JPH0687472B2 - Film carrier tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to a film carrier tape used in a TAB (Tape Automated Bonding) system.

<Prior Art> FIG. 5 is a plan view of a main part of a conventional film carrier tape of a TAB system, and FIG. 6 is a sectional view taken along line VI-VI of FIG. In these figures, reference numeral 1 indicates a main part of the film carrier tape. The film carrier tape 1 includes a flexible tape base material 2.
A square center device hole 3 for mounting a semiconductor chip is provided at the center of the tape substrate 2 in the width direction (vertical direction in the figure), and the center device hole 3 is vertically surrounded by the center device hole 3 so as to surround the center device hole 3. , Outer lead holes 4 are formed at four positions on the left and right.

Center device hole 3 and outer lead hole 4 of tape base material 2
A portion between and is a support tape portion 5, and the support tape portion 5 is integrally connected to the tape base material 1 outside the outer lead hole 4 via a bridge portion 6. On the surface of the tape base material 1, a plurality of lead terminals 7 are arranged radially around the center device hole 3 via the support tape portion 5 and the outer lead hole 4. The inner end portion of each lead terminal 7 is an inner lead portion 7a facing the center device hole 3 and connected to the protruding electrode 11 provided on the semiconductor chip 10.

A portion of the lead terminal 7 which faces the outer lead hole 4 is an outer lead portion 7b which is bonded to a substrate (not shown), a lead frame or the like. Further, the operation of the semiconductor chip 10 is examined outside the outer lead portion 7b. It is used as a test pad portion 7c.

Reference numeral 12 is a perforation hole for positioning and tape feeding at the time of bonding the semiconductor chip 10 and forming the pattern of the lead terminal 7.

In order to mount the film carrier tape 1 having the above-described structure, to which the semiconductor chip 10 is attached, on a substrate, a lead frame, or the like (not shown), first, the outer lead portion 7b and the bridge portion 6 of the lead terminal 7 are punched out by a punch or the like, Obtain the device 14 as shown. Next, the outer lead portion 7b of the device 14 is formed. Then, the outer lead portion 7b of the device 14 and a substrate (not shown), a lead frame or the like are bonded to each other by thermocompression bonding or the like in a state of being aligned with each other.

By the way, conventionally, when the device 14 is taken out of the die used for the punching process or the outer lead portion 7b is taken out of the die used for the forming process and transferred to the next step, the plan view of FIG. The device 14 is adsorbed and transferred by using a transfer nozzle 15 as shown in the sectional view of FIG. Further, before transferring the device 14 to a bonding position such as a substrate or a lead frame, the positional deviation from the bonding position is detected in advance and the transfer amount is corrected and controlled. A recognition process for the alignment is performed by using a TV camera or the like in a state in which the device 14 is attracted at 15.

By the way, when the transfer nozzle 15 sucks the device 14, the transfer nozzle 15 covers most of the area from the center of the device 14 to the support tape portion 5. Therefore, when performing the positional deviation correction by the recognition process using the TV camera in this state, the tip of the outer lead portion 7b may be deformed when the lead is cut, or the lead height may not be stable. The base portion 7b of the outer lead portion 7b in the vicinity of the support tape portion, which is not likely to be deformed by cutting the lead or the like, is used as a reference for alignment.

<Problems to be Solved by the Invention> By the way, in order to improve the accuracy of the above alignment,
It is necessary to increase the magnification of the image captured by the TV camera, but under the high-magnification captured image, as shown in FIG. 10, which is the captured image, only part of the device 14 is within the visual field of the operator's recognition. It will not fit. That is, the recognition visual field is very limited.

On the other hand, the outer lead portion 7b of each lead terminal 7 is
In the limited recognition visual field, each shape has the same recognition pattern, and many such recognition patterns exist. Therefore, even if the lead terminals are displaced by, for example, one pitch, the recognition pattern by the TV camera or the like becomes the same, and the alignment process is erroneously recognized as being correct. There is a problem that a defective product that is offset by one pitch is manufactured. Furthermore, since the outer lead portion 7b is formed on the surface of the support tape portion 5, a step is formed between the outer lead portion 7b and the support tape portion 5. Therefore, if the recognition process under high magnification is performed with such a step,
As shown in FIG. 11 which is an image of the dotted line portion XI of the figure, the contour 16 of the binarized image (hatched portion in the figure) of the dotted line portion XI becomes extremely unclear, so that the above-mentioned alignment is accurately performed. This makes it difficult to reduce the bonding accuracy.

The present invention has been made in view of such a problem, and makes it possible to improve the alignment accuracy at the time of bonding a device even when the above-described recognition processing is performed under a high magnification. The purpose is to

<Means for Solving the Problems> In the film carrier tape of the present invention, for outer lead bonding alignment on at least one side of the outer peripheral edge portion of the support tape portion and the root portion of the outer lead portion near the support tape portion. Marks are patterned.

<Operation> The above mark can be used as a reference when aligning the outer lead bonding and is used as a characteristic recognition pattern that can be distinguished from other outer lead portions having the same shape.

<Examples> Hereinafter, the present invention will be described based on Examples shown in the drawings.
In the embodiments of the present invention, parts corresponding to or corresponding to those of the conventional example are designated by the same reference numerals.

Embodiment 1 FIG. 1 is a partially enlarged plan view of an outer peripheral portion of a support tape portion and an outer lead portion in a film carrier tape according to Embodiment 1 of the present invention. The film carrier tape according to Example 1 basically has the same configuration as that of the conventional example.

In the film carrier tape of the present embodiment shown in FIG. 1, among the lead terminals, the root portion of the outer lead portion 7b of one lead terminal 7 near the support tape portion 5 is formed.
7d has a convex portion 17 patterned. This convex part
17 is a mark for aligning the outer lead bonding.

Therefore, with this configuration, the outer lead portion 7b formed with the convex portion 17 is not shielded by the transfer nozzle, and is not easily affected by cutting or forming of the outer lead portion 7b, and thus becomes a stable recognition point. Therefore, high bonding accuracy can be obtained. Moreover, as shown in FIG. 2 which is a binarized image of the dotted line II in FIG.
Since the mark in the root portion 7d has a characteristic recognition pattern, it can be clearly discriminated from the other outer lead portions 7b having the same shape, so that a recognition error as in the conventional example does not occur.

It should be noted that the pattern shape is not limited to the convex portion 17 and may be another shape such as a concave shape. Also,
The mark may be formed not only on a single lead terminal but also on a plurality of lead terminals as long as the features of the pattern can be recognized.

Embodiment 2 FIG. 3 is a partially enlarged plan view of an outer peripheral portion of a support tape portion and an outer lead portion in a film carrier tape according to Embodiment 2 of the present invention. In the second embodiment, a recess 18 formed by notching the support tape portion 5 is patterned on a part of the outer peripheral edge portion of the support tape portion 5 in the film carrier tape, which is the same as in the first embodiment. It is used as a mark for lead bonding alignment.

Therefore, with this configuration, the support tape portion 5 in which the concave portion 18 is formed is not shielded by the transfer nozzle as in the case of the first embodiment, and the outer lead portion is not formed.
Since it is not easily affected by cutting or forming of 7b, it becomes a stable recognition point. Therefore, high bonding accuracy can be obtained. Further, since the concave portion 18 forming portion of the support tape portion 5 has a characteristic recognition pattern as shown in FIG. 4 which is an image of a dotted line portion IV in FIG. 3, no recognition error occurs. Moreover, in addition to this, if the recognition focus is set on the support tape portion 5, there is no blurring of the image contour due to the influence of the step between the outer lead portion 7b and the support tape portion 5, so that the alignment can always be performed accurately.

The pattern shape is not limited to this embodiment, but may be another shape such as a convex shape, and the support tape portion 5 may be provided with a punched hole. Further, the marks may be formed not only in one place of the support tape portion but also in a plurality of places as long as the features of the pattern can be recognized.

Further, marks can be formed on both the outer lead portion 7b and the support tape portion 5.

<Effects of the Invention> According to the present invention, the outer lead bonding alignment mark is formed on at least one side of the outer peripheral edge of the support tape portion and the root portion of the outer lead portion near the support tape portion. The mark can be used as a reference for positioning during the recognition processing for alignment. Therefore, excellent effects such as high-precision bonding can be achieved.

[Brief description of drawings]

1 to 4 show each embodiment of the present invention,
FIG. 1 is a partially enlarged plan view of an outer peripheral portion of a support tape portion and an outer lead portion of a film carrier tape according to Example 1, and FIG. 2 is a diagram showing a binarized image of a dotted line portion II in FIG. 3 is a partially enlarged plan view of the outer peripheral portion of the support tape portion and the outer lead portion of the film carrier tape according to Example 2, and FIG. 4 is a dotted line IV-2 of FIG.
It is a figure which shows a binarized image. 5 to 11 show a conventional example, FIG. 5 is a plan view showing a state in which a semiconductor chip is bonded to a film carrier tape, and FIG. 6 is a sectional view taken along line VI-VI of FIG. ,
FIG. 7 is a plan view of a device obtained by punching out a film carrier tape, FIG. 8 is a plan view showing a state in which the device is adsorbed by a transfer nozzle, FIG. 9 is the same sectional view, and FIG. 10 is FIG. FIG. 11 is an enlarged plan view of a dotted line portion X of FIG. 11, and FIG. 11 is a diagram showing a binarized image of the dotted line portion XI of FIG. 1 ... Film carrier tape, 2 ... Tape base material, 3 ... Center device hole, 4 ... Outer lead hole, 5 ... Support tape part, 7 ... Lead terminal, 7a ... Inner lead part, 7b ... Outer lead part, 17 ... Convex part ( Mark), 18 ... Recessed part (mark).

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Seki 4-chome, Mizuhara, Itami-shi, Hyogo Mitsubishi Electric Corporation Kita-Itami Works (72) Inventor Tetsuya Ueda 4-chome, Mizuhara, Itami-shi, Hyogo Mitsubishi Electric Corporation Company Kita Itami Works

Claims (1)

[Claims] 1. A tape base material, wherein a center device hole for mounting a semiconductor chip and an outer lead hole are formed on the outer circumference of the center device hole in the tape base material, and the center device hole and the outer lead are formed. A portion between the hole and the hole serves as a support tape portion, and a plurality of lead terminals are radially arranged on the surface of the tape base material through the support tape portion and the outer lead hole centering on the center device hole. The inner end portion of each lead terminal is an inner lead portion facing the center device hole and connected to the semiconductor chip, and the portion of the lead terminal facing the outer lead hole is connected to a substrate or the like. Part of the film carrier tape, the outer peripheral part of the support tape part and the support part of the outer lead part. A film carrier tape, wherein an outer lead bonding alignment mark is patterned on at least one side of the root portion near the port tape portion.