JPH069906B2 - Composite material consisting of graphite and copper or copper alloy - Google Patents
Composite material consisting of graphite and copper or copper alloyInfo
- Publication number
- JPH069906B2 JPH069906B2 JP4662086A JP4662086A JPH069906B2 JP H069906 B2 JPH069906 B2 JP H069906B2 JP 4662086 A JP4662086 A JP 4662086A JP 4662086 A JP4662086 A JP 4662086A JP H069906 B2 JPH069906 B2 JP H069906B2
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- Japan
- Prior art keywords
- plate
- copper
- graphite
- composite material
- copper plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Physical Vapour Deposition (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えばX線ターゲットやスパッタリングター
ゲット等に使われる黒鉛と銅または銅合金からなる複合
材に関する。TECHNICAL FIELD The present invention relates to a composite material composed of graphite and copper or a copper alloy used in, for example, an X-ray target or a sputtering target.
銅および銅合金と黒鉛とは互いに熱膨張率が大きく異な
っている。銅および銅合金の線膨張係数が18〜20×10-6
であるのに対し、黒鉛の線膨張係数は3〜7×10-6であ
る。一般に、ろう付けや拡散接合で熱膨張率が実用上問
題にならない範囲は、両者の線膨張係数の差が10×10-6
より小さい場合である。The coefficients of thermal expansion of copper and copper alloys are greatly different from that of graphite. The coefficient of linear expansion of copper and copper alloys is 18-20 × 10 -6
On the other hand, the linear expansion coefficient of graphite is 3 to 7 × 10 −6 . Generally, in the range where the coefficient of thermal expansion does not pose a practical problem in brazing or diffusion bonding, the difference in linear expansion coefficient between the two is 10 × 10 -6.
If it is smaller.
このため、両者を硬ろう付けや拡散接合などで接合する
と、接合後の冷却過程で銅板の収縮率の方が大きいため
両者に寸法差を生じて大きな残留応力が発生し、脆性材
料である黒鉛板が破壊することがある。For this reason, when the two are joined by hard brazing or diffusion joining, the shrinkage rate of the copper plate is larger in the cooling process after joining, so that a large dimensional difference occurs between the two and a large residual stress occurs, and the graphite, which is a brittle material, The board may break.
例えば、第9図に示されるように黒鉛板1と銅板2を互
いに厚み方向に重ねるに当って、両者を高温度で拡散接
合(または硬ろう付け)したとする。この場合、接合後
の冷却過程で銅板2は黒鉛板1に対して相対的に収縮す
る。このため接合時の温度と冷却時の温度差が大きい場
合に、黒鉛板1と銅板2は、第9図に想像線で示したよ
うに撓み、極端な場合には第10図に示されるように黒
鉛板1に放射状のクラック3が生じる。このため黒鉛板
1と銅板2からなる複合材は、小さなテストピースでは
接合可能な場合があるが、実用的な大きさでは黒鉛板1
が破壊することが多い。For example, as shown in FIG. 9, it is assumed that when the graphite plate 1 and the copper plate 2 are stacked in the thickness direction, they are diffusion bonded (or hard brazed) at a high temperature. In this case, the copper plate 2 shrinks relatively to the graphite plate 1 in the cooling process after joining. Therefore, when the difference between the temperature at the time of joining and the temperature at the time of cooling is large, the graphite plate 1 and the copper plate 2 bend as shown by the imaginary line in FIG. 9, and in extreme cases, as shown in FIG. Radial cracks 3 are generated in the graphite plate 1. Therefore, the composite material composed of the graphite plate 1 and the copper plate 2 may be joined with a small test piece in some cases, but the graphite plate 1 has a practical size.
Is often destroyed.
従って現状では、両者を機械的手段によって締結する
か、樹脂系接着剤による接合、もしくはインジウムや半
田等の比較的低温で行なわれる軟ろう付けによって接合
している。Therefore, at present, they are fastened together by mechanical means, joined by a resin adhesive, or joined by soft brazing of indium, solder or the like at a relatively low temperature.
しかしながら、機械的締結では荷重が局部的に負荷され
るため締結力をあまり高くすることができない。一方、
樹脂系接着剤や軟ろう付けによる接合では、接合部の耐
熱性が劣るため、X線ターゲットやスパッタリングター
ゲットのように高温で使用されるものには問題がある。
しかも真空や特殊雰囲気中で使用すると、接着剤から不
純物ガスが発生する可能性がある。However, mechanical fastening cannot locally increase the fastening force because the load is locally applied. on the other hand,
In the case of joining with a resin-based adhesive or soft brazing, the heat resistance of the joined portion is inferior, so there is a problem with those used at high temperatures such as an X-ray target and a sputtering target.
Moreover, when used in a vacuum or a special atmosphere, an impurity gas may be generated from the adhesive.
また、例えば特開昭60-187546号公報に記載されている
ように、黒鉛板と銅板との間にTi層とNi層を介在さ
せることも提案されたが、本発明者らの研究によると、
インサート板にTiとNiを用いた場合、複合材がある
程度大きいと、接合後の冷却過程で黒鉛が破損しやす
く、このため現実的な大きさの製品に適用できない場合
があった。また、このようなTiおよびNi製のインサ
ート板を用いた場合に黒鉛が破損する原因は、インサー
ト板の熱膨張率と黒鉛の熱膨張率との差に原因があるら
しいことも判った。Further, as described in, for example, Japanese Patent Application Laid-Open No. 60-187546, it has been proposed to interpose a Ti layer and a Ni layer between a graphite plate and a copper plate, but according to the study by the present inventors, ,
When using Ti and Ni for the insert plate, if the composite material is large to some extent, the graphite is likely to be damaged in the cooling process after joining, and thus it may not be applicable to a product having a realistic size. It was also found that the cause of graphite breakage when such an insert plate made of Ti or Ni is likely to be due to the difference between the coefficient of thermal expansion of the insert plate and the coefficient of thermal expansion of graphite.
従って本発明の目的は、耐熱性が高くかつ黒鉛の破損を
生じにくくすることができるような複合材を得ることに
ある。Therefore, an object of the present invention is to obtain a composite material which has high heat resistance and is less likely to cause breakage of graphite.
本発明の複合材は、黒鉛板と、純銅または銅合金からな
る銅板と、上記黒鉛板と上記銅板との間に設けられかつ
上記銅板よりも熱膨張率が小さいMo,Nb,Ta,W
のうちいずれかの難溶融・低熱膨張金属あるいはその合
金からなるインサート板とを具備し、かつ上記黒鉛板と
銅板を拡散接合あるいは硬ろう付け等の高温で行なう接
合手段により上記インサート板を介して互いに接合させ
たものである。上記インサート板は、上記銅板よりも弾
性係数の高い金属が望ましい。The composite material of the present invention includes a graphite plate, a copper plate made of pure copper or a copper alloy, and Mo, Nb, Ta, W provided between the graphite plate and the copper plate and having a smaller coefficient of thermal expansion than the copper plate.
Of the above-mentioned graphite plate and a copper plate through a high-temperature joining means such as diffusion bonding or hard brazing through the insert plate. They are joined together. The insert plate is preferably a metal having a higher elastic coefficient than the copper plate.
上記構成の複合材は、銅板と黒鉛板とが両者の間に耐熱
性のインサート板を介して接合されており、このインサ
ート板の線膨張係数は7.5×10-6(at20℃)以下であ
り、これは黒鉛の線膨張係数4.0〜6.0×10-6と比
較して大き過ぎることがなく、黒鉛の破損を防ぐ上でき
わめて適当な熱膨張差であることが判った。しかもこの
インサート板は弾性係数が大きく、剛性が高いものであ
る。このように適度な線膨張係数を有する耐熱性の高剛
性インサート板を介して銅板と黒鉛板が拡散接合等によ
って接合されているので、接合後の銅板の収縮が抑制さ
れるとともに、複合材の撓みも少なくなる。このため冷
却過程で黒鉛板にクラックが生じたり破壊することを防
止できる。In the composite material having the above configuration, the copper plate and the graphite plate are joined together through a heat-resistant insert plate, and the linear expansion coefficient of this insert plate is 7.5 × 10 −6 (at 20 ° C.) or less. It was found that this is not too large as compared with the linear expansion coefficient of graphite of 4.0 to 6.0 × 10 −6, and that it is a very appropriate difference in thermal expansion from the viewpoint of preventing breakage of graphite. . Moreover, this insert plate has a large elastic coefficient and high rigidity. Since the copper plate and the graphite plate are bonded by diffusion bonding or the like through the heat-resistant high-rigidity insert plate having an appropriate coefficient of linear expansion as described above, the shrinkage of the copper plate after bonding is suppressed and the composite material Bending is also reduced. Therefore, the graphite plate can be prevented from cracking or breaking during the cooling process.
上記複合材の黒鉛板と銅板は、互いに硬ろう付けあるい
は拡散接合など高温で行なわれる接合手段によって面的
に接合されているから、両者の接合強度が高くかつ耐熱
性がある。また、接着材による接合と比較すると耐熱性
がはるかに優れており、かつ真空雰囲気中でガスの放出
を生じるおそれもない。Since the graphite plate and the copper plate of the composite material are surface-joined to each other by a joining means that is performed at a high temperature such as hard brazing or diffusion joining, they have high joining strength and heat resistance. Further, it has far superior heat resistance as compared with joining by an adhesive material, and there is no fear that gas will be released in a vacuum atmosphere.
第1図に示された一実施例において、複合材5は黒鉛製
の板6と、純銅または銅合金からなる銅板7と、これら
黒鉛板6と銅板7との間に設けられたインサート板8と
を備えている。In one embodiment shown in FIG. 1, the composite material 5 includes a graphite plate 6, a copper plate 7 made of pure copper or a copper alloy, and an insert plate 8 provided between the graphite plate 6 and the copper plate 7. It has and.
インサート板8は、上記銅板7よりも熱膨張率が小さく
かつ融点が銅板7と同等もしくは銅板7よりも高い金属
からなる。対象となる金属は、Mo,Nb,Ta,Wお
よびこれら金属の合金である。インサート板8の線膨張
係数は、黒鉛板6の線膨張係数に近い値、もしくは黒鉛
板6と銅板7の中間の値にあればよい。具体的には、線
膨張係数が7.5×10-6(at20℃)以下の金属を採用す
る。The insert plate 8 is made of a metal whose coefficient of thermal expansion is smaller than that of the copper plate 7 and whose melting point is equal to or higher than that of the copper plate 7. The target metals are Mo, Nb, Ta, W and alloys of these metals. The linear expansion coefficient of the insert plate 8 may be a value close to the linear expansion coefficient of the graphite plate 6 or an intermediate value between the graphite plate 6 and the copper plate 7. Specifically, a metal having a linear expansion coefficient of 7.5 × 10 −6 (at 20 ° C.) or less is adopted.
銅板7の厚みは、実用的には2〜30mm位であり、これ
に対してインサート板8の厚みは、その弾性係数にも左
右されるが、実用的には銅板7の厚みの1/20ないし1
/5位、すなわち0.1ないし2.0mm前後のものが使
用される。インサート板8は剛性の高いものが望ましい
だめ、弾性係数が銅板7の弾性係数よりも高い材料を選
定するのがよい。以上のことを考慮すると、インサート
板8の材料にはMo,W,Nb,Taなどの難溶融・低
熱膨張金属またはその合金が好適である。The thickness of the copper plate 7 is practically about 2 to 30 mm, while the thickness of the insert plate 8 is practically 1/20 of the thickness of the copper plate 7 although it depends on its elastic coefficient. Through 1
/ 5th place, that is, about 0.1 to 2.0 mm is used. Since it is desirable that the insert plate 8 has high rigidity, it is preferable to select a material having an elastic coefficient higher than that of the copper plate 7. In consideration of the above, the material of the insert plate 8 is preferably a refractory / low thermal expansion metal such as Mo, W, Nb, or Ta, or an alloy thereof.
上記インサート板8を黒鉛板6と銅板7との間に挟み、
接合温度まで加熱するとともに厚み方向に加圧すること
により、インサート板8を介して黒鉛板6と銅板7とが
拡散接合させられる。なお、黒鉛板6とインサート板8
との間、あるいは銅板7とインサート板8との間に適宜
の硬ろう材を介在させることにより、硬ろう付けによる
接合を行なってもよい。接合温度は例えば600ないし100
0℃位である。The insert plate 8 is sandwiched between the graphite plate 6 and the copper plate 7,
By heating to the bonding temperature and pressing in the thickness direction, the graphite plate 6 and the copper plate 7 are diffusion bonded via the insert plate 8. The graphite plate 6 and the insert plate 8
, Or by interposing an appropriate hard brazing material between the copper plate 7 and the insert plate 8 to join by hard brazing. Joining temperature is, for example, 600 to 100
It is around 0 ° C.
接合後の冷却過程では黒鉛板6に比べて銅板7の収縮率
が大きいが、黒鉛板6と銅板7との間には剛性の高いイ
ンサート板8が挟み込まれており、かつこれらが互いに
拡散接合ないし硬ろう付けによって強固に接合されてい
るため、熱膨張率の差による銅板7の収縮が押えられ
る。このため複合材5の撓みが減少し、黒鉛板6にクラ
ックが生じることが防止される。Although the shrinkage rate of the copper plate 7 is larger than that of the graphite plate 6 in the cooling process after joining, an insert plate 8 having high rigidity is sandwiched between the graphite plate 6 and the copper plate 7, and these are diffusion-bonded to each other. Or, since they are firmly joined by hard brazing, the contraction of the copper plate 7 due to the difference in the coefficient of thermal expansion is suppressed. Therefore, the bending of the composite material 5 is reduced, and the graphite plate 6 is prevented from cracking.
上記インサート板8の融点は銅板7の融点と同等もしく
は銅板7よりも高く、しかも黒鉛板6と銅板7とが高温
で行なわれる接合手段によって互いに接合されているか
ら、複合材5は優れた耐熱性を発揮する。しかもインサ
ート板8の厚みは銅板7の厚みの1/20ないし1/2と
薄いため、黒鉛板6と銅板7との間の熱伝動性に与える
影響が少ない。そして機械的締結の場合のような局部的
な荷重の負荷を生じないばかりか、接着剤を使用した場
合のような汚染物質の放出も生じない。また、黒鉛の耐
熱性は非酸化性雰囲気では約2500℃と優れているため、
銅板7側を適宜の手段によって冷却することにより、優
れた高温耐熱性を発揮する。The melting point of the insert plate 8 is equal to or higher than the melting point of the copper plate 7, and the graphite plate 6 and the copper plate 7 are joined to each other by a joining means performed at a high temperature, so that the composite material 5 has excellent heat resistance. Exert its abilities. Moreover, since the thickness of the insert plate 8 is as thin as 1/20 to 1/2 of the thickness of the copper plate 7, it has little influence on the thermal conductivity between the graphite plate 6 and the copper plate 7. Further, not only a local load is not applied as in the case of mechanical fastening, but also a pollutant is not emitted as in the case of using an adhesive. In addition, since the heat resistance of graphite is excellent at about 2500 ° C in a non-oxidizing atmosphere,
By cooling the copper plate 7 side by an appropriate means, excellent high temperature heat resistance is exhibited.
これらの理由から、上記複合材5はX線ターゲットやス
パッタリングターゲット等に好適である。For these reasons, the composite material 5 is suitable for an X-ray target, a sputtering target and the like.
第2図にX線ターゲット10の一例を示す。このターゲ
ット10には、長波長の炭素の特性X線を得るために、
第3図に示される複合材5が使用される。この複合材5
は、黒鉛板6の端面6aがテーパ状に加工され、このテ
ーパ状端面6aに電子線を当てることにより炭素の特性
X線を発生させる。その時の温度上昇に対処するため
に、銅板7側に冷却筒11を設けるとともに、この冷却
筒11に管12,13を通じて冷却水などの冷媒を流通
させ、銅板7を介して黒鉛板6の冷却を行なう。FIG. 2 shows an example of the X-ray target 10. In order to obtain a characteristic X-ray of long wavelength carbon, the target 10 is
The composite material 5 shown in FIG. 3 is used. This composite 5
The end face 6a of the graphite plate 6 is processed into a taper shape, and a characteristic X-ray of carbon is generated by applying an electron beam to the taper end face 6a. In order to cope with the temperature rise at that time, a cooling cylinder 11 is provided on the copper plate 7 side, and a coolant such as cooling water is circulated through the cooling cylinder 11 through pipes 12 and 13 to cool the graphite plate 6 through the copper plate 7. Do.
こうしたX線ターゲットでは、数百度℃程度の耐熱性と
真空雰囲気中でも不純物ガス放出しないことが必要であ
り、しかも局部加熱を防ぐ目的からターゲット10が軸
回りに高速回転させられるので、高い接合強度が要求さ
れる。これらの要求を満足するものとして、本実施例の
複合材5が好適である。なお、第4図に示された実施例
の複合材5は、銅板7にテーパ状の凹部7aを設けてい
る。In such an X-ray target, it is necessary to have a heat resistance of about several hundreds of degrees Celsius and not emit an impurity gas even in a vacuum atmosphere. Further, since the target 10 is rotated at a high speed around the axis for the purpose of preventing local heating, high bonding strength Required. The composite material 5 of this embodiment is suitable for satisfying these requirements. In the composite material 5 of the embodiment shown in FIG. 4, the copper plate 7 is provided with a tapered recess 7a.
第5図に示されるスパッタリング装置は、図示しない被
接着材に黒鉛をコーティングするものであり、ターゲッ
トに本発明の複合材5を用いる。この複合材5の構造は
基本的には前述した複合材5(第1図のもの)と同様
に、インサート板8を介して黒鉛板6と銅板7を高温で
接合したものである。通常はスパッタリング中にターゲ
ットの表面が高温に加熱されるために、ターゲットの反
対側は冷却される。図示例においては、銅板7側に冷媒
供給管14を通じて冷媒15が供給されることにより、
ターゲットすなわち複合材5の冷却がなされる。この場
合、銅板7は押え用の裏金を兼用している。同図におい
て、16はマグネットである。The sputtering apparatus shown in FIG. 5 coats an adherend (not shown) with graphite and uses the composite material 5 of the present invention as a target. The structure of the composite material 5 is basically a structure in which a graphite plate 6 and a copper plate 7 are joined at high temperature via an insert plate 8 similarly to the composite material 5 (shown in FIG. 1) described above. The opposite side of the target is cooled, typically because the surface of the target is heated to high temperatures during sputtering. In the illustrated example, the coolant 15 is supplied to the copper plate 7 side through the coolant supply pipe 14,
The target, that is, the composite material 5, is cooled. In this case, the copper plate 7 also serves as a backing metal for pressing. In the figure, 16 is a magnet.
スパッタリングスピードを速くするためには、ターゲッ
トに投入するエネルギーを大きくする必要があるが、従
来一般的に行なわれていた樹脂系接着剤や軟ろう付けに
よる接合では耐熱性が200℃以下であり、耐熱性の点で
難がある。これに対し本発明による複合材5を用いたタ
ーゲットは、耐熱性が格段に優れていることから、より
大きなエネルギーを投入できることになり、スパッタリ
ングスピードを向上させることができる。In order to increase the sputtering speed, it is necessary to increase the energy input to the target, but the heat resistance is 200 ° C or less in the conventional bonding with resin adhesive or soft brazing, There is a problem in heat resistance. On the other hand, the target using the composite material 5 according to the present invention is remarkably excellent in heat resistance, so that a larger amount of energy can be input, and the sputtering speed can be improved.
ターゲットに使われる複合材5あるいは黒鉛板6の接合
形状は、第6図に示される円環状、第7図に示される矩
形状、あるいは第8図に示されるコ字状を始めとして、
種々の形状が考えられる。The joint shape of the composite material 5 or the graphite plate 6 used for the target includes an annular shape shown in FIG. 6, a rectangular shape shown in FIG. 7, or a U-shape shown in FIG.
Various shapes are possible.
本発明によれば、互いに熱膨張率の大きく異なる黒鉛板
と銅板を拡散接合や硬ろう付けなどのような高温接合手
段によって互いに接合した場合に、黒鉛の破損を防止で
きる。しかも本発明の複合材は耐熱性と接合強度に優れ
ており、かつ雰囲気中への不純物ガスの放出の心配もな
い。According to the present invention, it is possible to prevent breakage of graphite when a graphite plate and a copper plate having large thermal expansion coefficients are joined to each other by a high temperature joining means such as diffusion joining or hard brazing. Moreover, the composite material of the present invention is excellent in heat resistance and bonding strength, and there is no fear of releasing an impurity gas into the atmosphere.
第1図は本発明の一実施例を示す複合材の断面図、第2
図は本発明の他の実施例を示す複合材を用いたX線ター
ゲットの斜視図、第3図は第2図に示された複合材の断
面図、第4図は本発明の更に別の実施例を示す複合材の
断面図、第5図はスパッタリング装置の断面図、第6図
ないし第8図はそれぞれ複合材の互いに異なる形状例を
示す平面図。第9図は従来の複合材の一例を示す側面
図、第10図は第9図に示された複合材にクラックが生
じた状態の平面図である。 5…複合材、6…黒鉛板、7…銅板、8…インサート
板。FIG. 1 is a sectional view of a composite material showing an embodiment of the present invention, and FIG.
FIG. 4 is a perspective view of an X-ray target using a composite material showing another embodiment of the present invention, FIG. 3 is a sectional view of the composite material shown in FIG. 2, and FIG. FIG. 5 is a cross-sectional view of a composite material showing an embodiment, FIG. 5 is a cross-sectional view of a sputtering apparatus, and FIGS. 6 to 8 are plan views showing mutually different shape examples of the composite material. FIG. 9 is a side view showing an example of a conventional composite material, and FIG. 10 is a plan view showing a state in which the composite material shown in FIG. 9 is cracked. 5 ... Composite material, 6 ... Graphite plate, 7 ... Copper plate, 8 ... Insert plate.
Claims (2)
と、上記黒鉛板と上記銅板との間に設けられかつ上記銅
板よりも熱膨張率が小さいMo,Nb,Ta,Wのうち
いずれかの難溶融・低熱膨張金属あるいはその合金から
なるインサート板とを具備し、かつ上記黒鉛板と銅板を
拡散接合あるいは硬ろう付け等の高温で行なう接合手段
により上記インサート板を介して互いに接合させたこと
を特徴とする黒鉛と銅または銅合金からなる複合材。1. A graphite plate, a copper plate made of pure copper or a copper alloy, and Mo, Nb, Ta or W provided between the graphite plate and the copper plate and having a smaller coefficient of thermal expansion than the copper plate. The above-mentioned graphite plate and copper plate are joined to each other through the insert plate by a joining means that is performed at a high temperature such as diffusion joining or hard brazing. A composite material consisting of graphite and copper or a copper alloy.
の弾性係数よりも高い金属を用いたことを特徴とする特
許請求の範囲第1項記載の黒鉛と銅または銅合金からな
る複合材。2. The composite material of graphite and copper or copper alloy according to claim 1, wherein the insert plate is made of a metal having a higher elastic modulus than that of the copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4662086A JPH069906B2 (en) | 1986-03-04 | 1986-03-04 | Composite material consisting of graphite and copper or copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4662086A JPH069906B2 (en) | 1986-03-04 | 1986-03-04 | Composite material consisting of graphite and copper or copper alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62202732A JPS62202732A (en) | 1987-09-07 |
| JPH069906B2 true JPH069906B2 (en) | 1994-02-09 |
Family
ID=12752335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4662086A Expired - Lifetime JPH069906B2 (en) | 1986-03-04 | 1986-03-04 | Composite material consisting of graphite and copper or copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069906B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9677170B2 (en) | 2007-02-09 | 2017-06-13 | Jx Nippon Mining & Metals Corporation | Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for producing the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3905295B2 (en) | 2000-10-02 | 2007-04-18 | 日鉱金属株式会社 | Diffusion bonding target assembly of high purity cobalt target and copper alloy backing plate and method for manufacturing the same |
| JP3905301B2 (en) | 2000-10-31 | 2007-04-18 | 日鉱金属株式会社 | Tantalum or tungsten target-copper alloy backing plate assembly and manufacturing method thereof |
-
1986
- 1986-03-04 JP JP4662086A patent/JPH069906B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9677170B2 (en) | 2007-02-09 | 2017-06-13 | Jx Nippon Mining & Metals Corporation | Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for producing the same |
| US10344373B2 (en) | 2007-02-09 | 2019-07-09 | Jx Nippon Mining & Metals Corporation | Process for producing a target formed of a sintering-resistant material of a high-melting point metal alloy, silicide, carbide, nitride or boride |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62202732A (en) | 1987-09-07 |
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