JPH07101773B2 - Semiconductor device mounting method - Google Patents

Description

The present invention relates to a method for mounting a semiconductor device on a printed circuit board.

[Prior Art] Conventionally, a printed circuit board on which a semiconductor device is mounted has moisture-proof,
Acrylic resin solder resist is applied to prevent dust and peel off of the conductive pattern.When mounting semiconductor devices or electrical parts, remove the solder resist on the conductive pattern to expose the semiconductor The terminals of the device and other electrical parts were soldered.

In this case, a large number of terminals of the semiconductor device may be simultaneously connected to the conductive pattern by a bonding tool.

In the conventional printed circuit board as described above, when the semiconductor device is mounted, the solder resist on the conductive pattern to which the terminals of the semiconductor device are connected must be removed and exposed. Not only the number of steps is required, but incomplete removal of the solder resist may result in connection failure.

In order to solve such a problem, for example, Japanese Patent Laid-Open No. 63-
In the 299397 publication, a solder resist is applied on the surface of a printed circuit board except a region slightly larger than the surface area of a semiconductor device including terminals, and the semiconductor device is placed in an area where the solder resist is not applied and There is disclosed a mounting board of a semiconductor integrated circuit in which a terminal is connected to a conductive pattern exposed on the substrate.

[Problems to be Solved by the Invention] Since the solder resist removing operation can be omitted when mounting the semiconductor device on the semiconductor integrated circuit mounting substrate as described above, the number of steps can be reduced.

However, as shown in FIGS. 4 and 5, a plurality of semiconductor devices 4, 4a, 4b, 4c are normally randomly mounted on the printed circuit board 1 on the printed circuit board. 2 to terminals 5 of semiconductor devices 4 to 4c
However, if the semiconductor devices 4 to 4c have different sizes, the bonding tool has to be replaced each time, which is very troublesome.

In addition, the non-coated portion 6 of the solder resist is used for each semiconductor device 4
Since each ~ 4c is provided independently, the solder resist application part provided between adjacent semiconductor devices interferes with the bonding tool, and the conductive pattern and the terminals of the semiconductor device are securely connected. There are things you can't do.

The present invention has been made to solve the above problems, in mounting a plurality of semiconductor devices arranged in a line on a printed circuit board, omitting the work of removing the solder resist,
Moreover, it is an object of the present invention to provide a method for mounting a semiconductor device that does not cause a connection failure between the conductive pattern and a terminal of the semiconductor device and can be easily bonded by a bonding tool.

[Means for Solving the Problems] In the method for mounting a semiconductor device according to the present invention, a plurality of semiconductor devices each having a terminal protruding in a group in the opposing first and second directions are provided with a conductive pattern. In a method of mounting a semiconductor device mounted on a printed circuit board, a first region connected to the semiconductor device slightly larger than a total surface area of a first terminal group protruding in a first direction of the plurality of semiconductor devices, and a second region of the plurality of semiconductor devices. A second region that is slightly wider than the total surface area of the second terminal group and that extends in the direction of the second terminal group is provided on the surface of the printed circuit board at a distance substantially equal to the length between the protruding portions of the terminals. Solder resist is applied to the surface excluding the first and second regions, a plurality of semiconductor devices are arranged in a line between the first and second regions, and terminals are exposed in the first and second regions. The conductive pattern They are connected to each other.

[Operation] According to the present invention, since the solder resist is not applied to the connection portion of the conductive pattern, it is not necessary to remove the solder resist.

Further, when mounting a plurality of semiconductor devices arranged in a line, the terminals of these semiconductor devices can be simultaneously connected to the conductive pattern by one bonding tool.

[Embodiment] FIG. 1 is a plan view schematically showing an embodiment of the present invention, and FIG. 2 is a view showing a state in which a semiconductor device is mounted thereon.
It is an A expanded sectional view. The same parts as those in the conventional example shown in FIGS. 4 and 5 are designated by the same reference numerals, and the description thereof will be omitted.

According to the present invention, a plurality of semiconductor devices 4 to 4b, each of which has terminals 5 and 5a projecting in groups, are arranged in a row at predetermined intervals on opposite sides of a first direction and a second direction. The terminals 5 and 5a are connected to a conductive pattern provided on the printed board 1 for mounting.

In mounting, first, a continuous first region 6 which is slightly wider than the entire area of the first terminal groups 51, 51, 51 protruding in the first direction of the semiconductor devices 4 to 4b arranged in a row is formed. , Second
A second region that is slightly wider than the entire area of the second terminal groups 51a, 51a, 51a and is connected to the semiconductor device 4
To 4b are provided on the printed circuit board 1 at intervals substantially equal to the length (width) W between the protruding portions of the terminals 5 and 5a, and the printed circuit board 1 except for the first and second regions 6 and 6a. A solder resist 3 is applied to the surface of the above to expose the conductive patterns 2, 2a in the first and second regions 6, 6a.

Then, as shown in FIG. 3, a plurality of semiconductor devices 4 to 4b are arranged in a line by the bonding tool 7 and their respective terminals 5 and 5a are exposed in the first and second regions 6 and 6a. The conductive patterns 2 and 2a are connected individually or simultaneously.

If the protrusions 8 and 8a are provided at the tip of the bonding tool 7 and the protrusions 8 and 8a are brought into contact with the conductive patterns 2 and 2a and preheated, soldering can be performed more reliably.

According to the above-mentioned embodiment, since the semiconductor devices 4 to 4b are arranged in a line, the positioning at the time of bonding by the bonding tool 7 is easy, and the conductive patterns 2, 2a are also arranged.
Are arranged in a line, the flux can be transferred to the conductive pattern 2 at the same time.

Further, as in the conventional case, when the solder resist non-coated portions are provided independently for each semiconductor device, when the terminals of the individual semiconductor devices are bonded by the bonding tool, the adjacent semiconductor devices are not bonded. In some cases, the solder resist existing between the terminals interferes with the bonding, and the terminals cannot be surely connected. However, in the present invention, regions in which the solder resist is not applied are arranged in a line in the length direction of the semiconductor device. Since the terminals are connected to each other, the terminals can be surely connected by the bonding tool.

EFFECTS OF THE INVENTION As is apparent from the above description, according to the present invention, a plurality of semiconductor devices each having a terminal protruding in a group in the opposing first and second directions are printed with a conductive pattern. In a method of mounting a semiconductor device mounted on a substrate, a first region that is slightly wider than a total surface area of a first terminal group protruding in a first direction of the plurality of semiconductor devices, and a second direction of the plurality of semiconductor devices. Continuous second regions slightly wider than the total surface area of the second terminal group protruding on the printed circuit board at a distance substantially equal to the length between the projecting portions of the terminals. Solder resist is applied to the surface excluding the second region, a plurality of semiconductor devices are arranged in a line between the first region and the second region, and terminals are exposed in the first and second regions. Connect to each conductive pattern By doing so, the following effects can be obtained.

(1) Positioning of a semiconductor device by a bonding tool has conventionally been required to have accuracy in four directions, up, down, left and right, but in the present invention, only accuracy in the terminal length direction (vertical direction in FIG. 1) is required. Since the semiconductor devices are mounted side by side so that the accuracy of the terminals in the parallel direction (horizontal direction in FIG. 1) is not required, it is easy to position the bonding tool, and in particular, one bonding tool can be used to position multiple semiconductor devices. Since semiconductor devices can be bonded at the same time, man-hours can be significantly reduced.

(2) If the solder resist non-coating portions are provided independently corresponding to one semiconductor device as in the prior art, the resist coating portions between the adjacent semiconductor devices interfere with the bonding tool. , The connection between the terminal and the conductive pattern is difficult to be surely made, but in the present invention, since the non-coated portions of the solder resist are continuously provided in the length direction of the plurality of semiconductor devices arranged in a line, Such problems can be solved.

(3) It is easy to transfer the flux and preheat the conductive pattern.

(4) Area where solder resist is not applied (non-application area)
Since there is a solder resist between them, a conductive pattern can be provided at this position, so that the degree of freedom of wiring is high. Further, since the semiconductor device is mounted on this, even if the active surface of the semiconductor device is arranged to face the printed circuit board, problems such as insulation and inflow of solder do not occur, and therefore, The degree of freedom in mounting the semiconductor device can be increased.

(5) Since the labor of removing the solder resist can be omitted, the number of steps can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view schematically showing an embodiment of the present invention, and FIG.
FIG. 4 is an enlarged sectional view taken along line AA, FIG. 3 is a schematic view showing a bonding state according to the present invention, FIG. 4 is a plan view schematically showing an embodiment of a conventional semiconductor device, and FIG. -A
FIG. 1: Printed circuit board, 2, 2a: Conductive pattern, 3: Solder resist, 4, 4a, 4b: Semiconductor device, 5, 5a: Terminal, 51, 51a: Terminal group,
6: 1st area, 6a: 2nd area.

Claims (1)

[Claims] 1. A method for mounting a semiconductor device, comprising: mounting a plurality of semiconductor devices, each of which has a terminal protruding in a group in opposite first and second directions, on a printed board provided with a conductive pattern. Of the semiconductor device of the first projecting in the first direction
A first area connected slightly wider than the total surface area of the terminal group,
A second protrusion of the plurality of semiconductor devices in the second direction
A second region connected to the terminal group, which is slightly wider than the total surface area, is provided on the surface of the printed circuit board with a distance substantially equal to the length between the protruding portions of the terminals, and the first and second regions of the printed circuit board are provided. Solder resist is applied to the surface excluding two regions, a plurality of semiconductor devices are arranged in a line between the first region and the second region, and the terminals are exposed in the first and second regions. A method for mounting a semiconductor device, wherein the semiconductor device is connected to each of the conductive patterns.