JPH07176843A - Laminated board for printed circuit - Google Patents
Laminated board for printed circuitInfo
- Publication number
- JPH07176843A JPH07176843A JP32238893A JP32238893A JPH07176843A JP H07176843 A JPH07176843 A JP H07176843A JP 32238893 A JP32238893 A JP 32238893A JP 32238893 A JP32238893 A JP 32238893A JP H07176843 A JPH07176843 A JP H07176843A
- Authority
- JP
- Japan
- Prior art keywords
- inorganic filler
- epoxy resin
- parts
- varnish
- aspect ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 34
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 34
- 239000011256 inorganic filler Substances 0.000 claims abstract description 33
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 33
- 239000011521 glass Substances 0.000 claims abstract description 27
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002966 varnish Substances 0.000 abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 14
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- 229910052802 copper Inorganic materials 0.000 abstract description 9
- 239000010949 copper Substances 0.000 abstract description 9
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 abstract description 5
- 239000011889 copper foil Substances 0.000 abstract description 5
- 229910001679 gibbsite Inorganic materials 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 239000004744 fabric Substances 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 239000010445 mica Substances 0.000 abstract description 3
- 229910052618 mica group Inorganic materials 0.000 abstract description 3
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、寸法変化率、ドリル加
工性、打抜加工性に優れた印刷回路用積層板に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit laminate having excellent dimensional change rate, drilling workability and punching workability.
【０００２】[0002]
【従来の技術】印刷回路用の銅張積層板は、その印刷回
路板への加工工程中におけるコストの削減の目的のた
め、従来の銅メッキによるスルーホールの形成に代わっ
て、銀ペーストによるスルーホールの形成が導入され、
フェノール樹脂積層板においては十数年前より実施され
ている。更に、穴の中に導電性ペーストを充填し、その
上からメッキ加工し、スルホール上にパッドを形成し配
線密度を向上させる方法が最近実施されている。後者の
用途へは、回路の精密化のため、そして積層板の臭気の
問題からエポキシ樹脂コンポジット基材銅張積層板ある
いはエポキシ樹脂ガラス基材銅張積層板が使用されてい
る。2. Description of the Related Art Copper clad laminates for printed circuits have been replaced with conventional silver plated through-holes instead of conventional copper-plated through-holes for the purpose of cost reduction during the process of manufacturing the printed circuit boards. Hole formation was introduced,
Phenolic resin laminates have been used for more than a dozen years. Further, a method of filling a conductive paste in the holes and performing plating on the holes to form pads on the through holes to improve the wiring density has been recently implemented. For the latter use, an epoxy resin composite-based copper-clad laminate or an epoxy resin glass-based copper-clad laminate is used because of the precision of the circuit and because of the odor problem of the laminate.
【０００３】その上、紙フェノール樹脂銅張積層板は、
メッキスルホールの信頼性が劣る、充填された導電性ペ
ーストの硬化時に発生するガスによりペースト内にボイ
ドを形成するなど問題がある。In addition, paper phenolic resin copper clad laminates are
There are problems such as poor reliability of plated through holes and formation of voids in the paste due to the gas generated when the filled conductive paste is cured.
【０００４】一方、エポキシ樹脂コンポジット基材銅張
積層板やエポキシ樹脂ガラス基材銅張積層板はガラス織
布を使用しているためコスト高という不具合がある。加
工性向上及びコストダウンのため、ガラス不織布のみの
構成による積層板があるが、ガラス織布層がないため、
寸法変化率が大きい等の欠点がある。On the other hand, the epoxy resin composite-based copper clad laminate and the epoxy resin glass-based copper clad laminate have a problem of high cost because they use glass woven cloth. In order to improve workability and reduce costs, there are laminated plates made of only glass non-woven fabric, but since there is no glass woven fabric layer,
There are drawbacks such as a large dimensional change rate.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、上記のよう
な問題点を解決するために種々検討の結果なされたもの
で、寸法変化率、ドリル加工性が良好である印刷回路用
積層板を提供することにある。DISCLOSURE OF THE INVENTION The present invention has been made as a result of various studies in order to solve the above problems, and provides a printed circuit laminate having a good dimensional change rate and good drilling workability. To provide.
【０００６】[0006]
【課題を解決するための手段】本発明は、樹脂含浸基材
がエポキシ樹脂と無機フィラーを含浸したガラス不織布
のみから構成され、これを加熱加圧成形してなる印刷回
路用積層板であって、樹脂１００重量部に対し無機フィ
ラーが１０〜２００重量部含有されており、無機フィラ
ーの一部または全部が、平面方向と厚さ方向の長さの比
（以下、アスペクト比という） ５.０〜２００のもので
あるものことを特徴とする印刷回路用積層板に関するも
のである。SUMMARY OF THE INVENTION The present invention is a laminated board for a printed circuit, wherein a resin-impregnated base material is composed only of a glass non-woven fabric impregnated with an epoxy resin and an inorganic filler, which is heat-press molded. The inorganic filler is contained in an amount of 10 to 200 parts by weight with respect to 100 parts by weight of the resin, and a part or all of the inorganic filler has a length ratio in the plane direction and the thickness direction (hereinafter, referred to as an aspect ratio) 5.0. The present invention relates to a laminated board for a printed circuit, characterized in that
【０００７】本発明において、ガラス不織布層に用いる
エポキシ樹脂は臭素化エポキシ樹脂、非臭素化エポキシ
樹脂、ビスフェノールＡ型エポキシ樹脂などいずれであ
ってもよく、それらの混合であってもよいが、好ましく
はビスフェノールＡ型エポキシ樹脂及びノボラック型エ
ポキシ樹脂を主成分とするエポキシ樹脂である。In the present invention, the epoxy resin used for the glass non-woven fabric layer may be any of brominated epoxy resin, non-brominated epoxy resin, bisphenol A type epoxy resin and the like, and may be a mixture thereof, but it is preferable. Is an epoxy resin containing bisphenol A type epoxy resin and novolac type epoxy resin as main components.
【０００８】更に、エポキシ樹脂とともに無機質フィラ
ーが含有されているが、その含有量は、樹脂１００重量
部に対して１０〜２００重量部である。無機質フィラー
は、その一部又は全部として、アスペクト比が ５.０〜
２００であるものを使用する。従って、アスペクト比
５.０〜２００の無機フィラーの含有量は樹脂１００重
量部に対して１０〜２００重量部である。１０重量部よ
り少量であると、その配合効果が小さく繊維方向は勿論
厚さ方向の熱膨張率が大きくなる。一方２００重量部よ
り多いとワニス中に均一に分散させることが困難とな
る。Further, an inorganic filler is contained together with the epoxy resin, and the content thereof is 10 to 200 parts by weight with respect to 100 parts by weight of the resin. Part or all of the inorganic filler has an aspect ratio of 5.0 to 5.0.
The one that is 200 is used. Therefore, the aspect ratio
The content of the inorganic filler of 5.0 to 200 is 10 to 200 parts by weight with respect to 100 parts by weight of the resin. When the amount is less than 10 parts by weight, the compounding effect is small and the coefficient of thermal expansion in the thickness direction as well as the fiber direction becomes large. On the other hand, if it is more than 200 parts by weight, it becomes difficult to disperse it uniformly in the varnish.
【０００９】アスペクト比が ５.０以下では寸法変化率
を小さくする効果が低下し、かかるフィラーを配合する
効果が十分に現れない。２００以上では含浸性が不良と
なり、ドリル加工性も低下するようになる。アスペクト
比が ５.０以上の無機フィラーとしては、マイカ、グラ
ファイト、ウオラストナイトなどがある。When the aspect ratio is 5.0 or less, the effect of reducing the dimensional change rate is lowered, and the effect of blending such a filler is not sufficiently exhibited. When it is 200 or more, the impregnation property becomes poor and the drill workability also deteriorates. Examples of the inorganic filler having an aspect ratio of 5.0 or more include mica, graphite and wollastonite.
【００１０】[0010]
【作用】本発明の印刷回路用積層板は、無機フィラーの
一部又は全部としてアスペクト比の大きいものを適当量
使用することによって、ガラス不織布のみを基材に使用
した印刷回路板のもつ加工工程中での寸法変化率が大き
いという欠点を低減することが可能となる。より具体的
には、繊維方向の熱膨張率を大幅に減少させることによ
って加工工程中の寸法変化率を小さくすることができ
る。また、厚さ方向の熱膨張率を小さくすることにより
スルーホールめっきの導通変化率の信頼性が向上する。In the printed circuit laminate of the present invention, by using an appropriate amount of inorganic filler having a large aspect ratio as a part or all of the inorganic filler, a processing step of the printed circuit board using only the glass nonwoven fabric as a base material is performed. It is possible to reduce the disadvantage that the dimensional change rate is large. More specifically, the rate of dimensional change during the processing step can be reduced by greatly reducing the coefficient of thermal expansion in the fiber direction. Further, by reducing the coefficient of thermal expansion in the thickness direction, the reliability of the rate of change in conduction of through-hole plating is improved.
【００１１】[0011]
【実施例】以下に本発明の実施例および比較例（従来
例）を示す。「部」は「重量部」を表す。EXAMPLES Examples of the present invention and comparative examples (conventional examples) are shown below. "Part" means "part by weight".
【００１２】《実施例１》エポキシ樹脂ワニスの組成は
次の通りである。 （１）臭素化エポキシ樹脂（油化シェル製 Ep-1046） ８０部 （２）ノボラック型エポキシ樹脂（油化シェル製 Ep-152) ２０部 （３）ジシアンジアミド ４部 （４）２エチル４メチルイミダゾール ０.１５部 （５）メチルセロソルブ ３６部 （６）アセトン ６０部 前記材料を混合して均一なエポキシ樹脂ワニスを調製し
た。Example 1 The composition of the epoxy resin varnish is as follows. (1) Brominated epoxy resin (Ep-1046 made by Yuka Shell) 80 parts (2) Novolac type epoxy resin (Ep-152 made by Yuka Shell) 20 parts (3) Dicyandiamide 4 parts (4) 2 Ethyl 4-methylimidazole 0.15 parts (5) Methyl cellosolve 36 parts (6) Acetone 60 parts The above materials were mixed to prepare a uniform epoxy resin varnish.
【００１４】上記のエポキシ樹脂ワニスに樹脂分１００
部対し次の配合の無機フィラーを添加し、撹拌混合して
無機フィラー含有ワニスを調製した。 （１）ギブサイト型水酸化アルミニウム ７０部 （昭和電工製 ハイジライト H-141） （２）マイカ（アスペクト比：５０、粒径１０μｍ） ２０部A resin component of 100 is added to the above epoxy resin varnish.
An inorganic filler having the following composition was added to a part and mixed with stirring to prepare a varnish containing an inorganic filler. (1) Gibbsite type aluminum hydroxide 70 parts (Showa Denko's Heidilite H-141) (2) Mica (aspect ratio: 50, particle size 10 μm) 20 parts
【００１５】この無機フィラー含有ワニスをガラス不織
布（日本バイリーン製 EP-4075）にエポキシ樹脂及び無
機フィラーの含有量が９０％になるように含浸乾燥し
て、ガラス不織布プリプレグ（Ａ）を得た。次に、前記
ガラス不織布プリプレグ（Ａ）を３枚重ねて、その両面
に厚さ１８μｍの銅箔を配置し、成形温度１６５℃、圧
力６０kg／cm2 で９０分間積層成形して厚さ １.２mmの
銅張積層板を得た。This inorganic filler-containing varnish was impregnated into a glass nonwoven fabric (EP-4075 manufactured by Japan Vilene) so that the epoxy resin content and the inorganic filler content were 90%, and dried to obtain a glass nonwoven fabric prepreg (A). Next, three sheets of the above glass nonwoven fabric prepreg (A) are stacked, copper foil having a thickness of 18 μm is arranged on both sides thereof, and laminated for molding for 90 minutes at a molding temperature of 165 ° C. and a pressure of 60 kg / cm 2 to obtain a thickness of 1. A 2 mm copper clad laminate was obtained.
【００１６】《実施例２》無機フィラー含有エポキシ樹
脂ワニスは前記エポキシ樹脂ワニスに樹脂分１００部に
対し次の配合の無機フィラーを添加し、撹拌混合して調
製した。 （１）ギブサイト型水酸化アルミニウム ６０部 （昭和電工製 ハイジライト H-141） （２）ウオラストナイト（アスペクト比：１５、粒径８μｍ）４０部Example 2 An inorganic resin-containing epoxy resin varnish was prepared by adding the following inorganic filler to 100 parts of the resin content of the epoxy resin varnish and mixing with stirring. (1) Gibbsite type aluminum hydroxide 60 parts (Showa Denko's Heidilite H-141) (2) Wollastonite (aspect ratio: 15, particle size 8 μm) 40 parts
【００１７】この無機フィラー含有エポキシ樹脂ワニス
をガラス不織布（日本バイリーン製EP-4075）にエポキ
シ樹脂及び無機フィラーの含有量が ８０％になるよう
に含浸乾燥して、ガラス不織布プリプレグ（Ｂ）を得
た。次に、前記ガラス不織布プリプレグ（Ｂ)を３枚重
ねて、その両面に厚さ１８μｍの銅箔を配置し、成形温
度１６５℃、圧力６０kg／cm2 で９０分間積層成形して
厚さ １.２mmの銅張積層板を得た。A glass nonwoven fabric (EP-4075 manufactured by Nippon Vilene) was impregnated with this epoxy resin varnish containing an inorganic filler so that the content of the epoxy resin and the inorganic filler was 80%, and dried to obtain a glass nonwoven fabric prepreg (B). It was Next, three sheets of the above glass nonwoven fabric prepreg (B) are stacked, copper foil having a thickness of 18 μm is arranged on both sides thereof, and laminated and molded for 90 minutes at a molding temperature of 165 ° C. and a pressure of 60 kg / cm 2 to obtain a thickness of 1. A 2 mm copper clad laminate was obtained.
【００１８】《比較例１》無機フィラー含有エポキシ樹
脂ワニスは前記エポキシ樹脂ワニスに樹脂分１００部に
対し次の配合の無機フィラーを添加し、撹拌混合して調
製した。 （１）ギブサイト型水酸化アルミニウム １００部 （昭和電工製 ハイジライト H-141） この無機フィラー含有エポキシ樹脂ワニスをガラス不織
布（日本バイリーン製EP-4075）にエポキシ樹脂及び無
機フィラーの含有量が ８０％になるように含浸乾燥し
て、ガラス不織布プリプレグ（Ｃ）を得た。次に、前記
ガラス不織布プリプレグ（Ｃ)を３枚重ねて、その両面
に厚さ１８μｍの銅箔を配置し、成形温度１６５℃、圧
力６０kg／cm2 で９０分間積層成形して厚さ １.２mmの
銅張積層板を得た。 《比較例２》表面層プリプレグは実施例１と同様のワニ
スをガラス織布（日東紡製 WE-18K-RB84）に樹脂含有量
が４５％になるよう含浸乾燥し、ガラス織布プリプレグ
（Ｅ）を得た。続いて、中間層用無機フィラー含有エポ
キシ樹脂ワニスは前記エポキシ樹脂ワニスに樹脂分１０
０部に対し次の配合の無機フィラーを添加し、撹拌混合
して調製した。 （１）ギブサイト型水酸化アルミニウム ８０部 （昭和電工製 ハイジライト H-141） Comparative Example 1 An epoxy resin varnish containing an inorganic filler was prepared by adding the following inorganic filler to 100 parts by weight of a resin component in the epoxy resin varnish and stirring and mixing. (1) Gibbsite type aluminum hydroxide 100 parts (Showa Denko's Hydilite H-141) This inorganic filler-containing epoxy resin varnish was added to a glass nonwoven fabric (Japan Vilene EP-4075) containing 80% of epoxy resin and inorganic filler. Was impregnated and dried to obtain a glass nonwoven fabric prepreg (C). Next, three sheets of the above glass nonwoven fabric prepreg (C) are stacked, copper foil having a thickness of 18 μm is arranged on both sides thereof, and laminated and molded at a molding temperature of 165 ° C. and a pressure of 60 kg / cm 2 for 90 minutes to obtain a thickness of 1. A 2 mm copper clad laminate was obtained. << Comparative Example 2 >> As the surface layer prepreg, the same varnish as in Example 1 was impregnated into a glass woven cloth (WE-18K-RB84 manufactured by Nitto Boseki) so that the resin content was 45%, and dried to obtain a glass woven prepreg (E ) Got. Subsequently, the epoxy resin varnish containing the inorganic filler for the intermediate layer was mixed with the epoxy resin varnish with a resin content of 10%.
An inorganic filler having the following composition was added to 0 part and mixed by stirring to prepare. (1) Gibbsite type aluminum hydroxide 80 parts (Showa Denko's Heidilite H-141)
【００１９】この無機フィラー含有エポキシ樹脂ワニス
をガラス不織布（日本バイリーン製EP-4075）にエポキ
シ樹脂及び無機フィラーの含有量が ８０％になるよう
に含浸乾燥して、ガラス不織布プリプレグ（Ｄ）を得
た。次に、前記ガラス不織布プリプレグ（Ｄ）を２枚重
ねて中間層とし、上下表面層に前記ガラス織布プリプレ
グ（Ｅ）を各１枚配置し、更にその両面に厚さ１８μｍ
の銅箔を配置し、成形温度１６５℃、圧力６０kg／cm2
で９０分間積層成形して厚さ １.２mmの銅張積層板を得
た。A glass nonwoven fabric (EP-4075 manufactured by Nippon Vilene) was impregnated with this epoxy resin varnish containing an inorganic filler so that the content of the epoxy resin and the inorganic filler was 80%, and dried to obtain a glass nonwoven fabric prepreg (D). It was Next, two glass non-woven fabric prepregs (D) are laminated to form an intermediate layer, and one glass woven fabric prepreg (E) is placed on each of the upper and lower surface layers, and the thickness is 18 μm on both sides.
Place the copper foil, molding temperature 165 ℃, pressure 60kg / cm 2
Was laminated for 90 minutes to obtain a copper clad laminate having a thickness of 1.2 mm.
【００２０】得られたそれぞれの銅張積層板について、
寸法変化率、ドリル摩耗性、打抜き加工性を測定した。
その結果を表１に示す。For each of the resulting copper clad laminates,
The dimensional change rate, drill wear resistance, and punching workability were measured.
The results are shown in Table 1.
【表１】 [Table 1]
【００２１】（測定方法） １．寸法変化率：３００×３００ｍｍに切断した積層板
のコーナー部に２５０ｍｍ間隔で穴を設け、その穴間距
離率の変化を測定した。 ２．ドリル摩耗性：ドリル回転数 ６０,０００ｒｐｍ、
送り速度１ｍ／分、積層板は３枚重ねで行った。 ３．打抜き性：ＡＳＴＭ法で実施、打抜き穴の壁面の粗
さ、穴端面の欠け、クラック、目白の状態を総合して判
定した。 ４．熱膨張率：ＴＭＡ法による。(Measurement method) 1. Dimensional change rate: Holes were formed at 250 mm intervals at the corners of the laminated plate cut into 300 × 300 mm, and the change in the distance ratio between holes was measured. 2. Drill wear: Drill rotation speed 60,000 rpm,
The feed rate was 1 m / min, and three laminated plates were stacked. 3. Punchability: Performed by the ASTM method, and comprehensively determined the roughness of the wall surface of the punched hole, the chipping of the hole end surface, the crack, and the white spot. 4. Thermal expansion coefficient: According to TMA method.
【００２２】[0022]
【発明の効果】前記実施例及び比較例の結果からも明ら
かなように、本発明の印刷回路用積層板は、印刷回路板
への加工時において、寸法変化率及びドリル摩耗性が改
善され、且つ打抜き加工性が改善される。As is clear from the results of the above-mentioned Examples and Comparative Examples, the printed circuit laminate of the present invention has improved dimensional change and drill wear during processing into printed circuit boards. Moreover, the punching workability is improved.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｃ０８Ｊ 5/24 ＣＦＣ 7310−4Ｆ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location // C08J 5/24 CFC 7310-4F
Claims (1)
ラーを含浸したガラス不織布のみから構成され、これを
加熱加圧成形してなる印刷回路用積層板であって、樹脂
１００重量部に対し、無機フィラーが１０〜２００重量
部含有されており、無機フィラーの一部または全部に平
面方向と厚さ方向の長さの比が、 ５.０〜２００である
ことを特徴とする印刷回路用積層板。1. A resin-impregnated base material is a laminate for a printed circuit, which is composed only of a glass nonwoven fabric impregnated with an epoxy resin and an inorganic filler, and is formed by heating and pressurizing the nonwoven fabric. An inorganic filler is contained in an amount of 10 to 200 parts by weight, and the ratio of the length in the plane direction to the thickness direction is 5.0 to 200 in a part or all of the inorganic filler. Board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32238893A JPH07176843A (en) | 1993-12-21 | 1993-12-21 | Laminated board for printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32238893A JPH07176843A (en) | 1993-12-21 | 1993-12-21 | Laminated board for printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07176843A true JPH07176843A (en) | 1995-07-14 |
Family
ID=18143110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32238893A Pending JPH07176843A (en) | 1993-12-21 | 1993-12-21 | Laminated board for printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07176843A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0792737A3 (en) * | 1996-02-29 | 1998-07-22 | Sumitomo Bakelite Company Limited | Laminated board and process for production thereof |
| WO2001063986A1 (en) * | 2000-02-22 | 2001-08-30 | Ppg Industries Ohio, Inc. | Electronic supports and methods and apparatus for forming apertures in electronic supports |
| US7354641B2 (en) | 2004-10-12 | 2008-04-08 | Ppg Industries Ohio, Inc. | Resin compatible yarn binder and uses thereof |
| CN102088819B (en) | 2009-12-07 | 2012-09-05 | 耿世达 | Novel electronic circuit substrate and manufacturing process thereof |
| WO2012164997A1 (en) * | 2011-05-30 | 2012-12-06 | パナソニック株式会社 | Laminate sheet, application therefor, and method for producing same |
-
1993
- 1993-12-21 JP JP32238893A patent/JPH07176843A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0792737A3 (en) * | 1996-02-29 | 1998-07-22 | Sumitomo Bakelite Company Limited | Laminated board and process for production thereof |
| WO2001063986A1 (en) * | 2000-02-22 | 2001-08-30 | Ppg Industries Ohio, Inc. | Electronic supports and methods and apparatus for forming apertures in electronic supports |
| US7354641B2 (en) | 2004-10-12 | 2008-04-08 | Ppg Industries Ohio, Inc. | Resin compatible yarn binder and uses thereof |
| CN102088819B (en) | 2009-12-07 | 2012-09-05 | 耿世达 | Novel electronic circuit substrate and manufacturing process thereof |
| WO2012164997A1 (en) * | 2011-05-30 | 2012-12-06 | パナソニック株式会社 | Laminate sheet, application therefor, and method for producing same |
| CN103582564A (en) * | 2011-05-30 | 2014-02-12 | 松下电器产业株式会社 | Laminate sheet, application therefor, and method for producing same |
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