JPH07100358B2 - Composite material consisting of graphite and copper - Google Patents
Composite material consisting of graphite and copperInfo
- Publication number
- JPH07100358B2 JPH07100358B2 JP61315494A JP31549486A JPH07100358B2 JP H07100358 B2 JPH07100358 B2 JP H07100358B2 JP 61315494 A JP61315494 A JP 61315494A JP 31549486 A JP31549486 A JP 31549486A JP H07100358 B2 JPH07100358 B2 JP H07100358B2
- Authority
- JP
- Japan
- Prior art keywords
- graphite
- copper
- linear expansion
- insert
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 64
- 229910002804 graphite Inorganic materials 0.000 title claims description 62
- 239000010439 graphite Substances 0.000 title claims description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 47
- 229910052802 copper Inorganic materials 0.000 title claims description 47
- 239000010949 copper Substances 0.000 title claims description 47
- 239000002131 composite material Substances 0.000 title claims description 20
- 239000000463 material Substances 0.000 claims description 47
- 238000005219 brazing Methods 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000009792 diffusion process Methods 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 4
- 230000035882 stress Effects 0.000 description 9
- 238000001816 cooling Methods 0.000 description 7
- 238000005477 sputtering target Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えばスパッタリングターゲットやＸ線発生
用ターゲット等に使用される黒鉛と銅からなる複合材に
関する。TECHNICAL FIELD The present invention relates to a composite material composed of graphite and copper used in, for example, a sputtering target or an X-ray generation target.
黒鉛と銅の熱膨張率は互いに大きく異なっている。例え
ば銅の線膨張係数は約18×10-6であるのに対し、黒鉛の
線膨張係数は約７×10-6である。このため、黒鉛と銅を
高温（約600〜1000℃）で硬ろう付けや拡散接合等の方
法で接合すると、冷却過程において黒鉛と銅の熱膨張差
によって相対的な寸法差を生じ、残留応力が発生する。
このため黒鉛と銅からなる複合材は、その寸法が小さけ
れば残留応力の影響は小さく接合は可能であるが、実用
的な大きさになると残留応力の影響によって黒鉛に大き
な引張り応力を生じる。黒鉛は引張り応力に弱いため、
接合後にクラックが入り、破壊してしまう。例えば、直
径200mmの円盤形テストピースを900℃で接合し、室温ま
で冷却すると、銅板の直径は約4mm収縮するが、黒鉛の
直径は約1mmしか収縮しない。その結果、黒鉛と銅は厚
み方向に撓み、黒鉛に放射状のクラックが発生してつい
には破壊に至る。The coefficients of thermal expansion of graphite and copper differ greatly from each other. For example, the linear expansion coefficient of copper is about 18 × 10 −6 , whereas the linear expansion coefficient of graphite is about 7 × 10 −6 . For this reason, when graphite and copper are joined at a high temperature (approximately 600 to 1000 ° C) by methods such as hard brazing or diffusion joining, a relative dimensional difference occurs due to the difference in thermal expansion between graphite and copper during the cooling process, resulting in residual stress. Occurs.
For this reason, the composite material composed of graphite and copper has a small effect of residual stress and can be bonded if its size is small, but when it is of a practical size, a large tensile stress is generated in graphite due to the effect of residual stress. Since graphite is weak against tensile stress,
After joining, it cracks and it breaks. For example, when disc-shaped test pieces with a diameter of 200 mm are joined at 900 ° C. and cooled to room temperature, the diameter of the copper plate shrinks by about 4 mm, but the diameter of the graphite shrinks by only about 1 mm. As a result, the graphite and copper bend in the thickness direction, and radial cracks are generated in the graphite, which eventually leads to destruction.
このため現状では、黒鉛と銅を結合するための手段とし
て、ボルト締め等による機械的締結や、樹脂系接着剤に
よる接合、あるいはインジウムや半田等を使用した軟ろ
う付けに頼っている。Therefore, at present, as means for connecting graphite and copper, mechanical fastening such as bolting, joining with a resin adhesive, or soft brazing using indium, solder or the like is relied upon.
しかしながら上述した従来技術では、次のような問題点
がある。However, the above-mentioned conventional technique has the following problems.
例えば機械的な締結方法では、高温に熱せられた時の膨
張あるいは冷却に伴う収縮等の熱的衝撃によって締結力
が低下しやすい。また、エポキシ系やナイロン系接着剤
などの樹脂系接着剤では接着強度に難があり、しかも耐
熱性がない。また真空中での使用において不純物ガスを
発生する等の問題がある。一方、軟ろう付けでは接合強
度が低いとともに、耐熱性に劣るといった問題があっ
た。For example, in a mechanical fastening method, the fastening force is likely to decrease due to thermal shock such as expansion when heated to a high temperature or contraction caused by cooling. Further, resin-based adhesives such as epoxy-based and nylon-based adhesives have a difficulty in adhesive strength and have no heat resistance. Further, there is a problem that an impurity gas is generated when used in vacuum. On the other hand, soft brazing has problems that the joint strength is low and the heat resistance is poor.
上記問題点を解決するために本発明の複合材は、黒鉛と
銅（銅合金も含む）との間に互いに熱膨張率の異なる金
属からなる２枚のインサート材を厚み方向に重ねて介在
させる。そして黒鉛側に位置する第１のインサート材
は、その線膨張係数α１が銅の線膨張係数αcuよりも小
さく、かつ黒鉛の線膨張係数αｃよりも大きい金属から
なる。また銅側に位置する第２のインサート材は、その
線膨張係数α２が黒鉛の線膨張係数αｃと同等もしくは
黒鉛の線膨張係数αｃよりも小さく、かつ上記第１のイ
ンサート材の線膨張係数α１よりも小さい金属からな
る。これら２種類のインサート材を介し、適当な荷重を
負荷した状態で600℃ないし1000℃まで加熱することに
より、上記黒鉛と銅を硬ろう付けまたは拡散接合によっ
て互いに結合させるようにしたものである。In order to solve the above problems, in the composite material of the present invention, two insert materials made of metals having different coefficients of thermal expansion are interposed between graphite and copper (including a copper alloy) so as to be stacked in the thickness direction. . The first insert material located on the graphite side is made of a metal whose linear expansion coefficient α 1 is smaller than the linear expansion coefficient αcu of copper and larger than the linear expansion coefficient αc of graphite. The second insert material located on the copper side has a linear expansion coefficient α 2 equal to or smaller than the linear expansion coefficient αc of graphite and smaller than the linear expansion coefficient αc of graphite, and the linear expansion coefficient of the first insert material. It is made of a metal smaller than α 1 . The graphite and copper are bonded to each other by hard brazing or diffusion bonding by heating to 600 ° C. to 1000 ° C. under a proper load through these two kinds of insert materials.
銅と黒鉛を硬ろう付けや拡散接合等のような高温で接合
すると、銅の熱膨張率が黒鉛よりも大きいため、冷却中
に銅が黒鉛よりも大きく収縮する。このため何の対策も
講じていない場合には黒鉛中に過大な引張り応力が生
じ、ついには破壊に至る。しかるに本発明の複合材は、
上述した線膨張係数α１，α２をもつ金属製インサート
材を２段階に分けて黒鉛と銅との間に挿入しておくこと
によって、冷却過程で黒鉛に作用する熱応力を効果的に
低減させることができるようになり、実用的な大きさの
黒鉛と銅からなる複合材の高温接合が可能となった。When copper and graphite are bonded at a high temperature such as hard brazing or diffusion bonding, the coefficient of thermal expansion of copper is larger than that of graphite, so that copper shrinks more than graphite during cooling. For this reason, if no measures are taken, excessive tensile stress is generated in the graphite, which eventually leads to destruction. However, the composite material of the present invention is
By inserting the metallic insert material having the above-mentioned linear expansion coefficients α 1 and α 2 into two stages and inserting it between graphite and copper, the thermal stress acting on the graphite during the cooling process is effectively reduced. As a result, it has become possible to perform high temperature bonding of a composite material of graphite and copper of practical size.
第１図に示された本発明の第１実施例の複合材１は、口
径30mmの円盤状のテストピースであり、一面側に黒鉛２
が、また他面側に銅３が設けられている。そして黒鉛２
と銅３との間には、黒鉛２側に第１のインサート材４
が、また銅３側に第２のインサート材５が介在させられ
ている。更には、黒鉛２と第１のインサート材４との間
に硬ろう材６が設けられている。また、各インサート材
4,5間、および銅３と第２のインサート材５との間にも
それぞれ硬ろう材7,8が設けられている。これらの硬ろ
う材6,7,8は、いずれもニッケル製であり、その厚さは
例えば５ないし500μｍ位が適当である。硬ろう材6,7,8
は、必要とされる耐熱性に応じてニッケルの代りに銀あ
るいは銅系の金属を採用してもよい。この実施例の場
合、黒鉛２の厚さは一例として7mm、銅３の厚さは4mm、
インサート材4,5の厚さはいずれも0.5mmとした。The composite material 1 of the first embodiment of the present invention shown in FIG. 1 is a disc-shaped test piece having a diameter of 30 mm, and graphite 2 is provided on one surface side.
However, copper 3 is provided on the other surface side. And graphite 2
Between the copper and the copper 3, the first insert material 4 on the graphite 2 side.
However, the second insert material 5 is interposed on the copper 3 side. Furthermore, a hard brazing material 6 is provided between the graphite 2 and the first insert material 4. Also, each insert material
Hard brazing filler metals 7 and 8 are also provided between the steel plates 4 and 5 and between the copper 3 and the second insert material 5, respectively. Each of these hard brazing materials 6, 7, 8 is made of nickel, and its thickness is preferably about 5 to 500 μm. Hard brazing material 6,7,8
In place of nickel, a silver-based or copper-based metal may be used depending on the required heat resistance. In the case of this embodiment, the thickness of the graphite 2 is 7 mm as an example, the thickness of the copper 3 is 4 mm,
The thickness of each of the insert materials 4 and 5 was set to 0.5 mm.
黒鉛２側に位置する第１のインサート材４はチタン製で
あり、その線膨張係数α１はおおむね８×10-6である。
ただし、チタンの代りにバナジウム等のように線膨張係
数が10×10-6以下の金属を使用してもよい。銅３側に位
置する第２のインサート材５はモリブデン製であり、そ
の線膨張係数α２はおおむね６×10-6である。ただし、
モリブデンの代りにタングステン等のような線膨張係数
が６×10-6以下の金属を使用してもよい。いずれにして
も、インサート材4,5には硬ろう材6,7,8よりも耐熱性の
高い金属が使用される。The first insert material 4 located on the graphite 2 side is made of titanium, and its linear expansion coefficient α 1 is approximately 8 × 10 −6 .
However, a metal having a linear expansion coefficient of 10 × 10 −6 or less such as vanadium may be used instead of titanium. The second insert material 5 located on the copper 3 side is made of molybdenum, and its linear expansion coefficient α 2 is about 6 × 10 −6 . However,
Instead of molybdenum, a metal having a linear expansion coefficient of 6 × 10 −6 or less such as tungsten may be used. In any case, the insert materials 4 and 5 use a metal having higher heat resistance than the hard brazing materials 6, 7 and 8.
上記インサート材4,5と硬ろう材6,7,8を、黒鉛２と銅３
との間に上記の配列で重ねたのち、適当な荷重を付加し
ながら、硬ろう材6,7,8が溶融する温度まで加熱・保持
することにより、黒鉛２と銅3,およびインサート材4,5
の硬ろう付けを同時に行なう。The insert materials 4,5 and brazing filler metals 6,7,8 are replaced with graphite 2 and copper 3
After stacking the above in the above arrangement with the above, while heating and holding to a temperature at which the hard brazing materials 6, 7, 8 melt while applying an appropriate load, the graphite 2 and the copper 3, and the insert material 4 ,Five
Hard brazing is performed at the same time.
上記複合材１に使われている第１のインサート材４の線
膨張係数α１は、黒鉛２の線膨張係数αｃよりも多少大
きい。このため、高温に加熱された状態で接合すると、
常温まで冷却された時に黒鉛２に多少の圧縮応力が生じ
る。黒鉛２は引張り方向の力には弱いが圧縮に対しては
ある程度の強度を発揮するため、このように適度な圧縮
応力の付与は黒鉛２を割れにくくする上で有効である。
また、銅３側に設けられた第２のインサート材５の線膨
張係数α２は黒鉛２の線膨張係数αｃ以下としており、
この第２のインサート材５を銅３に接合させているか
ら、高温で接合された銅３が常温に戻る際に収縮しよう
としても、その熱応力が黒鉛２側に影響することを緩和
できる。このように２段階のインサート材4,5を介在さ
せることで、黒鉛２に生じる引張り応力の低減化が図れ
るようになり、黒鉛２のクラックの発生と破壊を防止で
きるものである。なお、黒鉛２の線膨張係数をαｃ、第
１のインサート材４の線膨張係数をα１、第２のインサ
ート材５の線膨張係数をα２、銅３の線膨張係数をαcu
とした場合、黒鉛２のクラック発生の防止に効果のある
各材料の線膨張係数の概略値の関係は次の通りである。The linear expansion coefficient α 1 of the first insert material 4 used in the composite material 1 is slightly larger than the linear expansion coefficient αc of the graphite 2. For this reason, when joining while being heated to a high temperature,
When cooled to room temperature, some compressive stress is generated in the graphite 2. The graphite 2 is weak against the force in the tensile direction, but exerts a certain degree of strength against compression. Therefore, application of an appropriate compressive stress is effective in making the graphite 2 hard to break.
Further, the linear expansion coefficient α 2 of the second insert material 5 provided on the copper 3 side is set to be equal to or less than the linear expansion coefficient αc of the graphite 2.
Since the second insert material 5 is bonded to the copper 3, even if the copper 3 bonded at high temperature tries to shrink when returning to normal temperature, it is possible to reduce the influence of the thermal stress on the graphite 2 side. By interposing the two-stage insert materials 4 and 5 in this way, the tensile stress generated in the graphite 2 can be reduced, and the generation and destruction of cracks in the graphite 2 can be prevented. The linear expansion coefficient of graphite 2 is αc, the linear expansion coefficient of the first insert material 4 is α 1 , the linear expansion coefficient of the second insert material 5 is α 2 , and the linear expansion coefficient of copper 3 is αcu.
In that case, the relationship between the approximate values of the linear expansion coefficient of each material that is effective in preventing the occurrence of cracks in the graphite 2 is as follows.
α２≦αｃ＜α１＜（αｃ＋３×10-6）＜＜αcu また、黒鉛２の厚みをtc、第１のインサート材４の厚み
をt1、第２のインサート材５の厚みをt2、銅３の厚みを
tcuとした場合、各々の厚さは以下の範囲が適してい
る。α 2 ≦ αc <α 1 <(αc + 3 × 10 −6 ) << αcu Further, the thickness of the graphite 2 is tc, the thickness of the first insert material 4 is t 1 , and the thickness of the second insert material 5 is t 2 , The thickness of copper 3
When tcu is set, the following thicknesses are suitable for each thickness.
tc≧2mm 0.1mm≦t1≦3mm 0.1mm≦t2≦3mm tcu≧1mm 上記複合材１は、硬ろう付けによって黒鉛２と銅３およ
びインサート材4,5が高い強度で接合されており、しか
も耐熱性に優れている。従って上記複合材１は、例えば
炭素のスパッタリングターゲットやＸ線発生用ターゲッ
トとしての要求を充分満足する。tc ≧ 2mm 0.1mm ≦ t 1 ≦ 3mm 0.1mm ≦ t 2 ≦ 3mm tcu ≧ 1mm In the above composite material 1, graphite 2 and copper 3 and insert materials 4 and 5 are joined with high strength by hard brazing, Moreover, it has excellent heat resistance. Therefore, the composite material 1 sufficiently satisfies the requirements as, for example, a carbon sputtering target or an X-ray generation target.
例えばスパッタリングターゲットはスパッタリング中に
表面が高温に加熱されるために黒鉛が使用され、その反
対側に冷却効率の良い銅が使用されている。また、スパ
ッタリング・スピードを速くするためには優れた耐熱性
が要求される。上記複合材１は、こうしたスパッタリン
グターゲットとして充分使用に耐える耐熱性を有してい
る。For example, in a sputtering target, graphite is used because the surface is heated to a high temperature during sputtering, and copper having a high cooling efficiency is used on the opposite side. Also, excellent heat resistance is required to increase the sputtering speed. The composite material 1 has heat resistance enough to be used as such a sputtering target.
また上記複合材１は、長波長の炭素の特性Ｘ線を得るた
めのターゲットとしても好適である。Ｘ線ターゲットは
黒鉛側に電子線が照射される時に温度が数百℃まで上昇
するために、その反対側は水冷等によって冷却する必要
がある。しかもターゲットは高速回転させられているた
め、高い接合強度が必要となる。これらの要求を上記複
合材１は満足することができる。The composite material 1 is also suitable as a target for obtaining a characteristic X-ray of long-wavelength carbon. Since the temperature of the X-ray target rises to several hundreds of degrees Celsius when the graphite side is irradiated with an electron beam, the opposite side needs to be cooled by water cooling or the like. Moreover, since the target is rotated at high speed, high bonding strength is required. The composite material 1 can meet these requirements.
第２図は本発明の第２実施例を示し、この複合材１は外
径が200mmのリング状に形成されている。その積層構造
は第１実施例と同様であるが、黒鉛２の厚さは7mm、銅
３の厚さは4mm、インサート材4,5の厚さはそれぞれ1mm
である。第１実施例で述べたと同様に、第１のインサー
ト材４は、チタン（またはバナジウム等）からなり、第
２のインサート材５はモリブデン（またはタングステン
等）からなる。また、図示していないが黒鉛２と銅３お
よびインサート材4,5の間には、第１実施例と同様の硬
ろう材6,7,8が介在されている。FIG. 2 shows a second embodiment of the present invention. This composite material 1 is formed in a ring shape having an outer diameter of 200 mm. The laminated structure is the same as that of the first embodiment, but the thickness of the graphite 2 is 7 mm, the thickness of the copper 3 is 4 mm, and the thickness of the insert material 4 is 1 mm.
Is. As described in the first embodiment, the first insert material 4 is made of titanium (or vanadium or the like), and the second insert material 5 is made of molybdenum (or tungsten or the like). Although not shown, the hard brazing materials 6, 7, 8 similar to those of the first embodiment are interposed between the graphite 2, the copper 3 and the insert materials 4, 5.
この実施例では直径200mmと大形のスパッタリングター
ゲットであるにもかかわらず、高い耐熱性を示し、従来
品の2.5倍のエネルギーをスパッタリング時に負荷して
も全く問題を生じることなく使用でき、被スパッタリン
グ物への高性能の成膜が可能であった。Despite being a large sputtering target with a diameter of 200 mm in this example, it shows high heat resistance and can be used without any problem even if 2.5 times the energy of the conventional product is applied during sputtering. It was possible to form a high-performance film on an object.
なお上記各実施例では硬ろう付けによって各部材を接合
するようにしているが、本発明は高温度下で行なわれる
拡散接合によって黒鉛２と銅３およびインサート材4,5
を接合する場合にも同様に適用できる。In each of the above embodiments, the members are joined by hard brazing, but in the present invention, the graphite 2, the copper 3 and the insert materials 4, 5 are made by diffusion joining performed at a high temperature.
The same can be applied to the case of joining.
本発明によれば、黒鉛と銅を硬ろう付けや拡散接合で接
合した場合に冷却過程で黒鉛にクラックが生じることを
防止でき、実用的な大きさの黒鉛と銅からなる複合材が
得られる。この複合材は耐熱性に優れかつ接合強度が高
く、しかも真空雰囲気中で使用されても不純物ガスを発
生しないため、スパッタリングターゲットやＸ線発生用
ターゲットとして優れた性能を発揮する。According to the present invention, when graphite and copper are joined by hard brazing or diffusion joining, it is possible to prevent cracks from occurring in the graphite during the cooling process, and a composite material of graphite and copper having a practical size can be obtained. . This composite material has excellent heat resistance and high bonding strength, and does not generate an impurity gas even when used in a vacuum atmosphere, and therefore exhibits excellent performance as a sputtering target or an X-ray generation target.
第１図は本発明の第１実施例を示す複合材の断面図、第
２図は本発明の第２実施例を示す複合材の断面図であ
る。 １…複合材、２…黒鉛、３…銅、４…第１のインサート
材、５…第２のインサート材、6,7,8…硬ろう材。FIG. 1 is a sectional view of a composite material showing a first embodiment of the present invention, and FIG. 2 is a sectional view of a composite material showing a second embodiment of the present invention. 1 ... Composite material, 2 ... graphite, 3 ... copper, 4 ... first insert material, 5 ... second insert material, 6,7,8 ... hard brazing material.
Claims (1)
金属からなる２枚のインサート材を厚み方向に重ねて介
在させ、黒鉛側に位置する第１のインサート材はその線
膨張係数が銅の線膨張係数よりも小さくかつ黒鉛の線膨
張係数よりも大きい金属からなり、また銅側に位置する
第２のインサート材はその線膨張係数が黒鉛の線膨張係
数と同等もしくは黒鉛の線膨張係数よりも小さくかつ上
記第１のインサート材の線膨張係数よりも小さい金属か
らなり、これら２種類のインサート材を介して上記黒鉛
と銅を硬ろう付けまたは拡散接合によって互いに結合さ
せたことを特徴とする黒鉛と銅からなる複合材。1. A first insert material located on the graphite side has a coefficient of linear expansion, wherein two insert materials made of metals having different thermal expansion coefficients are interposed between graphite and copper so as to overlap each other in the thickness direction. Is made of a metal whose coefficient of linear expansion is smaller than that of copper and larger than that of graphite, and the second insert material located on the copper side has a coefficient of linear expansion equal to that of graphite or a coefficient of linear expansion of graphite. It is made of a metal having a coefficient of expansion smaller than that of the first insert material and a coefficient of linear expansion smaller than that of the first insert material, and the graphite and copper are bonded to each other by hard brazing or diffusion bonding through these two kinds of insert materials. Characteristic composite material consisting of graphite and copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61315494A JPH07100358B2 (en) | 1986-12-26 | 1986-12-26 | Composite material consisting of graphite and copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61315494A JPH07100358B2 (en) | 1986-12-26 | 1986-12-26 | Composite material consisting of graphite and copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63165132A JPS63165132A (en) | 1988-07-08 |
| JPH07100358B2 true JPH07100358B2 (en) | 1995-11-01 |
Family
ID=18066045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61315494A Expired - Lifetime JPH07100358B2 (en) | 1986-12-26 | 1986-12-26 | Composite material consisting of graphite and copper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07100358B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009039037A (en) * | 2007-08-09 | 2009-02-26 | Yanmar Co Ltd | Combine |
| US9536851B2 (en) * | 2014-09-05 | 2017-01-03 | Infineon Technologies Ag | Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60187546A (en) * | 1984-03-06 | 1985-09-25 | 株式会社東芝 | Graphite-copper joining member and manufacture thereof |
| JPS61183180A (en) * | 1985-02-06 | 1986-08-15 | 株式会社東芝 | Hot load resistant composite structure |
-
1986
- 1986-12-26 JP JP61315494A patent/JPH07100358B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63165132A (en) | 1988-07-08 |
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