JPH07162155A - Multi-layer connection structure of circuit body and multi-layer connection method of circuit body - Google Patents

Abstract

(57) [Abstract] [Purpose] To facilitate positioning, fixing and connection of circuit
Reduce the number of processes and parts. [Structure] At least one pair of circuit bodies 11 connected in multiple layers,
21, a cone-shaped protruding conducting portion 12 protruding in the layer direction is provided on one side, and a circular hole conducting portion 23 fitted at a predetermined height position of the protruding conducting portion 12 is provided on the other side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-layer connection structure of circuit bodies for multi-layer connection of at least one pair of circuit bodies, and a multi-layer connection method of circuit bodies.

[0002]

2. Description of the Related Art Conventionally, when a substrate as a circuit body is formed, it is formed by the following method, for example. First, as shown in FIG. 8, a substrate 2a having a ridge pattern 1 is formed by a die and then subjected to a catalyst treatment for surface roughening, and then, as shown in FIG. After being inserted into the tee, the cavity is filled with liquid plastic to mold the substrate 2b as a secondary molded product. At this time, the surface of the ridge pattern 1 is exposed. Then, as shown in FIG. 10, only the ridge pattern 1 exposed to the outside is plated to form a substrate 2c as a plastic molded product.
A clearance hole (or a through hole) 3 is formed at a required position on the ridge pattern 1.

In addition to this, molding is performed by the following method. in this case,
As shown in FIG. 11, the substrate 4a is molded by, for example, a mold,
Only the circuit pattern portion 5 is irradiated with ultraviolet rays, and only the activated portion is electroless plated to form a substrate as a plastic molded product. Also in this case, a clearance hole (or a through hole) 6 is formed at a required position of the circuit pattern portion 5.

When a plurality of substrates formed by these methods are laminated and connected in multiple layers via the clearance holes 3 (6), for example, as shown in FIG. This is carried out by inserting the (terminal) 7 and subjecting the conductor (terminal) 7 to soldering, for example.

A plurality of substrates are laminated to form a through hole 3 '.
In the case of multi-layer connection via (6 ′), for example, as shown in FIG. 13, the through hole 3 ′ (6 ′) is plated.

[0006]

Conventionally, when a plurality of substrates are laminated and connected in multiple layers by using a surface contact method such as a clearance hole or a through hole, there is a problem that the number of steps is large and the number of parts is increased.

In particular, in the case of a clearance hole which requires soldering, fixing and positioning are required, which makes the structure and process more complicated.

The present invention has been made in view of the above problems, and it is easy to position, fix and connect a circuit body,
An object of the present invention is to provide a multi-layer connection structure for a circuit body and a multi-layer connection method for a circuit body that can reduce the number of steps and the number of components.

[0009]

The invention according to claim 1 is
At least one pair of circuit bodies that are connected in multiple layers is provided, and one side is provided with a conical projecting conducting portion projecting in the layer direction, and the other is provided with a circular hole conducting portion that fits at a predetermined height position of the projecting conducting portion. It is characterized by

According to a second aspect of the present invention, there is provided at least one pair of circuit bodies that are connected in multiple layers, one side of which is provided with a conical projecting conducting portion projecting in the layer direction, and the other is provided with a predetermined height position of the projecting conducting portion. A multi-layer connection method for a circuit body provided with a circular hole conducting portion to be fitted to, wherein the plurality of circuit bodies are arranged in multiple layers, and the hole conducting portion is fitted to the projecting conducting portion for multi-layer connection. It is characterized by

According to a third aspect of the present invention, there is provided a multi-layer connection device for a circuit body according to the first aspect or a multi-layer connection method for a circuit body according to the second aspect, wherein the projecting conduction portion and the hole conduction portion are provided. , Is provided in the bus bar of the circuit body.

[0012]

According to the first aspect of the present invention, a circle provided at a predetermined height position of the conical projection conducting portion provided at a required position of one circuit body, and a circle provided at a required position of the other circuit body. The shape hole conducting portion is fitted, and the conical protruding conduction portion and the circular hole conducting portion are connected by soldering or welding.

According to the second aspect of the present invention, the circular hole conducting portions of the other plurality of circuit bodies are sequentially fitted into a predetermined height position of the conical protruding conducting portion of one circuit body, The conical protruding conduction portion and the circular hole conduction portion of the other plurality of circuit bodies are connected by soldering, welding, or the like. At this time, by adjusting the hole diameter of each circular hole conducting portion, the heights of the connecting surfaces of the other plurality of circuit bodies can be sequentially made different, and the hole diameter can be made larger than that of the conical protruding conducting portion. If so, conduction can be avoided.

According to the third aspect of the present invention, since the protruding conducting portion and the hole conducting portion are provided on the bus bar of the circuit body, the circuit body can be laminated with a small number of parts.

[0015]

The present invention will be described below with reference to the illustrated embodiments.

FIG. 1 is an enlarged explanatory view of a main part for explaining a multi-layer connection structure of a circuit body and a multi-layer connection method of a circuit body according to an embodiment of the present invention. A board 11 which is a circuit body shown in the drawing has a conical protruding conduction portion 12 formed at a required position, that is, a position where branching or terminal connection is made. When the conical protruding conduction part 12 is formed on the substrate 11, for example, when the substrate 11 is formed by a mold, the conical protruding conduction part 12 is also formed by the same mold. That is, both are integrally formed with a mold. As will be described later in detail, it is preferable that the inside of the conical protruding conduction portion 12 is hollow and the back surface is concave. Further, the thickness of the conical protruding conduction portion 12 is made constant also for preventing sink marks during molding. The conical protrusions 12 can facilitate the positioning (such as absorption of stress strain due to contraction between compositely connected circuit bodies) for stacking the upper substrate. After that, for example, only the circuit pattern portion including the conical protruding conduction portion 12 is irradiated with ultraviolet rays, and only the activated portion is electroless plated,
The circuit pattern 13 is formed.

The substrate 1 having the conical protruding conductive portion 12
In the case of molding 1, for example, when the substrate 11 is molded with a mold, the conical protruding conduction part 12 is also formed with the same mold.
In particular, when the circuit pattern forming the conical protruding portion 12 is formed as a ridge pattern, the substrate 11 is inserted into the cavity of the mold after catalytic treatment for surface roughening, Fill the cavity with liquid plastic. Then, a method of plating only the ridge pattern and the conical protrusion conducting portion 12 exposed on the surface may be used.

The substrate 21, which is another circuit body laminated on the substrate 11, has a circular or inverted mortar-shaped hole conducting portion 23 at a desired position, that is, at a position where a circuit pattern 22 is formed to branch or end. Are formed. The inclination angle of the inverted mortar-shaped hole conducting portion 23 is the conical protruding conducting portion 1
A tilt angle of 2 is preferred. As the other circuit body, in addition to the board 21, a molded board, a normal wiring board, an FFC, an FPC, a bus bar or the like can be used.

When the substrate 21 is laminated on the substrate 11, the inverted mortar-shaped hole conducting portion 23 of the substrate 21 is positioned on the conical protruding conducting portion 12 of the substrate 11, and the conical protruding portion of the substrate 11 is positioned. The inverted mortar-shaped hole conducting portion 23 of the substrate 21 is overlaid and fitted on the conducting portion 12. At this time, the circuit pattern 13 on the substrate 11 and the circuit pattern 22 on the substrate 21 contact each other.
The diameter of the hole conducting portion 23 determines the fitting position of the conical projecting conducting portion 12 of the substrate 11, that is, the predetermined height position. Therefore, it is desirable to appropriately adjust the diameter of the hole conducting portion 23. After that, in the conical protruding conduction portion 12 of the substrate 11, a portion protruding upward from the inverted mortar-shaped hole conduction portion 23 of the substrate 21 and the periphery of the inverted mortar-shaped hole conduction portion 23 of the substrate 21. The circuit pattern 22 portion is joined by, for example, soldering or laser welding.

FIG. 2 is a cross-sectional view for explaining a specific example of circuit body lamination, FIG. 3 is an enlarged perspective view of an essential part for explaining the stage before the circuit body lamination, and FIG. 4 is for the stage after the circuit body lamination. FIG. In this case, the lowermost substrate 11 has, for example, four conical protruding conductive portions 12a, 1 at desired positions.
2b, 12c and 12d are molded. For example, four inverted mortar-shaped hole conducting portions 23a, 23b, 23c, and 23d are formed at required positions on a substrate (for example, a wiring substrate) 21 which is the second layer from the bottom and is laminated on the substrate 11 which is the lowermost layer. And the corresponding conical protruding portions 12a, 12a
It is inserted through b, 12c and 12d. Then, the circuit pattern 22 around the inverted mortar-shaped hole conducting portions 23a, 23b, 23d has a conical protruding conducting portion 12a, 12b.
, 12d by soldering or laser welding.
Further, the conical protruding conductive portion 12d absorbs the stress strain due to the contraction of the substrate (wiring substrate) 21. However, on the other hand, since the third inverted mortar-shaped hole conducting portion 23c from the left does not need to be connected to the conical protruding conductive portion 12c, the diameter is larger than that of the other inverted mortar-shaped hole conducting portions 23a, 23b, 23d. Is large and is not in contact with the conical protruding conduction portion 12c.

On the bus bar 31, which is the third layer from the bottom and is laminated on the lowermost substrate 11, the inverted mortar-shaped hole conducting portions 23a, 23b, 23d to which the substrate (wiring substrate) 21 is welded.
Hole conducting portion 32 which is two mere holes having a smaller diameter than
a, 32c and these two hole conducting parts 32a, 32c
A hole conducting portion 32c which is a simple hole having a diameter larger than that of the hole conducting portion 32a, 32b, 32c is formed.
Are inserted into the conical protruding portions 12a, 12b, 12c. The bus bar 31 portion around the hole conducting portions 32a, 32c is joined to the conical protruding conducting portions 12a, 12c by soldering or laser welding. However, since the central hole conducting portion 32b does not need to be joined to the conical protruding conducting portion 12b, it has a large diameter and the conical protruding conducting portion 1b has a large diameter.
It is not joined to 2b.

As shown in FIG. 2, a board (wiring board) 21
Reverse mortar-shaped holes to be welded 23a, 23b, 2
Since the diameter of the inverted mortar-shaped hole conducting portions 32a and 32c of the bus bar 31 to be welded is smaller than that of 3d, the board (wiring substrate) 21 and the bus bar 31 are formed on the conical protruding conducting portions 12a, 12b and 12c. There is an appropriate space between them, and there is no risk of contact between them and causing a short circuit.

As shown in FIG. 3, when a multilayer structure is intended, a substrate (wiring substrate) 21 is laminated and welded on the lowermost substrate 11, and then a bus bar 31 is laminated and welded thereon.

As shown in FIG. 4, the conical protruding conductive portion 12 is formed.
Since the stress strain due to the contraction of the substrate (wiring substrate) 21 can be absorbed, the lowermost substrate 11 and the substrate (wiring substrate) 21 can be stacked with their corners aligned.

In this embodiment, the conical protruding conducting portion 12 is formed on the substrate 11, and the conical protruding conducting portion 1 is formed on the substrate 21.
Reverse mortar-shaped hole conducting portion 23 engaging with 2, bus bar 31
A hole conducting portion 32, which is a simple hole, is formed, and the conical protruding conducting portion 12 of the substrate 11 is sequentially fitted with the inverted mortar-shaped hole conducting portion 23 of the substrate 21 and the hole conducting portion 32 of the bus bar 31. Since it is configured as described above, with a small number of parts on the substrate 11,
The board 21 and the bus bar 31 can be connected in multiple layers. Moreover, since the hole diameter of the hole conducting portion 32 of the bus bar 31 is smaller than the hole diameter of the inverted mortar-shaped hole conducting portion 23 of the substrate 21, the substrate 21 and the bus bar 31 are mutually formed in a multilayer structure. It is possible to easily perform positioning, fixing and connection of the board 21 and the bus bar 31 to the board 11 with a proper space.

Since the board 21 and the bus bar 31 do not need to be fitted into the conical protruding conductive portion 12, a hole conductive portion having a diameter larger than that of the conical protruding conductive portion 12 is formed. , And the portion of the bus bar 31 that does not need to be connected to the conical protruding conduction portion 12 is the conical protruding conduction portion 1.
It can be avoided from 2.

FIG. 5 is a perspective view showing an example of connection between the conical protruding conductive portion and another circuit body. It is also possible to connect the electric wire 41 to the conical projection conducting portion 12. In that case,
The covering material may be removed at a desired position of the electric wire 41, the electric wire portion exposed to the outside may be joined to the conical protruding conductive portion 12, and the electric wire portion may be soldered or laser welded.

FIG. 6 is an enlarged cross-sectional view of a main part showing a concrete example in which the conical protruding conductive portion is formed in a circuit body other than the substrate. The conical protruding conduction portion 52 can be formed by punching a bus bar molded material 51 of copper alloy, for example.
Also in this case, the back surface has a concave shape. Further, it is possible to easily position the upper substrate (bus bar) 61 with respect to stacking (such as absorption of stress strain due to contraction between the compositely connected circuit bodies). Needless to say, the bus bar 61, which is another circuit body, may be formed with a simple circular hole conducting portion 62 in consideration of the diameter.

FIG. 7 is a perspective view showing a concrete example of the case where the conical protruding conductive portion is formed in the circuit body in the junction box. The conical protruding conduction portion can be applied to the circuit body 71 in the junction box. In that case,
The large-current bus bar 8 is provided in the conical protruding conductive portion 73 formed on the required circuit pattern 72 of the substrate 71 which is a circuit body.
1 etc. can be joined appropriately.

[0030]

According to the first aspect of the present invention, the cone-shaped protruding conducting portion provided at a required position of one circuit body is provided at a predetermined height position and the other circuit body is provided at a required position thereof. The circular hole conduction part is fitted and the conical protruding conduction part and the circular hole conduction part are connected by soldering or welding, so positioning, fixing and connection of the upper layer circuit body is easy in sequence. Therefore, the number of processes and the number of parts can be reduced. Further, the conical protruding portions can absorb the strain due to the contraction rate of the mutual circuit bodies, and the positioning can be corrected for the lamination of the upper substrate.

According to the second aspect of the present invention, the circular hole conducting portions of the other plurality of circuit bodies are sequentially fitted at the predetermined height positions of the conical protruding conducting portions of the one circuit body. , The conical protruding conduction part and the circular hole conduction parts of the other plurality of circuit bodies are connected by soldering or welding, so that the upper layer circuit bodies can be easily positioned, fixed and connected in sequence. The number of processes and the number of parts can be reduced. Further, the circuit bodies of the respective layers can be stacked at appropriate intervals without contacting each other. Further, the conical conduction portion can absorb the strain due to the contraction rate of the mutual circuit bodies, and the positioning can be corrected with respect to the lamination of the upper substrate.

According to the third aspect of the present invention, since the protruding conducting portion and the hole conducting portion are provided on the bus bar of the circuit body, the number of parts and the number of steps can be further reduced.

[Brief description of drawings]

FIG. 1 is an enlarged explanatory view of a main part for explaining a multilayer connecting method of a circuit body and a multilayer connecting structure of a circuit body according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a specific example of stacking circuit bodies.

FIG. 3 is an enlarged perspective view of an essential part for explaining a stage before stacking of circuit bodies.

FIG. 4 is an enlarged perspective view of an essential part for explaining a stage after the circuit body is laminated.

FIG. 5 is a perspective view showing an example of connection between a conical protruding conduction portion and another circuit body.

FIG. 6 is an enlarged cross-sectional view of a main part showing a specific example in which the conical protruding conduction part is formed of another circuit body.

FIG. 7 is a perspective view showing a specific example of a case where a conical protruding conduction portion is formed in a circuit body in a junction box.

FIG. 8 is a perspective view showing a manufacturing process of a former stage of a substrate which is a conventional circuit body.

FIG. 9 is a perspective view showing a manufacturing process of a middle stage of a substrate which is a conventional circuit body.

FIG. 10 is a perspective view showing a manufacturing process of a latter stage of a substrate which is a conventional circuit body.

FIG. 11 is a perspective view showing another method of manufacturing a substrate which is a conventional circuit body.

FIG. 12 is a cross-sectional view showing a configuration of multilayer connection of substrates which are conventional circuit bodies.

FIG. 13 is a cross-sectional view showing the configuration of another multilayer connection of a board which is a conventional circuit body.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 board (circuit body) 12 conical protruding conduction part 13 circuit pattern 21 board (other circuit body) 22 circuit pattern 23 inverted mortar-shaped hole conduction part 31 bus bar (other circuit body) 32 hole conduction part 41 electric wire 51 Bus bar (circuit body) 52 Conical protruding conduction portion 61 Bus bar (other circuit body) 62 Hole conducting portion 71 Substrate (circuit body) 72 Circuit pattern 73 Conical protruding conduction portion 81 Bus bar (other circuit body)

Claims (4)

[Claims] 1. At least one pair of circuit bodies for multi-layer connection are provided, one of which is provided with a conical projecting conduction portion projecting in the layer direction, and the other of which is a circular shape fitted at a predetermined height position of the projecting conduction portion. A multilayer connection structure of a circuit body, characterized in that a hole conducting portion is provided. 2. The multilayer connection structure for a circuit body according to claim 1, wherein the projecting conducting portion and the hole conducting portion are provided on a bus bar of the circuit body. Multi-layer connection structure 3. At least one pair of circuit bodies that are connected in multiple layers is provided, one of which is provided with a conical projecting conduction portion projecting in the layer direction, and the other of which is a circular shape that is fitted at a predetermined height position of the projecting conduction portion. A multilayer connection method for a circuit body, comprising: providing a hole conducting portion, arranging the plurality of circuit bodies in multiple layers, and fitting the hole conducting portion into the projecting conducting portion to perform multilayer connection. 4. The circuit body multilayer connection method according to claim 3, wherein the protruding conducting portion and the hole conducting portion are provided on a bus bar of the circuit body. Multi-layer connection method.