JPH09254331A - Laminated sheet - Google Patents
Laminated sheetInfo
- Publication number
- JPH09254331A JPH09254331A JP6827696A JP6827696A JPH09254331A JP H09254331 A JPH09254331 A JP H09254331A JP 6827696 A JP6827696 A JP 6827696A JP 6827696 A JP6827696 A JP 6827696A JP H09254331 A JPH09254331 A JP H09254331A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- inorganic filler
- thermosetting resin
- fiber base
- laminated sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000011256 inorganic filler Substances 0.000 claims abstract description 19
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims abstract description 14
- 239000000835 fiber Substances 0.000 claims abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 12
- 239000002344 surface layer Substances 0.000 claims abstract description 9
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 7
- 239000003365 glass fiber Substances 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 239000004744 fabric Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 10
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 239000000377 silicon dioxide Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 2
- 239000000454 talc Substances 0.000 abstract description 2
- 229910052623 talc Inorganic materials 0.000 abstract description 2
- 229920006122 polyamide resin Polymers 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 11
- 239000002966 varnish Substances 0.000 description 9
- 238000004080 punching Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000004745 nonwoven fabric Substances 0.000 description 6
- 239000002759 woven fabric Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001679 gibbsite Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、特に電気機器、電子機
器、通信機器等に使用される印刷回路用として好適な積
層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminate suitable for a printed circuit used in electric equipment, electronic equipment, communication equipment and the like.
【０００２】[0002]
【従来の技術】民生用電子機器の小型化、高機能化が進
み、それに用いられる印刷回路基板として、ガラス不織
布を中間層基材とし、ガラス織布を表面層基材とした構
成で、エポキシ樹脂を含浸させ加熱加圧成形した積層板
（以下、コンポジット積層板という）が使用されてい
る。最近かかるコンポジット積層板に対し、従来この分
野で使用されている紙基材フェノール積層板と同等の打
抜き加工性、低コスト化が要求されるようになってき
た。2. Description of the Related Art Consumer electronic devices have become smaller and more sophisticated, and as a printed circuit board used for them, glass nonwoven fabric is used as an intermediate layer base material and glass woven fabric is used as a surface layer base material. A laminate (hereinafter referred to as a composite laminate) impregnated with a resin and heat-pressed is used. Recently, such composite laminates have been required to have the same punching workability and lower cost as those of the paper-based phenolic laminates conventionally used in this field.
【０００３】また産業用電子機器分野においても、低コ
スト化の必要性からガラス織布を使用しないか又はその
使用量を減らしたコンポジット積層板が使用されるよう
になってきたが、性能上ガラス織布基材積層板より種々
の点で劣り、これと同等の寸法変化、反りが小さいこと
が要求されるようになってきた。In the field of industrial electronic equipment, composite laminates which do not use glass woven fabric or reduce the amount of glass woven fabric have been used due to the need for cost reduction. It is inferior in various points to a woven fabric laminate, and it has been required to have the same dimensional change and small warpage.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記のよう
な問題点を解決するため種々検討の結果なされたもの
で、その目的とするところは、電気的特性及び他の諸特
性を低下させることなく、打抜き加工性、寸法変化、反
りのレベルを向上させ、かつ低コストである印刷回路用
積層板を提供することにある。The present invention has been made as a result of various studies in order to solve the above-mentioned problems, and its purpose is to reduce electrical characteristics and other characteristics. It is an object of the present invention to provide a laminated board for a printed circuit, which has improved punching workability, dimensional change, and warp level, and is low in cost.
【０００６】[0006]
【課題を解決するための手段】本発明は、表面層は熱硬
化性樹脂含浸する繊維基材からなり、中間層は熱硬化性
樹脂に無機充填材を前記樹脂に対して１０〜３００重量
％混合してなる組成物からなることを特徴とする積層板
に関するものである。According to the present invention, the surface layer comprises a fibrous base material impregnated with a thermosetting resin, and the intermediate layer comprises a thermosetting resin and an inorganic filler in an amount of 10 to 300% by weight based on the resin. The present invention relates to a laminated board characterized by comprising a composition obtained by mixing.
【０００７】本発明の積層板の中間層には、繊維基材を
使用せず無機充填材を加えて、打抜き加工性や寸法安定
性を維持、向上させるとともに、Ｚ方向の熱膨張を小さ
くするのでスルホール信頼性を向上させることも可能で
ある。かかる無機充填材としては、水酸化アルミニウ
ム、炭酸カルシウム、クレー、タルク、シリカ等であ
り、特に耐燃性を要求される場合には水酸化アルミニウ
ムが好ましい。樹脂に対する混合割合は１０〜３００重
量％が好ましい。１０重量％未満では、スルーホール信
頼性の向上効果が小さく、３００重量％を越えると無機
充填材の混合及び成形が困難となる。特に好ましい範囲
は５０〜２００重量％である。An inorganic filler is added to the intermediate layer of the laminate of the present invention without using a fiber base material to maintain and improve punching workability and dimensional stability, and to reduce thermal expansion in the Z direction. Therefore, it is possible to improve the reliability of the through hole. Such inorganic fillers include aluminum hydroxide, calcium carbonate, clay, talc, silica and the like, and aluminum hydroxide is preferable especially when flame resistance is required. The mixing ratio with respect to the resin is preferably 10 to 300% by weight. If it is less than 10% by weight, the effect of improving the reliability of the through hole is small, and if it exceeds 300% by weight, it becomes difficult to mix and mold the inorganic filler. A particularly preferred range is 50 to 200% by weight.
【０００８】本発明に用いられる熱硬化性樹脂は、積層
板特性上エポキシ樹脂が好ましいが、このほか、ポリイ
ミド樹脂、ポリエステル樹脂、フェノール樹脂などを用
いることができる。また、表面層に用いる繊維基材は、
ガラス繊維織布、ガラス繊維不織布、合成繊維織布又は
不織布、クラフト紙、リンター紙など特に限定されない
が、耐熱性及び強度の点からはガラス繊維織布が好まし
い。The thermosetting resin used in the present invention is preferably an epoxy resin in view of the characteristics of the laminated board, but in addition to this, a polyimide resin, a polyester resin, a phenol resin or the like can be used. Further, the fiber base material used for the surface layer is
Glass fiber woven cloth, glass fiber nonwoven cloth, synthetic fiber woven cloth or nonwoven cloth, kraft paper, linter paper and the like are not particularly limited, but glass fiber woven cloth is preferable from the viewpoint of heat resistance and strength.
【０００９】本発明の積層板は、中間層において従来の
コンポジット積層板に使用されていたガラス不織布等を
全く使用せず、繊維基材に起因する打抜き加工性の低下
を防止し、更に中間層には繊維基材の配向性が無いこと
より、反りや寸法安定性も優れている。また、中間層に
無機充填材を多量に混合することにより上記特性を更に
改良することができるとともに、スルーホールめっきの
信頼性を向上させることができる。The laminated sheet of the present invention does not use the glass nonwoven fabric or the like used in the conventional composite laminated sheet in the intermediate layer at all, prevents the deterioration of the punching workability due to the fiber base material, and further prevents the intermediate layer. Since the fiber substrate has no orientation, it has excellent warpage and dimensional stability. Further, by mixing a large amount of an inorganic filler in the intermediate layer, the above characteristics can be further improved, and the reliability of through-hole plating can be improved.
【００１０】更に、繊維基材は原価価格及び製造工程上
コスト高になるが、本発明の積層板は中間層に繊維基材
を使用せず、単に無機充填材を熱硬化性樹脂と混合する
のみであるので、大幅なコストダウンを達成することが
できる。Further, although the fiber base material is expensive in terms of cost and manufacturing process, the laminated plate of the present invention does not use the fiber base material for the intermediate layer, but simply mixes the inorganic filler with the thermosetting resin. Since it is only, a significant cost reduction can be achieved.
【００１１】[0011]
【実施例】以下に本発明の実施例及び比較例（従来例）
を示す。「部」及び「％」はそれぞれ「重量部」及び
「重量％」を示す。Examples of the present invention and comparative examples (conventional examples) are described below.
Is shown. "Parts" and "%" indicate "parts by weight" and "% by weight", respectively.
【００１２】《実施例１》エポキシ樹脂ワニス（ａ）の
組成は次の通りである。 （１）臭素化エポキシ樹脂（油化シェル製 Ｅｐ−１０４６） １００部 （２）ジシアンジアミド ４ （３）２−エチル−４−メチルイミダゾール ０.１５ （４）メチルセロソルブ ３０ （５）アセトン ６０ 上記材料を混合して均一なワニスを調製した。このワニ
スをガラス織布（日東紡績製 ＷＥ−１８Ｋ ＲＢ−８
４）に樹脂含有量が３０〜４０％になるように含浸し乾
燥してガラス織布プリプレグ〔Ａ〕を得た。続いて前記
エポキシ樹脂配合ワニスの樹脂固形分１００部に対し
て、次の配合の無機充填材を添加し、攪拌混合し無機充
填材含有ワニス〔１〕を作製した。 （１）ギブサイト型水酸化アルミニウム （昭和電工製，ハイジライトＨ−４２） １１２部 （２）超微粉末シリカ（シオノギ製薬製 カープレックス） ８Example 1 The composition of the epoxy resin varnish (a) is as follows. (1) Brominated epoxy resin (Ep-1046 manufactured by Yuka Shell Co., Ltd.) 100 parts (2) Dicyandiamide 4 (3) 2-Ethyl-4-methylimidazole 0.15 (4) Methylcellosolve 30 (5) Acetone 60 The above materials Were mixed to prepare a uniform varnish. This varnish was woven into glass (Nitto Boseki WE-18K RB-8
4) was impregnated with a resin content of 30 to 40% and dried to obtain a woven glass prepreg [A]. Then, to 100 parts of the resin solid content of the epoxy resin-blended varnish, the following inorganic filler was added and mixed by stirring to prepare an inorganic filler-containing varnish [1]. (1) Gibbsite type aluminum hydroxide (Showa Denko, Heidilite H-42) 112 parts (2) Super fine powder silica (Shionogi Pharmaceutical Carplex) 8
【００１３】このワニス〔１〕を上記ガラス織布プリプ
レグ〔Ａ〕の片面に乾燥後の膜厚が０．６ｍｍになるよ
うにナイフコーターで塗工乾燥してプリプレグ〔Ｂ〕を
得た。次にこのプリプレグ〔Ｂ〕２枚を塗工面を内側に
して重ね合わせ、さらにその両面に１８μｍ厚の銅箔を
重ね、成形温度１６５℃、圧力３０ｋｇ／ｃｍ2 で９０
分間積層成形して、厚さ１.６ｍｍの銅張積層板を得
た。This varnish [1] was applied to one surface of the glass woven fabric prepreg [A] by a knife coater so that the film thickness after drying was 0.6 mm, and dried to obtain a prepreg [B]. Next, two sheets of this prepreg [B] are laminated with the coated surface inside, and a copper foil having a thickness of 18 μm is further laminated on both surfaces, and the molding temperature is 165 ° C. and the pressure is 30 kg / cm 2 for 90 minutes.
The laminate was molded for one minute to obtain a copper clad laminate having a thickness of 1.6 mm.
【００１４】《比較例１》前記エポキシ樹脂ワニス
（ａ）の樹脂固形分１００部に対して、次の配合の無機
充填材を添加し、攪拌混合し無機充填材含有ワニス
〔２〕を作製した。 （１）ギブサイト型水酸化アルミニウム （昭和電工製，ハイジライトＨ−４２） ９３部 （２）超微粉末シリカ（シオノギ製薬製 カープレックス） ８ このようにして得られた無機充填材含有ワニス〔２〕を
ガラス不織布（日本バイリーン製 ＥＰ４０７５）に、
樹脂及び無機充填材の合計の含有量が中間層全体に対し
て９０％になるように含浸乾燥して、ガラス不織布プリ
プレグ〔Ｃ〕を得た。次にこのガラス不織布プリプレグ
〔Ｃ〕を中間層とし、上下表面層に実施例１で得たガラ
ス織布プリプレグ〔Ａ〕を配置し、さらにその両面に１
８μｍ厚の銅箔を重ね、成形温度１６５℃、圧力６０ｋ
ｇ／ｃｍ2 で９０分間積層成形して、厚さ１．６ｍｍの
銅張積層板を得た。Comparative Example 1 An inorganic filler having the following composition was added to 100 parts of the resin solid content of the epoxy resin varnish (a) and mixed by stirring to prepare an inorganic filler-containing varnish [2]. . (1) Gibbsite type aluminum hydroxide (Showa Denko, Hydilite H-42) 93 parts (2) Ultrafine powder silica (Shionogi Pharmaceutical Carplex) 8 Inorganic filler-containing varnish thus obtained [2 ] To a glass non-woven fabric (Japan Vilene EP4075),
The non-woven fabric prepreg [C] was obtained by impregnation and drying so that the total content of the resin and the inorganic filler was 90% with respect to the entire intermediate layer. Next, this glass nonwoven fabric prepreg [C] was used as an intermediate layer, and the glass woven fabric prepreg [A] obtained in Example 1 was placed on the upper and lower surface layers, and 1 was placed on both sides thereof.
Layered with 8μm thick copper foil, molding temperature 165 ℃, pressure 60k
Lamination molding was performed for 90 minutes at g / cm 2 to obtain a copper-clad laminate having a thickness of 1.6 mm.
【００１５】以上の実施例及び比較例において得られた
銅張積層板について、打抜き加工性、寸法変化率、曲げ
強さ等を測定した。その結果を表１に示す。With respect to the copper clad laminates obtained in the above Examples and Comparative Examples, punching workability, dimensional change rate, bending strength, etc. were measured. Table 1 shows the results.
【００１６】[0016]
【表１】 [Table 1]
【００１７】（測定方法） １．打ち抜き加工性：ＡＳＴＭ法による、○：良好、
△：やや不良。 ２．反り：一片が３００ｍｍの銅張積層板のテストピー
スを１７０℃、３０分間加熱した後の反りの最大量を測
定した。 ３．寸法変化率：穴間隔が２５０ｍｍの銅張積層板のテ
ストピースを１７０℃、３０分間加熱した後の穴間隔の
寸法変化率を測定した。 ４．曲げ強さ：ＪＩＳ Ｃ ６４８１による ５ Ｚ方向熱膨張率：銅張積層板を全面エッチングし、
常温から２００℃まで１０℃／分で昇温し、Ｚ方向の熱
膨張率を求めた。(Measurement method) Punching processability: According to ASTM method, ◯: Good,
Δ: Somewhat poor. 2. Warpage: The maximum amount of warpage was measured after heating a test piece of a copper clad laminate having a piece of 300 mm for 30 minutes at 170 ° C. 3. Dimensional change rate: The dimensional change rate of the hole spacing was measured after heating a test piece of a copper clad laminate having a hole spacing of 250 mm at 170 ° C. for 30 minutes. 4. Flexural strength: 5Z direction thermal expansion coefficient according to JIS C 6481: Copper-clad laminate is entirely etched,
The temperature was raised from room temperature to 200 ° C. at a rate of 10 ° C./min, and the coefficient of thermal expansion in the Z direction was determined.
【００１８】なお、製造コストについては、実施例１で
得られた積層板は、製造工程からコストの高いガラス繊
維不織布を使用せず、無機充填材を熱硬化性樹脂と混合
して中間層としているので、比較例１で得られたものに
比べそれぞれ１０〜３０％程度低コスト化することがで
きる。Regarding the manufacturing cost, the laminated plate obtained in Example 1 does not use the expensive glass fiber nonwoven fabric from the manufacturing process, but mixes an inorganic filler with a thermosetting resin to form an intermediate layer. Therefore, the cost can be reduced by about 10 to 30% as compared with that obtained in Comparative Example 1.
【００１９】[0019]
【発明の効果】本発明の積層板は、曲げ強度等の低下が
なく、打抜き加工性、反り、寸法安定性に優れており、
低コスト化も達成できる。EFFECT OF THE INVENTION The laminated sheet of the present invention has no deterioration in bending strength and the like, and is excellent in punching workability, warpage and dimensional stability.
Cost reduction can also be achieved.
Claims (3)
なり、中間層は熱硬化性樹脂に無機充填材が前記樹脂に
対して１０〜３００重量％配合された組成物からなるこ
とを特徴とする積層板。1. The surface layer is made of a thermosetting resin-impregnated fiber base material, and the intermediate layer is made of a composition in which an inorganic filler is mixed with the thermosetting resin in an amount of 10 to 300% by weight based on the resin. Characteristic laminated board.
求項１記載の積層板。2. The laminate according to claim 1, wherein the fiber base material is a glass fiber woven cloth.
主成分とするものである請求項１又は２記載の積層板。3. The laminated plate according to claim 1, wherein the inorganic filler contains aluminum hydroxide as a main component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6827696A JPH09254331A (en) | 1996-03-25 | 1996-03-25 | Laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6827696A JPH09254331A (en) | 1996-03-25 | 1996-03-25 | Laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09254331A true JPH09254331A (en) | 1997-09-30 |
Family
ID=13369082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6827696A Pending JPH09254331A (en) | 1996-03-25 | 1996-03-25 | Laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09254331A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6117516A (en) * | 1997-04-24 | 2000-09-12 | Sumitomo Bakelite Company Limited | Laminate and process for producing the same |
| JP2001260157A (en) * | 2000-03-22 | 2001-09-25 | Sumitomo Bakelite Co Ltd | Manufacturing method of laminated board |
| JP2012228879A (en) * | 2011-04-14 | 2012-11-22 | Sumitomo Bakelite Co Ltd | Laminate sheet, circuit board, semiconductor package, and method of manufacturing laminate sheet |
| JP2013006328A (en) * | 2011-06-23 | 2013-01-10 | Sumitomo Bakelite Co Ltd | Laminate, circuit board, and semiconductor package |
-
1996
- 1996-03-25 JP JP6827696A patent/JPH09254331A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6117516A (en) * | 1997-04-24 | 2000-09-12 | Sumitomo Bakelite Company Limited | Laminate and process for producing the same |
| JP2001260157A (en) * | 2000-03-22 | 2001-09-25 | Sumitomo Bakelite Co Ltd | Manufacturing method of laminated board |
| JP2012228879A (en) * | 2011-04-14 | 2012-11-22 | Sumitomo Bakelite Co Ltd | Laminate sheet, circuit board, semiconductor package, and method of manufacturing laminate sheet |
| JP2013006328A (en) * | 2011-06-23 | 2013-01-10 | Sumitomo Bakelite Co Ltd | Laminate, circuit board, and semiconductor package |
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