JPH0715214A - Irreversible circuit element - Google Patents

Irreversible circuit element

Info

Publication number
JPH0715214A
JPH0715214A JP15720293A JP15720293A JPH0715214A JP H0715214 A JPH0715214 A JP H0715214A JP 15720293 A JP15720293 A JP 15720293A JP 15720293 A JP15720293 A JP 15720293A JP H0715214 A JPH0715214 A JP H0715214A
Authority
JP
Japan
Prior art keywords
conductor
substrate
conductor pattern
central
ferrite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP15720293A
Other languages
Japanese (ja)
Inventor
Kazuyoshi Kobayashi
和義 小林
Naoto Kobayashi
尚都 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP15720293A priority Critical patent/JPH0715214A/en
Publication of JPH0715214A publication Critical patent/JPH0715214A/en
Withdrawn legal-status Critical Current

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  • Non-Reversible Transmitting Devices (AREA)

Abstract

PURPOSE:To provide an irreversible circuit element capable of reducing the number of parts and obtaining correct cross angle of center conductors. CONSTITUTION:Conductor patterns 111a, 111b and 111c constituting parallel conductor patterns constituting one part of center conductors and the electrodes of capacitors and a resistor 113 are printed and formed on dielectric substrates 110 on both sides, a microwave ferrite 120, permanent magnet 140 and conductor board 130 are arranged above and under it, they are housed in shield cases 151 and 152, thus an isolator element is constituted. Thus, the dispersion of characteristics for each element can be reduced and further, parts cost and manufacturing cost can be reduced.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、マイクロ波やミリ波等
の高周波回路において使用されるアイソレータ或いはサ
ーキュレータ等の非可逆回路素子に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nonreciprocal circuit device such as an isolator or a circulator used in a high frequency circuit such as a microwave or a millimeter wave.

【0002】[0002]

【従来の技術】従来、サーキュレータやアイソレータ等
の非可逆回路素子は、予め定められた特定方向にのみ電
力を伝送し、逆方向には伝送しない特性を有している。
この特性を利用して、例えば、サーキュレータは送受信
分波器やフィルタ回路と組み合わせた多周波分波器とし
て用いられ、またアイソレータは高周波回路内のインピ
ーダンス整合、増幅器のトランジスタ保護等に使用され
ている。
2. Description of the Related Art Conventionally, non-reciprocal circuit elements such as circulators and isolators have a characteristic of transmitting electric power only in a predetermined specific direction and not transmitting electric power in the reverse direction.
Utilizing this characteristic, for example, a circulator is used as a multi-frequency demultiplexer combined with a transmission / reception demultiplexer or a filter circuit, and an isolator is used for impedance matching in a high-frequency circuit, transistor protection of an amplifier, etc. .

【0003】集中定数型の非可逆回路素子は、その集中
定数であるインダクタンス及びキャパシタンスを個別に
形成して組み立てられていた。この代表的な構成例とし
ては次の3つが上げられる。
Lumped constant type non-reciprocal circuit elements have been assembled by individually forming the lumped constants of inductance and capacitance. The following three are typical examples of this configuration.

【0004】即ち、第1の構成例としては、図2及び図
3に示すように、フェライト1及び網状の中心導体2を
挿入するための穴3aのあいた樹脂又はセラミックから
なる基板3を備え、この基板3上に形成された導体パタ
ーン3b,3c,3dからなるキャパシタンスと中心導
体2からなるインダクタンスを組み合わせて構成したも
のである。
That is, as a first configuration example, as shown in FIGS. 2 and 3, a substrate 3 made of resin or ceramic having holes 3a for inserting the ferrite 1 and the mesh-shaped central conductor 2 is provided, The capacitance formed by the conductor patterns 3b, 3c, 3d formed on the substrate 3 and the inductance formed by the central conductor 2 are combined.

【0005】この組立において、フェライト1は図3に
示すように中心導体2によって包まれ、この際、120
度の角度で交差した中心導体が互いに導通接触しないよ
うに絶縁フィルム4a,4bが介在される。中心導体2
に包まれたフェライト1は基板3の穴3aに挿入され、
中心導体2の3つの入出力用電極2a〜2cは基板3上
のコンデンサ電極となる導体パターン3b〜3dに接続
される。さらに、中心導体2の上部に永久磁石5が載置
された状態で、シールドケース6a,6bに収納され
る。ここで、基板3の裏面には一面に接地用の導体パタ
ーン(図示せず)が形成され、この導体パターンはシー
ルドケース6bに接触されている。
In this assembly, the ferrite 1 is surrounded by the central conductor 2 as shown in FIG.
The insulating films 4a and 4b are interposed so that the central conductors intersecting at an angle of degrees do not come into conductive contact with each other. Center conductor 2
Ferrite 1 wrapped in is inserted into hole 3a of substrate 3,
The three input / output electrodes 2a to 2c of the central conductor 2 are connected to the conductor patterns 3b to 3d which will be the capacitor electrodes on the substrate 3. Further, the permanent magnet 5 is placed on the upper part of the center conductor 2 and housed in the shield cases 6a and 6b. Here, a conductor pattern (not shown) for grounding is formed on one surface of the back surface of the substrate 3, and the conductor pattern is in contact with the shield case 6b.

【0006】第2の構成例としては、図4及び図5に示
すように、第1の構成例におけるインダクタンスを構成
する中心導体を、図5の(a)(b)に示すように両面プリン
ト基板7の表面71及び裏面72上に導体パターン7a
〜7jで形成し、キャパシタンスを形成する電極8b〜
8dが設けられた穴開き基板8上に組み合わせて構成し
たものである。
As a second configuration example, as shown in FIGS. 4 and 5, the central conductor constituting the inductance in the first configuration example is printed on both sides as shown in FIGS. 5 (a) and 5 (b). Conductive patterns 7a are formed on the front surface 71 and the back surface 72 of the substrate 7.
~ 7j to form a capacitance 8b ~
8d is provided in combination on the perforated substrate 8.

【0007】この組立において、穴開き基板8はこれと
ほぼ同形状の銅板9上に重ねられ、、さらにこれらは3
つの切り起こし突片10a〜10cが形成された銅板1
0上に重ねられる。ここで、穴開き基板8の裏面一面に
接地用の導体パターン(図示せず)が形成され、この導
体パターンは銅板9に接触されている。穴開き基板8及
び銅板9の穴8a,9aにはフェライト11aが挿入配
置され、この上に両面プリント基板7、フェライト11
b及び銅板12が重ねられ、これらは銅板10の突片1
0a〜10cによって所定部分が導通接続されると共に
全体が固定される。さらにこの上に永久磁石13が重ね
られ、これらはプラスチック樹脂ケース14及びシール
ドケース15a,15bに収納される。
In this assembly, the perforated substrate 8 is placed on a copper plate 9 having substantially the same shape as that of the perforated substrate 8.
Copper plate 1 with two cut-and-raised protrusions 10a to 10c
Stacked on 0. Here, a conductor pattern (not shown) for grounding is formed on the entire back surface of the perforated substrate 8, and this conductor pattern is in contact with the copper plate 9. A ferrite 11a is inserted and arranged in the holes 8a and 9a of the perforated substrate 8 and the copper plate 9, and the double-sided printed board 7 and the ferrite 11 are placed on the ferrite 11a.
b and the copper plate 12 are overlapped, and these are the protruding pieces 1 of the copper plate 10.
A predetermined portion is electrically connected by 0a to 10c and the whole is fixed. Further, a permanent magnet 13 is superposed on this, and these are housed in a plastic resin case 14 and shield cases 15a and 15b.

【0008】第3の構成例としては、図6に示すように
第1の構成例におけるキャパシタンス形成用基板にフェ
ライト挿入用の穴を形成しない基板16を用い、網状の
中心導体2と組み合わせて構成したものである。
As a third configuration example, as shown in FIG. 6, a substrate 16 in which a ferrite insertion hole is not formed is used as the capacitance forming substrate in the first configuration example and is combined with the mesh-shaped center conductor 2. It was done.

【0009】この組立において、フェライト1及び絶縁
フィルム4a,4bを包んだ中心導体2の上部に基板1
6が重ねられ、中心導体2の3つの入出力電極2a〜2
cが基板16上の電極パターン16a〜16cに接続さ
れる。さらに、基板16上には絶縁フィルム17及び入
出力端子が形成されたプラスチック樹脂製の枠体18が
重ねられ、中心導体2の下部には永久磁石19が配置さ
れ、これら全体がシールドケース20a〜20cに収納
される。
In this assembly, the substrate 1 is placed on top of the central conductor 2 enclosing the ferrite 1 and the insulating films 4a and 4b.
6 are overlapped, and three input / output electrodes 2a to 2 of the center conductor 2 are stacked.
c is connected to the electrode patterns 16a to 16c on the substrate 16. Further, a frame 18 made of plastic resin on which an insulating film 17 and an input / output terminal are formed is stacked on the substrate 16, and a permanent magnet 19 is arranged below the central conductor 2, and all of them are shield cases 20a ... It is stored in 20c.

【0010】[0010]

【発明が解決しようとする課題】しかしながら、前述し
た従来の非可逆回路素子においては、次のような問題点
があった。即ち、第1及び第3の構成例においてはフェ
ライト1を包む際に中心導体2を折り返したときに、そ
の交差角度を正確に120度均等に設定することが非常
に困難であり、また中心導体が重なることにより各中心
導体の入出力用電極とフェライトとの間の距離が異なる
ため、素子毎の特性にばらつきが生じる。また、第2の
構成例においては、前述した問題点は解消されるが、部
品点数が多いため、部品コスト及び製造コストが高くな
るという問題点があった。
However, the above-mentioned conventional non-reciprocal circuit device has the following problems. That is, in the first and third configuration examples, when the central conductor 2 is folded back when the ferrite 1 is wrapped, it is very difficult to set the intersecting angles to be exactly 120 degrees evenly. Since the distances between the input / output electrodes of the respective central conductors and the ferrite are different due to the overlapping, the characteristics of each element vary. Further, in the second configuration example, although the above-mentioned problems are solved, there is a problem that the cost of parts and the manufacturing cost are increased due to the large number of parts.

【0011】本発明の目的は上記の問題点に鑑み、部品
点数を低減すると共に中心導体の正確な交差角度を得ら
れる非可逆回路素子を提供することにある。
In view of the above problems, it is an object of the present invention to provide a non-reciprocal circuit device capable of reducing the number of parts and obtaining an accurate intersection angle of the center conductors.

【0012】[0012]

【課題を解決するための手段】本発明は上記の目的を達
成するために、互いに一端が接続され120度で交差す
る3つの中心導体と、該中心導体に対面配置された磁性
体と、前記各中心導体の他端に接続されたコンデンサと
を備えた非可逆回路素子において、前記中心導体を構成
する導体パターンと前記コンデンサの電極を構成する導
体パターンが形成された両面基板を設け、前記中心導体
を構成する導体パターンに対面して前記磁性体を配置し
た非可逆回路素子を提案する。
In order to achieve the above-mentioned object, the present invention has three center conductors, one end of which is connected to each other and intersects at 120 degrees, and a magnetic body facing the center conductor. In a non-reciprocal circuit device including a capacitor connected to the other end of each center conductor, a double-sided board having a conductor pattern forming the center conductor and a conductor pattern forming the electrodes of the capacitor is provided, We propose a nonreciprocal circuit device in which the magnetic material is arranged so as to face a conductor pattern that constitutes a conductor.

【0013】[0013]

【作用】本発明によれば、中心導体を構成する導体パタ
ーンと該中心導体の他端に接続されるコンデンサの電極
を構成する導体パターンが両面基板の表裏面に印刷形成
され、前記中心導体を構成する導体パターンに対面して
磁性体が配置されて非可逆回路素子が構成される。これ
により、前記中心導体の交差角度は各素子毎に同一とな
る。
According to the present invention, the conductor pattern forming the center conductor and the conductor pattern forming the electrode of the capacitor connected to the other end of the center conductor are formed by printing on the front and back surfaces of the double-sided board, A non-reciprocal circuit device is formed by arranging a magnetic body so as to face the conductor pattern. As a result, the intersection angle of the central conductors is the same for each element.

【0014】[0014]

【実施例】以下、図面に基づいて本発明の一実施例を説
明する。図1は、本発明の一実施例のアイソレータ素子
を示す構成図である。図において、110 はセラミック誘
電体基板(以下、基板と称する)、120 は円盤形状のマ
イクロ波フェライト、130 は導体板、140 は例えばマイ
クロ波フェライトと同面積を有する円盤形状の永久磁
石、151,152 は金属製のシールドケースである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing an isolator element according to an embodiment of the present invention. In the figure, 110 is a ceramic dielectric substrate (hereinafter referred to as substrate), 120 is a disc-shaped microwave ferrite, 130 is a conductor plate, 140 is a disc-shaped permanent magnet having the same area as the microwave ferrite, 151, 152 are It is a metal shield case.

【0015】基板110 は、図7に示すように例えば正方
形状に形成され、その表面には中心部の円形領域110a以
外の部分に3つのコンデンサの電極となる導体パターン
111a,111b,111c及び接地用の導体パターン112 が印刷形
成されると共に、導体パターン111cと導体パターン112
との間に接続された抵抗体113 が印刷形成されている。
ここで、円形領域110aはマイクロ波フェライト120 に対
応した形状に設定されている。
The substrate 110 is formed, for example, in a square shape as shown in FIG. 7, and a conductor pattern serving as electrodes of three capacitors is provided on the surface of the substrate 110 except for the circular region 110a at the center.
111a, 111b, 111c and the conductor pattern 112 for grounding are formed by printing, and the conductor pattern 111c and the conductor pattern 112 are also formed.
A resistor 113 connected between and is formed by printing.
Here, the circular region 110a is set to have a shape corresponding to the microwave ferrite 120.

【0016】さらに、基板110 の表面中央部の円形領域
110a内には、中心導体の一部を構成する3組の平行導体
パターン114a,114b,115a,115b,116a,116b が領域内中央
部から半径方向に放射状に形成され、各平行導体パター
ン間の交差角度は120度に設定されている。また、各
平行導体パターン114a,114b,115a,115b,116a,116b の一
端側は対応する導体パターン111a,111b,111cに接続され
ている。
Further, a circular area at the center of the surface of the substrate 110
In the 110a, three sets of parallel conductor patterns 114a, 114b, 115a, 115b, 116a, 116b forming a part of the central conductor are radially formed in the radial direction from the central portion of the region, and the parallel conductor patterns are arranged between the parallel conductor patterns. The intersection angle is set to 120 degrees. Further, one end side of each parallel conductor pattern 114a, 114b, 115a, 115b, 116a, 116b is connected to the corresponding conductor pattern 111a, 111b, 111c.

【0017】基板110 の裏面においては、表面中央部の
円形領域110aに対応する円形領域外の領域には、全面に
接地用の導体パターン117 が印刷形成されている。ま
た、裏面中央部の円形領域内には、表面の平行導体パタ
ーン114a,114b,115a,115b,116a,116b に続いて同一方向
に延びるように平行導体パターン114c,114d,115c,115d,
116c,116d が印刷形成され、それぞれの一端側は接地用
の導体パターン117 に接続されている。さらに、各平行
導体パターン114c,114d,115c,115d,116c,116d の他端側
は、それぞれスルーホール114e,114f,115e,115f,116e,1
16f を介して対応する平行導体パターン114a,114b,115
a,115b,116a,116b の他端側に接続されている。また、
基板110 裏面の接地用の導体パターン117 は、スルーホ
ール118 を介して表面の接地用の導体パターン112 に接
続され、表面の導体パターン111a,111b,111c にはそれ
ぞれ入出力端子119a,119b が半田付けされている。
On the back surface of the substrate 110, a conductor pattern 117 for grounding is printed and formed on the entire surface in a region outside the circular region corresponding to the circular region 110a at the center of the front surface. Further, in the circular area at the center of the back surface, parallel conductor patterns 114c, 114d, 115c, 115d, 115d, 115d, 115d, 115b, 115a, 115b, 116a, 116b, so as to extend in the same direction subsequently
116c and 116d are formed by printing, and one end side of each is connected to the conductor pattern 117 for grounding. Further, the other end side of each parallel conductor pattern 114c, 114d, 115c, 115d, 116c, 116d has through holes 114e, 114f, 115e, 115f, 116e, 1 respectively.
Corresponding parallel conductor patterns 114a, 114b, 115 via 16f
It is connected to the other end side of a, 115b, 116a, 116b. Also,
The grounding conductor pattern 117 on the back side of the substrate 110 is connected to the grounding conductor pattern 112 on the front side through the through holes 118, and the input / output terminals 119a and 119b are soldered to the front side conductor patterns 111a, 111b and 111c, respectively. It is attached.

【0018】導体板130 は、例えば所定の厚さを有する
銅板からなり、基板110 と同等の形状を有すると共に、
その中央部にはマイクロ波フェライト120 を挿入配置可
能な所定面積の開口部131 が形成されている。
The conductor plate 130 is made of, for example, a copper plate having a predetermined thickness, has the same shape as the substrate 110, and
An opening 131 having a predetermined area in which the microwave ferrite 120 can be inserted and arranged is formed in the central portion.

【0019】組立に際しては、導体板130 の開口部131
内にマイクロ波フェライト120 が挿入配置された後、こ
の導体板130 上に基板110 が重ねて配置される。これに
より、基板110 裏面の接地用導体パターン117 は導体板
130 に導電接触される。さらに、基板110 の中央部上に
永久磁石140 が配置された状態で、これら全てがシール
ドケース151,152 内に収納され、アイソレータ素子の組
立が完了する。
At the time of assembly, the opening 131 of the conductor plate 130
After the microwave ferrite 120 is inserted and arranged therein, the substrate 110 is arranged on the conductor plate 130 in an overlapping manner. As a result, the grounding conductor pattern 117 on the rear surface of the substrate 110 is
Conductive contact with 130. Further, with the permanent magnet 140 arranged on the central portion of the substrate 110, all of them are housed in the shield cases 151, 152, and the assembly of the isolator element is completed.

【0020】前述した構成によれば、図8に示す回路図
におけるインダクタL1は平行導体パターン114a〜114d
によって、インダクタL2は平行導体パターン115a〜11
5dによって、インダクタL3は平行導体パターン116a〜
116dによってそれぞれ構成され、コンデンサC1は導体
パターン111a,117によって、コンデンサC2は導体パタ
ーン111b,117によって、コンデンサC3は導体パターン
111c,117によってそれぞれ構成される。
According to the configuration described above, the inductor L1 in the circuit diagram shown in FIG. 8 has parallel conductor patterns 114a to 114d.
As a result, the inductor L2 becomes parallel conductor patterns 115a-11
By 5d, the inductor L3 causes the parallel conductor pattern 116a-
116d respectively, the capacitor C1 is composed of the conductor patterns 111a and 117, the capacitor C2 is composed of the conductor patterns 111b and 117, and the capacitor C3 is composed of the conductor patterns 111a and 117.
111c and 117 respectively.

【0021】従って、前述した本実施例によれば、中心
導体は基板110 上に印刷形成された導体パターンによっ
て構成されるので、その交差角度を正確に120度均等
に設定することができ、また両面基板の表裏にほぼ同様
の配置で3つの中心導体を形成しているので、各中心導
体とフェライトとの間の距離が等しくなり、素子毎の特
性にばらつきが生じることが少ない。また、従来例に比
べて部品点数が少なくなり、部品コスト及び製造コスト
を低減することができる。
Therefore, according to the above-described embodiment, since the central conductor is formed by the conductor pattern formed by printing on the substrate 110, the intersecting angles thereof can be set accurately at 120 degrees, and Since the three central conductors are formed on the front and back surfaces of the double-sided substrate in substantially the same arrangement, the distances between the central conductors and the ferrite are equal, and the characteristics of each element rarely vary. Further, the number of parts is reduced as compared with the conventional example, and the parts cost and the manufacturing cost can be reduced.

【0022】尚、本実施例の構成は一例でありこれに限
定されることはない。
The configuration of this embodiment is an example, and the present invention is not limited to this.

【0023】[0023]

【発明の効果】以上説明したように本発明によれば、中
心導体を構成する導体パターンと該中心導体の他端に接
続されるコンデンサの電極を構成する導体パターンが両
面基板上に印刷形成され、前記中心導体を構成する導体
パターンに対面して磁性体が配置されて非可逆回路素子
が構成されるので、従来に比べて部品点数を低減するこ
とができ、これによりコストの低減を図ることができ
る。さらに、前記中心導体の交差角度は各素子毎に同一
となるので、素子毎の特性のばらつきを少なくすること
ができ、常に設計値通りの最良の特性を得ることができ
る。
As described above, according to the present invention, the conductor pattern forming the center conductor and the conductor pattern forming the electrode of the capacitor connected to the other end of the center conductor are formed by printing on the double-sided board. Since the non-reciprocal circuit element is formed by arranging the magnetic body facing the conductor pattern forming the central conductor, the number of parts can be reduced as compared with the conventional one, and thereby the cost can be reduced. You can Further, since the intersection angle of the central conductors is the same for each element, it is possible to reduce variations in characteristics of each element and always obtain the best characteristics as designed.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す構成図FIG. 1 is a configuration diagram showing an embodiment of the present invention.

【図2】第1の従来例を示す構成図FIG. 2 is a configuration diagram showing a first conventional example.

【図3】第1の従来例における中心導体とフェライトの
包囲構成を示す図
FIG. 3 is a diagram showing a surrounding structure of a central conductor and a ferrite in a first conventional example.

【図4】第2の従来例を示す構成図FIG. 4 is a configuration diagram showing a second conventional example.

【図5】第2の従来例における基板を示す構成図FIG. 5 is a configuration diagram showing a substrate in a second conventional example.

【図6】第3の従来を示す構成図FIG. 6 is a block diagram showing a third conventional example.

【図7】本発明の一実施例における基板を示す構成図FIG. 7 is a configuration diagram showing a substrate according to an embodiment of the present invention.

【図8】本発明の一実施例のアイソレータ素子を示す回
路図
FIG. 8 is a circuit diagram showing an isolator element according to an embodiment of the present invention.

【符号の説明】 110 …セラミック誘電体基板、111a,111b,111c…導体パ
ターン(コンデンサ用電極)、112 …接地用導体パター
ン、113 …抵抗体、114a〜114d,115a〜115d,116a〜11
6d…平行導体パターン(中心導体)、114e,114f,115e,1
15f,116e,116f,118…スルーホール、117 …接地用導体
パターン、120 …マイクロ波フェライト、130 …導体
板、140 …永久磁石、151,152 …シールドケース。
[Explanation of reference symbols] 110 ... Ceramic dielectric substrate, 111a, 111b, 111c ... Conductor pattern (capacitor electrode), 112 ... Grounding conductor pattern, 113 ... Resistor, 114a to 114d, 115a to 115d, 116a to 11
6d… Parallel conductor pattern (center conductor), 114e, 114f, 115e, 1
15f, 116e, 116f, 118 ... through hole, 117 ... grounding conductor pattern, 120 ... microwave ferrite, 130 ... conductor plate, 140 ... permanent magnet, 151, 152 ... shield case.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 互いに一端が接続され120度で交差す
る3つの中心導体と、該中心導体に対面配置された磁性
体と、前記各中心導体の他端に接続されたコンデンサと
を備えた非可逆回路素子において、 前記中心導体を構成する導体パターンと前記コンデンサ
の電極を構成する導体パターンが形成された両面基板を
設け、 前記中心導体を構成する導体パターンに対面して前記磁
性体を配置したことを特徴とする非可逆回路素子。
1. A non-equipment comprising: three central conductors, one end of which is connected to each other and intersecting at 120 degrees; a magnetic body facing the central conductor; and a capacitor connected to the other end of each of the central conductors. In a reversible circuit element, a double-sided substrate on which a conductor pattern forming the central conductor and a conductor pattern forming the electrode of the capacitor are formed is provided, and the magnetic body is arranged facing the conductor pattern forming the central conductor. A non-reciprocal circuit device characterized by the above.
JP15720293A 1993-06-28 1993-06-28 Irreversible circuit element Withdrawn JPH0715214A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15720293A JPH0715214A (en) 1993-06-28 1993-06-28 Irreversible circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15720293A JPH0715214A (en) 1993-06-28 1993-06-28 Irreversible circuit element

Publications (1)

Publication Number Publication Date
JPH0715214A true JPH0715214A (en) 1995-01-17

Family

ID=15644441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15720293A Withdrawn JPH0715214A (en) 1993-06-28 1993-06-28 Irreversible circuit element

Country Status (1)

Country Link
JP (1) JPH0715214A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116154438A (en) * 2022-12-29 2023-05-23 大连麻利那电子有限公司 Patch type circulator
WO2023092372A1 (en) * 2021-11-25 2023-06-01 华为技术有限公司 Circulator, isolator, and communication device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023092372A1 (en) * 2021-11-25 2023-06-01 华为技术有限公司 Circulator, isolator, and communication device
CN116154438A (en) * 2022-12-29 2023-05-23 大连麻利那电子有限公司 Patch type circulator

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