが剥離することを防止するため
に接続長t2を長くする必要があり、前述同様実装効率を
低下させてしまつた。更に、フレキシブル基板１とリジ
ツト基板２とを密着させると、余剰部の接続長t1を長く
しても完全にブリツジ形成を防止することができないの
で、これら基板1,2の間隔を例えば10〜30μｍ程度に制
御する必要があつた。However, according to such a conventional connecting method, if the connection length t 1 of the excess portion into which the excess solder flows is not increased, the excess solder contacts or joins with the excess solder of the adjacent connection portion to form a so-called bridge. Resulting in.
In order to prevent such bridging, it is necessary to lengthen the connection length t 1 of the surplus portion, that is, the second connection portion. Therefore, a wide end portion of the rigid board 2 must be used as the second connecting portion, so that the mounting portion of the electric component of the rigid board 2 is reduced and the mounting efficiency is lowered. Also, since both boards 1 and 2 are connected only by solder, the connection length t 2 is increased to prevent the connection from being broken by some external force and the copper foil pattern of the connection portion from being peeled off. It is necessary to reduce the mounting efficiency as described above. Furthermore, if the flexible substrate 1 and the rigid substrate 2 are brought into close contact with each other, the bridging cannot be completely prevented even if the connection length t 1 of the surplus portion is increased. It was necessary to control to about 30 μm.
又、不完全接続が生じた場合、従来の接続方法では、半
田を融解して基板1,2の接続を断とした後、再び半田接
続をやり直さねばならずその作業が面倒であり、接続作
業の効率も低下してしまつた。更にフレキシブル基板１
のある銅はくパターン７が接続部付近で断線した場合
も、容易に補修することができないので、そのフレキシ
ブル基板１を交替しなければならず、基板1,2の接続作
業の効率が低下してしまつた。Also, if incomplete connection occurs, the conventional connection method requires melting the solder to disconnect the boards 1 and 2 and then re-connecting the solder, which is a troublesome work. The efficiency of has also decreased. Flexible substrate 1
Even if the copper foil pattern 7 with a wire breaks near the connection, it cannot be easily repaired, so the flexible board 1 must be replaced, and the efficiency of the connection work of the boards 1 and 2 is reduced. Teshima Tsuta.
本発明は上記事情に着目してなされたもので基板上の実
装効率が向上され小型化に最適であると共に接続強度・
接続の信頼性も向上し保守性も良好な基板接続方法を提
供することを目的とする。The present invention has been made by paying attention to the above circumstances. The mounting efficiency on the board is improved, and it is optimal for downsizing and the connection strength and
It is an object of the present invention to provide a board connecting method with improved connection reliability and good maintainability.
そこで本発明は、第１の接続部及び第２の接続部のうち
少なくとも一方にスルーホールを設け、前記第１の接続
部及び前記第２の接続部のうち互いに対向する部分に半
田を施し、前記第１の接続部と前記第２の接続部とを対
向させ、さらに前記第１の接続部と前記第２の接続部と
に熱を加えて前記半田を溶融させて前記第１の接続部と
前記第２の接続部とを接続することにより上記目的を達
成した。Therefore, in the present invention, a through hole is provided in at least one of the first connecting portion and the second connecting portion, and solder is applied to portions of the first connecting portion and the second connecting portion that face each other, The first connecting portion and the second connecting portion are opposed to each other, and heat is further applied to the first connecting portion and the second connecting portion to melt the solder and thereby the first connecting portion. The above-mentioned object is achieved by connecting the second connecting portion and the second connecting portion.
以下図面を参照しながら本発明を詳説する。 Hereinafter, the present invention will be described in detail with reference to the drawings.
第３図は本発明の一実施例による接続構造を示した図で
あり、第２図と同一要部には同一符号を付しその説明は
省略する。フレキシブル基板１の端部は、カバーコート
10が除去されて銅はくパターン７が露出され、その部分
に半スルーホール14が設けられ、第１の接続部が形成さ
れている。又、リジツト基板２の端部にはこの第１の接
続部と対応するように、ランド８とランド８に全スルー
ホール13とが設けられ、第２の接続部が形成されてい
る。半スルーホールは裏面側にランドが設けられないも
ので、全スルーホールは裏面側にランドが設けられたも
のである。そして、これら第１及び第２の接続部が半田
９によつて電気的、機械的に接続され、半田付けをする
際、加熱された半田はスルーホール13,14に流れ込む。
この際、スルーホール13、14とは若干ずれを持つて配設
される。FIG. 3 is a view showing a connection structure according to an embodiment of the present invention, and the same parts as those in FIG. 2 are designated by the same reference numerals and their description will be omitted. The end of the flexible substrate 1 has a cover coat
The copper foil pattern 7 is exposed by removing 10 and a half through hole 14 is provided in that portion to form a first connection portion. Further, at the end of the rigid substrate 2, a land 8 and all through holes 13 are provided in the land 8 so as to correspond to the first connecting portion, and a second connecting portion is formed. The half through holes have no land on the back surface side, and all the through holes have land on the back surface side. Then, the first and second connecting portions are electrically and mechanically connected by the solder 9, and when soldering, the heated solder flows into the through holes 13 and 14.
At this time, the through holes 13 and 14 are arranged with a slight deviation.
ところで、フレキシブル基板１の第１の接続部の接続長
t2′はリジツト基板２の第２の接続部の接続長t3′より
も短くなつている。これは両接続部の重なり合わない第
２の接続部の余剰部（接続長t1′＝t3′−t2′）で、半
田接続時の余剰半田を吸収するためからである。しか
し、本構造によれば余剰半田がスルーホール13,14に流
れ込むので、この余剰部の接続長t1′は従来のものに比
べ短かくて済む。又、各接続部の中央付近に設けられた
スルーホール13,14で半田を吸収しているので、半田が
多少多目であつても隣接する接続部間の余剰半田との接
触あるいは結合によるブリツジの形成を防止することが
できる。更にスルーホール13,14を用いて接続を行なつ
ているので第１及び第２の接続部の接続長t2′，t1′を
従来のものに比べ短かくすることができ、基板上の電気
部品の実装効率を向上させることもできる。更に又、何
らかの外力を受けてもスルーホールを用いているため第
１及び第２の接続部の銅はくパターンが基板1,2より剥
離することもなくなる。特にスルーホール13のように全
スルーホールであれば銅はくパターンの剥離に対しての
強度はより強くなる。By the way, the connection length of the first connection portion of the flexible substrate 1
t 2 ′ is shorter than the connection length t 3 ′ of the second connection portion of the rigid board 2. This is because the surplus portion (connection length t 1 ′ = t 3 ′ −t 2 ′) of the second connection portion where the both connection portions do not overlap absorbs the excess solder at the time of solder connection. However, according to this structure, since the excess solder flows into the through holes 13 and 14, the connection length t 1 ′ of this excess portion can be shorter than that of the conventional one. Further, since the through holes 13 and 14 provided near the center of each connection portion absorb the solder, bridging due to contact or coupling with the excess solder between the adjacent connection portions even if the amount of solder is somewhat large. Formation can be prevented. Further, since the connection is made by using the through holes 13 and 14, the connection lengths t 2 ′ and t 1 ′ of the first and second connection portions can be made shorter than those of the conventional one, and the connection length on the substrate can be reduced. It is also possible to improve the mounting efficiency of electric components. Furthermore, even if some external force is applied, the copper foil patterns of the first and second connecting portions are not separated from the substrates 1 and 2 because the through holes are used. In particular, if all through holes like the through hole 13, the strength against peeling of the copper foil pattern becomes stronger.
さて、本実施例によれば、接続する際に半田の加熱むら
等により不完全接続が生じる。例えば、加熱用の大形コ
テで全接続部を一斉に半田付けする場合、放熱によりし
ばしば基板1,2の両端部付近の接続部が不完全接続とな
る。その場合、その不完全接続の生じた接続部のスルー
ホール13,14に加熱溶融された半田を流し込むことによ
り容易に補修でき、不完全接続を解消することができ
る。特にリジツト基板２のスルーホール13から補修のた
めに半田を流し込むようにすれば、フレキシブル基板１
のように熱に弱く変形等が容易に生じることがないの
で、リジツト基板２自体を損なうことはなく有利であ
る。又、フレキシブル基板１のある銅はくパターン７が
接続部付近で断線した場合も、スルーホール13,14にジ
ヤンパ線を半田付けすることにより容易に補修すること
ができ有利である。Now, according to this embodiment, incomplete connection occurs due to uneven heating of the solder when connecting. For example, when all the connecting parts are soldered together with a large iron for heating, the connecting parts near both ends of the substrates 1 and 2 are often incompletely connected due to heat dissipation. In that case, it is possible to easily repair by pouring the heat-melted solder into the through holes 13 and 14 of the connection portion where the incomplete connection occurs, and it is possible to eliminate the incomplete connection. In particular, if solder is poured from the through hole 13 of the rigid board 2 for repair, the flexible board 1
As described above, since it is vulnerable to heat and is not easily deformed, the rigid substrate 2 itself is not damaged and is advantageous. Further, even if the copper foil pattern 7 on the flexible substrate 1 is broken near the connecting portion, it is advantageous that soldering can be easily performed by soldering jumper wires to the through holes 13 and 14.
尚、両基板1,2の接続部間の接続状態の確認は、スルー
ホール13,14に流れ込んでいる半田を見ることで行なう
ことができ、又、これら接続部の接続箇所を直接確認で
きるので誤確認を低減することもできる。It should be noted that the connection state between the connection portions of both boards 1 and 2 can be confirmed by observing the solder flowing into the through holes 13 and 14, and the connection locations of these connection portions can be directly confirmed. False confirmations can also be reduced.
第４図は本発明の他の実施例による接続構造を示した図
であり、第３図と同一の要部には同一の符号を付しその
説明は省略する。本接続構造では、フレキシブル基板１
のスルーホール24とリジツト基板２のスルーホール23と
を所定間隔で設けてその位置を略一致させて配設し半田
接続を行ない、フレキシブル基板１のカバーコート10の
端部とリジツト基板２の端部とを接着剤で固着してい
る。又、本接続構造では、リジツト基板２の第２の接続
部の接続長t3″を短かくして余剰半田の殆んどをスルー
ホール23,24で吸収するようにしている。このように本
実施例による接続構造であれば、接続部の接続長をより
短かくすることができるので、より基板上の電気部品の
実装効率が向上する。FIG. 4 is a view showing a connection structure according to another embodiment of the present invention. The same parts as those in FIG. 3 are designated by the same reference numerals, and the description thereof will be omitted. In this connection structure, the flexible substrate 1
Through holes 23 of the rigid board 2 and the through holes 23 of the rigid board 2 are arranged at substantially the same positions so as to be soldered, and the end of the cover coat 10 of the flexible board 1 and the end of the rigid board 2 are connected. The parts are fixed to each other with an adhesive. Further, in this connection structure, the connection length t 3 ″ of the second connection portion of the rigid board 2 is made short so that most of the excess solder is absorbed by the through holes 23 and 24. Thus, the present embodiment With the connection structure according to the example, the connection length of the connection portion can be further shortened, so that the mounting efficiency of the electric components on the substrate is further improved.
第５図は本発明の更に他の実施例による接続構造を示し
た断面図であり、第４図と同一の要部には同一の符号を
付しその説明は省略する。本接続構造は第３図の接続構
造と略同様であり、異なる点はリジット基板２の第２の
接続部のスルーホール33の近傍に設けられたスルーホー
ル17と、スルーホール33,34とに電気部品16のリード線
を挿入し半田付けをしたことである。このように本実施
例による接続構造であれば、両接続部をリード線を介し
て接続しているのでより両基板1,2間の接続強度が向上
する。又、このリード線をスルーホール33,34の位置合
わせに用いることができるので、この位置合わせが容易
となる。更に、接続部のスルーホール33,34を電気部品1
6の接続用スルーホールとして兼用しているので、更に
一層基板上の電気部品の実装効率が向上する。FIG. 5 is a cross-sectional view showing a connection structure according to still another embodiment of the present invention. The same parts as those in FIG. 4 are designated by the same reference numerals, and the description thereof will be omitted. This connection structure is substantially the same as the connection structure shown in FIG. 3, except that the through hole 17 provided in the vicinity of the through hole 33 of the second connection portion of the rigid substrate 2 and the through holes 33, 34 are different. That is, the lead wire of the electric component 16 was inserted and soldered. In this way, in the connection structure according to the present embodiment, since both connection parts are connected via the lead wire, the connection strength between both substrates 1 and 2 is further improved. Further, since this lead wire can be used for alignment of the through holes 33, 34, this alignment becomes easy. Further, the through holes 33, 34 of the connecting portion are connected to the electric component 1
Since it is also used as a through hole for connection of 6, the mounting efficiency of electrical components on the substrate is further improved.
第６図は本発明の更に他の実施例による接続構造を示す
平面図であり、第３図と同一の要部には同一の符号を付
しその説明は省略する。フレキシブル基板１の銅はくパ
ターン７と接続される第１の接続部の１つのみにスルー
ホールが設けられ、銅はくパターン７と接続されない第
１の接続部にスルーホール20,21が設けられている。
尚、フレキシブル基板１の他の接続部にはスルーホール
は設けられていない。リジツト基板１の第２の接続部
（ランド８）には全てスルーホールが設けられ、この中
に銅はくパターンと接続されない接続部（ランド23）が
１つ設けられている。FIG. 6 is a plan view showing a connection structure according to still another embodiment of the present invention. The same parts as those in FIG. 3 are designated by the same reference numerals and the description thereof will be omitted. A through hole is provided only in one of the first connecting portions of the flexible substrate 1 that is connected to the copper foil pattern 7, and through holes 20 and 21 are provided in the first connecting portion that is not connected to the copper foil pattern 7. Has been.
No through hole is provided in the other connecting portion of the flexible substrate 1. Through holes are provided in all of the second connecting portions (lands 8) of the rigid substrate 1, and one connecting portion (land 23) not connected to the copper foil pattern is provided therein.
本実施例は、スルーホールの位置合わせを行なうコの字
形の金属棒30をスルーホール20,21に挿入した後半田付
を行なつている。よつて本実施例による接続構造であれ
ば、両接続部をコの字形の金属棒30を介して接続してい
るのでより両基板1,2間の接続強度が向上する。In this embodiment, a U-shaped metal rod 30 for aligning the through holes is inserted into the through holes 20 and 21 and then soldered. Therefore, in the connection structure according to the present embodiment, since both connection parts are connected via the U-shaped metal rod 30, the connection strength between both substrates 1 and 2 is further improved.
尚、本発明は上述した実施例に限られるものではなく、
一方の基板1,2の一部の接続部にスルーホールを設けて
も良いし、又スルーホールの形状等（例えば穴の形や
数）を任意に設定しても良い。The present invention is not limited to the above-mentioned embodiment,
A through hole may be provided in a part of the connecting portion of one of the substrates 1 and 2, or the shape of the through hole (for example, the shape and number of holes) may be set arbitrarily.
以上のように本発明によれば、両基板の接続部間に設け
られた半田を溶融させたとき、溶融した余剰半田の逃げ
道としてスルーホールを設けてあるので、隣接する接続
部への余剰半田のはみだしを防止して隣接する接続部と
の間にブリツジが形成されることを防止することができ
る。言い換えれば基板の盤面方向への余剰半田のはみだ
しをを極力少なくすることができるので、接続部の接続
長を短かくでき基板上の電気部品の実装効率が向上し小
型化に適すると共に、接続部分の銅はくパターン等の金
属膜の剥離を防止することができ、かつ接続強度も向上
する。又、不完全接続が生じた場合にはスルーホールに
加熱溶融された半田を流し込むことで補修でき、フレキ
シブル基板の銅はくパターンが接続部付近で断線した場
合にもスルーホールにジヤンパ線を接続することで補修
できるので、保守性及び作業能率が向上する。更に、接
続確認を接続箇所であるスルーホールをみることで行な
えるので誤確認も低減できる。As described above, according to the present invention, when the solder provided between the connection portions of both boards is melted, the through hole is provided as an escape route for the melted excess solder. It is possible to prevent the protrusion of the bridging and to prevent the formation of a bridge between the adjacent connecting portion. In other words, it is possible to minimize the protrusion of excess solder in the board direction of the board, so that the connection length of the connection part can be shortened and the mounting efficiency of electrical parts on the board is improved, making it suitable for downsizing and the connection part. The peeling of the metal film such as the copper foil pattern can be prevented, and the connection strength is also improved. In addition, if incomplete connection occurs, it can be repaired by pouring the heated and melted solder into the through hole, and even if the copper foil pattern of the flexible board is broken near the connection part, connect the jumper wire to the through hole. By doing so, maintenance is possible and work efficiency is improved. Furthermore, since the connection can be confirmed by observing the through hole, which is the connection point, erroneous confirmation can be reduced.
第１図は従来の基板接続方法による基板接続構造を示す
図、第２図（ａ），（ｂ）はその詳細接続構造を示す平
面図及び断面図、第３図（ａ），（ｂ）は本発明の一実
施例による基板接続構造を示す平面図及び断面図、第４
図（ａ），（ｂ）は本発明の他の実施例による基板接続
構造を示す平面図及び断面図、第５図は本発明の更に他
の実施例による基板接続構造を示す断面図、第６図は本
発明の更に他の実施例による基板接続構造を示す平面図
である。 １……フレキシブル基板、２……リジツト基板、７……
銅はくパターン、8,23……ランド、９……半田、10……
カバーコート、12……ソルダレジスト、13,14,20,21,2
3,24,33,34……スルーホール、16……電子部品、30……
コの字形の金属棒FIG. 1 is a diagram showing a substrate connecting structure by a conventional substrate connecting method, FIGS. 2 (a) and 2 (b) are plan views and sectional views showing the detailed connecting structure, and FIGS. 3 (a) and 3 (b). FIG. 4 is a plan view and a cross-sectional view showing a substrate connection structure according to an embodiment of the present invention.
5A and 5B are a plan view and a sectional view showing a substrate connecting structure according to another embodiment of the present invention, and FIG. 5 is a sectional view showing a substrate connecting structure according to still another embodiment of the present invention. FIG. 6 is a plan view showing a substrate connecting structure according to still another embodiment of the present invention. 1 ... Flexible substrate, 2 ... Rigid substrate, 7 ...
Copper foil pattern, 8,23 …… Land, 9 …… Solder, 10 ……
Cover coat, 12 …… Solder resist, 13,14,20,21,2
3,24,33,34 …… Through hole, 16 …… Electronic parts, 30 ……
U-shaped metal rod
───────────────────────────────────────────────────── フロントページの続き (72)発明者 市川 友久 東京都日野市旭が丘３丁目１番地の１ 東 京芝浦電気株式会社日野工場内 (56)参考文献 特開 昭53−93365（ＪＰ，Ａ) 特開 昭57−121297（ＪＰ，Ａ) 特開 昭58−48492（ＪＰ，Ａ) 特開 昭59−186388（ＪＰ，Ａ) 特公 昭55−42520（ＪＰ，Ｂ２) 特公 昭59−46119（ＪＰ，Ｂ２) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tomohisa Ichikawa 3-1, Asahigaoka, Hino City, Tokyo 1 Higashi Factory, Tokyo Shibaura Electric Co., Ltd. (56) Reference JP-A-53-93365 (JP, A) JP-A-57-121297 (JP, A) JP-A-58-48492 (JP, A) JP-A-59-186388 (JP, A) JP-B-55-42520 (JP, B2) JP-B-59-46119 (JP, B2)
Claims (4)
部とリジット基板に設けられた第２の接続部とを接続す
る基板接続方法において、前記第１の接続部及び前記第
２の接続部のうち少なくとも一方にスルーホールを設
け、前記第１の接続部及び前記第２の接続部のうち対向
する部分に半田を施し、前記第１の接続部と前記第２の
接続部とを対向させ、さらに前記第１の接続部と前記第
２の接続部とに熱を加えて前記半田を溶融させて前記第
１の接続部と前記第２の接続部とを接続することを特徴
とする基板接続方法。1. A substrate connecting method for connecting a first connecting portion provided on a flexible substrate and a second connecting portion provided on a rigid substrate, wherein the first connecting portion and the second connecting portion are provided. A through hole is provided in at least one of the first connecting portion and the second connecting portion, and solder is applied to opposing portions of the first connecting portion and the second connecting portion so that the first connecting portion and the second connecting portion face each other. And a substrate which is characterized in that heat is applied to the first connecting portion and the second connecting portion to melt the solder and connect the first connecting portion and the second connecting portion. How to connect.
のスルーホールを所定間隔で設け、前記第１の接続部の
各スルーホールの位置と前記第２の接続部の各スルーホ
ールの位置とが略一致するように接続したことを特徴と
する特許請求の範囲第（１）項記載の基板接続方法。2. A plurality of through holes are provided at predetermined intervals in both the first connecting portion and the second connecting portion, the positions of the through holes of the first connecting portion and the through holes of the second connecting portion. The substrate connecting method according to claim (1), wherein the connection is made so that the positions of the holes substantially coincide with each other.
１の接続部と第２の接続部とを接続するようにしたこと
を特徴とする特許請求の範囲第（２）項記載の基板接続
方法。3. A substrate according to claim 2, wherein a metal rod member is inserted into the through hole to connect the first connecting portion and the second connecting portion. How to connect.
の金属部材を挿入して第１の接続部と第２の接続部とを
接続することを特徴とする特許請求の範囲第（２）項又
は第（３）項記載の基板接続方法。4. A first connecting portion and a second connecting portion are connected by inserting a U-shaped metal member into at least two through holes, and the first connecting portion and the second connecting portion are connected to each other. Alternatively, the board connecting method according to the item (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58180128A JPH0680890B2 (en) | 1983-09-30 | 1983-09-30 | Board connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58180128A JPH0680890B2 (en) | 1983-09-30 | 1983-09-30 | Board connection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6074494A JPS6074494A (en) | 1985-04-26 |
| JPH0680890B2 true JPH0680890B2 (en) | 1994-10-12 |
Family
ID=16077904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58180128A Expired - Lifetime JPH0680890B2 (en) | 1983-09-30 | 1983-09-30 | Board connection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680890B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006100566A (en) * | 2004-09-29 | 2006-04-13 | Toshiba Corp | Printed wiring board structure and electronic equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5393365A (en) * | 1977-01-28 | 1978-08-16 | Gen Corp | Method of and device for connecting flexible board to other board |
| JPS5542520A (en) * | 1978-09-18 | 1980-03-25 | Okamura Shokuhin Kogyo:Kk | Overall tasty nourishing food |
| JPS57121297A (en) * | 1981-01-20 | 1982-07-28 | Sharp Kk | Method of producing composite printed board |
| JPS5848492A (en) * | 1981-09-16 | 1983-03-22 | 株式会社富士通ゼネラル | Flexible printed wiring board and its solder connection method |
| JPS5946119A (en) * | 1982-09-07 | 1984-03-15 | Fuji Electric Corp Res & Dev Ltd | Working piece of electromagnetic stirring and mixing treatment apparatus |
| JPS59186388A (en) * | 1983-04-07 | 1984-10-23 | 三菱電機株式会社 | Method of connecting printed board |
-
1983
- 1983-09-30 JP JP58180128A patent/JPH0680890B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6074494A (en) | 1985-04-26 |
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