JPH06302926A - Multilayered boad for printed circuit - Google Patents
Multilayered boad for printed circuitInfo
- Publication number
- JPH06302926A JPH06302926A JP5085995A JP8599593A JPH06302926A JP H06302926 A JPH06302926 A JP H06302926A JP 5085995 A JP5085995 A JP 5085995A JP 8599593 A JP8599593 A JP 8599593A JP H06302926 A JPH06302926 A JP H06302926A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- inorganic filler
- surface layer
- resin
- woven fabric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 34
- 239000011256 inorganic filler Substances 0.000 claims abstract description 34
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 34
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 34
- 239000011521 glass Substances 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000002344 surface layer Substances 0.000 claims abstract description 20
- 239000002759 woven fabric Substances 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 7
- 239000004745 nonwoven fabric Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 10
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 abstract description 9
- 239000011889 copper foil Substances 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 230000003746 surface roughness Effects 0.000 abstract description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 abstract 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 abstract 3
- 229910052794 bromium Inorganic materials 0.000 abstract 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000012466 permeate Substances 0.000 abstract 1
- 239000002966 varnish Substances 0.000 description 12
- 239000011888 foil Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229910001679 gibbsite Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、特に電気機器、電子機
器、通信機等に使用される印刷回路用積層板に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit laminate used in electric equipment, electronic equipment, communication equipment and the like.
【０００２】[0002]
【従来の技術】民生用電子機器、産業用電子機器の小型
化、高機能化が進む中で、コンピューター、計測器等の
高電圧が印加される回路基板においては、トランスやト
ランジスター等の重量物が搭載されるため強度面から熱
硬化性樹脂ガラス織布積層板が使用されている。更に、
これに加えて高密度化のために、安全性を確保する立場
から耐トラッキング性に優れた基板が要求されるように
なってきた。従来、民生機器に用いられるフェノール樹
脂積層板においては、この耐トラッキング性のため、金
属箔を接着するのに用いる接着剤に炭化しにくいメラミ
ン樹脂、脂環族エポキシ樹脂あるいはポリエステル樹脂
が用いられていた。一方、コンポジット積層板等のエポ
キシ積層板は小型化高密度化に伴い金属箔が薄くなる傾
向であるため、金属箔に接着剤を塗工しがたい、あるい
は接着剤を塗工後金属箔がカールしてしまう等により接
着剤付金属箔が使用できない状況である。一方、産業用
機器用においては、耐トラッキング性向上のため脂環式
エポキシ樹脂や、不飽和ポリエステル樹脂系等の芳香族
環の少ないタイプの樹脂が用いられてきたが、コストが
高い、耐熱性不足、金属箔との引き剥がし強さが弱い等
の問題があった。2. Description of the Related Art As consumer electronic devices and industrial electronic devices are becoming smaller and more sophisticated, heavy loads such as transformers and transistors are required for circuit boards to which high voltage is applied, such as computers and measuring instruments. The thermosetting resin glass woven fabric laminated plate is used from the viewpoint of strength. Furthermore,
In addition to this, in order to increase the density, a substrate having excellent tracking resistance has been required from the viewpoint of ensuring safety. Conventionally, in a phenolic resin laminate used for consumer equipment, a melamine resin, an alicyclic epoxy resin or a polyester resin which is hard to be carbonized is used as an adhesive used for adhering a metal foil because of its tracking resistance. It was On the other hand, in epoxy laminates such as composite laminates, the metal foil tends to become thinner with the miniaturization and higher density, so it is difficult to apply the adhesive to the metal foil, or the metal foil after applying the adhesive is The metal foil with adhesive cannot be used due to curling. On the other hand, for industrial equipment, alicyclic epoxy resins and unsaturated polyester resin-based resins with few aromatic rings have been used to improve tracking resistance, but the cost is high and the heat resistance is high. There were problems such as shortage and weak peeling strength from the metal foil.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記のような
問題点を解決するために種々検討の結果完成されたもの
で、臭素化エポキシ樹脂が極めて炭化しやすいことに鑑
み、表面層には無機充填剤含有非臭素化エポキシ樹脂ガ
ラス織布を配し、中間層には耐燃性付与のため無機充填
剤を含有した臭素化エポキシ樹脂で構成し、電気特性及
び他の諸特性を劣化させることなく優れた耐トラッキン
グ性を有する印刷回路用積層板を提供するものである。The present invention has been completed as a result of various studies in order to solve the above problems, and in view of the fact that the brominated epoxy resin is extremely carbonized, the surface layer is Non-brominated epoxy resin glass woven fabric containing inorganic filler is placed, and brominated epoxy resin containing inorganic filler is added to the intermediate layer to impart flame resistance, and electrical properties and other properties are deteriorated. And a laminated board for a printed circuit having excellent tracking resistance.
【０００４】[0004]
【課題を解決するための手段】本発明は、表面層の樹脂
を臭素を含まないエポキシ樹脂によって構成し、かつ、
無機充填剤が表面層の樹脂１００重量部に対して１０〜
２００重量部含有されているエポキシ樹脂ガラス織布か
らなり、更に、好ましくは中間層は臭素化エポキシ樹脂
を主成分とし、かつ樹脂１００重量部に対し無機充填剤
を１０〜２００重量部含有されていることを特徴とする
印刷回路用積層板である。本発明において、表面層に用
いられる無機充填剤は樹脂１００重量部に対して１０〜
２００重量部、好ましくは２０〜１５０重量部含まれ
る。無機充填剤を全く含有せず非臭素化エポキシ樹脂の
みで表面層を形成すると耐トラッキング性に対する効果
は低く、無機充填剤の含有量が１０重量部以下でも同様
である。２００重量部以上では無機充填剤混合時の樹脂
粘度が高くなり過ぎて、ガラス織布への含浸が困難とな
り、いずれも好ましくない。According to the present invention, a resin for a surface layer is composed of a bromine-free epoxy resin, and
The inorganic filler is 10 to 100 parts by weight of the resin of the surface layer.
200 parts by weight of epoxy resin glass woven fabric is contained, and preferably, the intermediate layer contains brominated epoxy resin as a main component, and 10 to 200 parts by weight of inorganic filler per 100 parts by weight of resin. It is a laminated board for a printed circuit characterized in that In the present invention, the inorganic filler used in the surface layer is 10 to 100 parts by weight of the resin.
200 parts by weight, preferably 20 to 150 parts by weight. When the surface layer is formed only from the non-brominated epoxy resin without containing any inorganic filler, the effect on the tracking resistance is low, and the same is true when the content of the inorganic filler is 10 parts by weight or less. If the amount is 200 parts by weight or more, the resin viscosity at the time of mixing the inorganic filler becomes too high, which makes it difficult to impregnate the glass woven cloth, which is not preferable.
【０００５】無機充填剤としては水酸化アルミニウム、
シリカ、タルク、ウォラストナイト、マイカ、クレー、
水酸化マグネシウム等があるが、難燃性、加工性、耐燃
性の点より好ましくは水酸化アルミニウムである。更に
水酸化アルミニウムを表面層に使用した場合、耐トラッ
キング性向上の効果が大きい。本発明において、表面層
を上記のように構成することにより耐トラッキング性が
向上するとともに、はんだ耐熱性及び銅箔引き剥がし強
さを維持しつつ、ガラス織布のフィラメント間に無機充
填剤が入ることにより表面粗さも向上させることができ
る。一方、中間層は、エポキシ樹脂として臭素化エポキ
シ樹脂を主成分として使用し、無機充填剤を樹脂１００
重量部に対して１０〜２００重量部使用することによ
り、難燃性、加工性を向上させることができる。無機充
填剤の量が１０重量部より少量であると、耐燃性、加工
性が不十分となり、２００重量部より多量であると、無
機充填剤混合時の樹脂粘度が高くなりガラス不織布への
含浸が困難となり好ましくない。Aluminum hydroxide as the inorganic filler,
Silica, talc, wollastonite, mica, clay,
Although there are magnesium hydroxide and the like, aluminum hydroxide is preferable from the viewpoint of flame retardancy, processability, and flame resistance. Further, when aluminum hydroxide is used for the surface layer, the effect of improving tracking resistance is great. In the present invention, while the tracking resistance is improved by configuring the surface layer as described above, while maintaining the solder heat resistance and the copper foil peeling strength, the inorganic filler enters between the filaments of the glass woven cloth. As a result, the surface roughness can also be improved. On the other hand, the intermediate layer uses a brominated epoxy resin as a main component as an epoxy resin and uses an inorganic filler as a resin 100.
By using 10 to 200 parts by weight with respect to parts by weight, flame retardancy and processability can be improved. If the amount of the inorganic filler is less than 10 parts by weight, the flame resistance and processability will be insufficient, and if it is more than 200 parts by weight, the resin viscosity will increase when the inorganic filler is mixed and the glass nonwoven fabric will be impregnated. Is difficult and not preferable.
【０００６】[0006]
【作用】表面層のエポキシ樹脂中に配合された無機充填
剤が耐トラッキング性を向上させる理由は、成形された
積層板表面に無機充填剤が存在し、それにより表面の樹
脂の割合が減少するためと考えられる。無機充填剤とし
ては水酸化アルミニウム（水和アルミナ）が好ましい
が、その理由は放電の熱により水酸化アルミニウムが分
解して水を発生し、水と放電により分解した有機物とが
反応して揮発性の物質を生じることによりトラックの成
形が防止されるためと考えられる。[Function] The reason why the inorganic filler compounded in the epoxy resin of the surface layer improves the tracking resistance is that the inorganic filler is present on the surface of the molded laminate, which reduces the proportion of the resin on the surface. It is thought to be because. Aluminum hydroxide (hydrated alumina) is preferred as the inorganic filler because the heat of discharge decomposes the aluminum hydroxide to generate water, and the water and the organic matter decomposed by the discharge react to make it volatile. It is considered that the formation of the track prevents the formation of the track.
【０００７】[0007]
【実施例】以下に本発明の実施例及び比較例（従来例）
を示す。「部」は「重量部」を、「％」は「重量％」を
示す。 ≪実施例１≫表面層のエポキシ樹脂配合ワニスの組成は
次の通りである。 （１）非臭素化エポキシ樹脂（油化シェル製 Ｅｐ−８５０） １００部 （２）ジシアンジアミド ２ （３）２−フェニル−４−メチルイミダゾール ０.１５ （４）メチルセロソルブ ２０ （５）アセトン ３０ 上記各材料を混合して均一なエポキシ樹脂ワニス（Ｉ）
を作製した。続いてこのエポキシ樹脂ワニス（１）に樹
脂分１００部に対し下記の無機充填剤を添加し、攪拌混
合し、無機充填剤含有ワニスを作製した。 （６）ギブサイト型水酸化アルミニウム ５０部 （昭和電工製 ハイジライトＨ−４２） この無機充填剤含有ワニスをガラス織布（日東紡製 WB-
18KRB-84）に樹脂含有量が３５％程度になるように含浸
乾燥してガラス織布プリプレグ(Ａ)を得た。EXAMPLES Examples of the present invention and comparative examples (conventional examples) are described below.
Indicates. "Part" means "part by weight" and "%" means "% by weight". << Example 1 >> The composition of the epoxy resin-containing varnish for the surface layer is as follows. (1) Non-brominated epoxy resin (Ep-850 manufactured by Yuka Shell Co., Ltd.) 100 parts (2) Dicyandiamide 2 (3) 2-phenyl-4-methylimidazole 0.15 (4) Methylcellosolve 20 (5) Acetone 30 Above Epoxy resin varnish (I) with uniform mixture of each material
Was produced. Subsequently, the following inorganic filler was added to 100 parts of the resin content of this epoxy resin varnish (1), and the mixture was stirred and mixed to prepare an inorganic filler-containing varnish. (6) Gibbsite type aluminum hydroxide 50 parts (Showa Denko's Heidilite H-42) This inorganic filler-containing varnish was woven into glass (Nittobo WB-
18KRB-84) was impregnated with a resin content of about 35% and dried to obtain a glass woven prepreg (A).
【０００８】次に中間層のエポキシ樹脂配合ワニスの組
成は次の通りである。 （１）臭素化エポキシ樹脂（油化シェル製 Ｅｐ−１０４６） １００部 （２）ジシアンジアミド ４ （３）２−エチル−４−メチルイミダゾール ０.１５ （４）メチルセロソルブ ３６ （５）アセトン ６０ 上記各材料を混合して均一なエポキシ樹脂ワニス（II）
を作製した。続いてこのエポキシ樹脂ワニス（II）に樹
脂分１００部に対し下記の無機充填剤を添加し、攪拌混
合し、無機充填剤含有ワニスを作製した。 （６）ギブサイト型水酸化アルミニウム ６０部 （昭和電工製 ハイジライトＨ−４２） この無機充填剤含有ワニスをガラス不織布（日本バイリ
ーン製 EP-4075）に樹脂及び無機充填剤の含有量が９０
％程度になるように含浸乾燥して、ガラス不織布プリプ
レグ（Ｂ）を得た。次に、前記ガラス不織布プリプレグ
（Ｂ）を３枚重ね中間層とし、上下表面層に前記ガラス
織布プリプレグ（Ａ）を各１枚配置し、更にその両面に
１８μｍ厚の銅箔を重ね、温度１７０℃、圧力６０ｋｇ
／ｃｍ2 で９０分間積層成形して、厚さ１.６ｍｍの銅
張積層板を得た。Next, the composition of the epoxy resin-containing varnish for the intermediate layer is as follows. (1) Brominated epoxy resin (Ep-1046 manufactured by Yuka Shell Co., Ltd.) 100 parts (2) Dicyandiamide 4 (3) 2-Ethyl-4-methylimidazole 0.15 (4) Methylcellosolve 36 (5) Acetone 60 Each of the above Epoxy resin varnish with mixed materials (II)
Was produced. Subsequently, the following inorganic filler was added to 100 parts of the resin content of this epoxy resin varnish (II), and the mixture was stirred and mixed to prepare an inorganic filler-containing varnish. (6) Gibbsite-type aluminum hydroxide 60 parts (Showa Denko's Heidilite H-42) This inorganic filler-containing varnish was added to a glass non-woven fabric (Japan Vilene EP-4075) containing 90 parts of resin and inorganic filler.
The glass non-woven fabric prepreg (B) was obtained by impregnating and drying so as to be about 10%. Next, three glass nonwoven fabric prepregs (B) were laminated to form an intermediate layer, and one glass woven fabric prepreg (A) was arranged on each of the upper and lower surface layers, and copper foil having a thickness of 18 μm was laminated on both surfaces thereof, 170 ℃, pressure 60kg
/ Cm 2 and laminated for 90 minutes to obtain a copper-clad laminate having a thickness of 1.6 mm.
【０００９】≪実施例２≫実施例１の無機充填剤含有エ
ポキシ樹脂ガラス織布プリプレグ（Ａ）において、ギブ
サイト型水酸化アルミニウムの配合量を５０部から１０
０部に代えた以外は実施例１と同様にして銅張積層板を
得た。 ≪比較例１≫実施例１の無機充填剤含有エポキシ樹脂ガ
ラス織布プリプレグ（Ａ）の代わりに、無機充填剤を含
有しない非臭素化エポキシ樹脂ワニス（Ｉ）をそのまま
前記ガラス織布に含浸乾燥して樹脂含有量４５％程度の
エポキシ樹脂ガラス織布プリプレグを得た。以下、実施
例１と同様にして銅張積層板を得た。 ≪比較例２≫実施例１の表面層に用いたエポキシ樹脂ガ
ラス織布プリプレグ（Ａ）の代わりに、無機充填剤を含
有しない臭素化エポキシ樹脂ワニス（II）をそのまま前
記ガラス織布に含浸乾燥して樹脂含有量４５％程度のエ
ポキシ樹脂ガラス織布プリプレグを得た。以下、実施例
１と同様にして銅張積層板を得た。Example 2 In the inorganic filler-containing epoxy resin glass woven prepreg (A) of Example 1, the amount of gibbsite type aluminum hydroxide blended was 50 to 10 parts.
A copper clad laminate was obtained in the same manner as in Example 1 except that 0 part was used. << Comparative Example 1 >> Instead of the inorganic filler-containing epoxy resin glass woven fabric prepreg (A) of Example 1, a non-brominated epoxy resin varnish (I) containing no inorganic filler was directly impregnated into the glass woven fabric and dried. Thus, an epoxy resin glass woven fabric prepreg having a resin content of about 45% was obtained. Then, a copper clad laminate was obtained in the same manner as in Example 1. << Comparative Example 2 >> Instead of the epoxy resin glass woven fabric prepreg (A) used for the surface layer of Example 1, a brominated epoxy resin varnish (II) containing no inorganic filler was directly impregnated into the glass woven fabric and dried. Thus, an epoxy resin glass woven fabric prepreg having a resin content of about 45% was obtained. Then, a copper clad laminate was obtained in the same manner as in Example 1.
【００１０】以上の実施例及び比較例において得られた
銅張積層板について、耐トラッキング性、はんだ耐熱
性、及び銅箔引き剥がし強さ及びＵＬ耐燃性を測定し
た。その結果を表１に示す。なお、寸法安定性、スルー
ホールメッキ信頼性、電気絶縁性等も測定したが、実施
例と比較例との間には差は認められなかった。The copper clad laminates obtained in the above Examples and Comparative Examples were measured for tracking resistance, solder heat resistance, copper foil peeling strength and UL flame resistance. The results are shown in Table 1. The dimensional stability, the reliability of through-hole plating, the electrical insulation, etc. were also measured, but no difference was observed between the example and the comparative example.
【００１１】[0011]
【表１】 （＊１）銅箔をエッチング後、０.１％塩化アンモニウ
ム水溶液を５０滴以上滴下しても短絡しなかった時の印
加電圧値。 （＊２）ＵＬ燃焼試験において、消煙までの時間の平均
値。[Table 1] (* 1) Applied voltage value when a short circuit did not occur after 50 or more drops of 0.1% ammonium chloride aqueous solution was dropped after etching the copper foil. (* 2) Average value of time until smoke elimination in UL combustion test.
【００１２】[0012]
【発明の効果】本発明の印刷回路用積層板は、耐トラッ
キング性が特に優れ、ＵＬ耐燃性、耐熱性、銅箔引き剥
がし強さも良好であるので、工業的印刷回路板用として
極めて好適である。The printed circuit laminate of the present invention has particularly excellent tracking resistance, UL flame resistance, heat resistance and copper foil peeling strength, and is therefore very suitable for industrial printed circuit boards. is there.
Claims (2)
とし、かつ、表面層の樹脂１００重量部に対して無機充
填剤が１０〜２００重量部含有されているエポキシ樹脂
含浸ガラス織布からなることを特徴とする印刷回路用積
層板。1. An epoxy resin-impregnated glass woven fabric whose surface layer contains a non-brominated epoxy resin as a main component and contains 10 to 200 parts by weight of an inorganic filler with respect to 100 parts by weight of the resin of the surface layer. A laminated board for a printed circuit characterized by the following.
いて、表面層以外の層が臭素化エポキシ樹脂を主成分と
し、かつ、樹脂１００重量部に対して無機充填剤が１０
〜２００重量部含有されているエポキシ樹脂含浸ガラス
不織布からなることを特徴とする印刷回路用積層板。2. The printed circuit laminate according to claim 1, wherein the layers other than the surface layer contain a brominated epoxy resin as a main component, and the inorganic filler is 10 parts with respect to 100 parts by weight of the resin.
A laminated board for a printed circuit comprising an epoxy resin-impregnated glass non-woven fabric in an amount of up to 200 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5085995A JP2787846B2 (en) | 1993-04-13 | 1993-04-13 | Printed circuit laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5085995A JP2787846B2 (en) | 1993-04-13 | 1993-04-13 | Printed circuit laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06302926A true JPH06302926A (en) | 1994-10-28 |
| JP2787846B2 JP2787846B2 (en) | 1998-08-20 |
Family
ID=13874249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5085995A Expired - Lifetime JP2787846B2 (en) | 1993-04-13 | 1993-04-13 | Printed circuit laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2787846B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6124220A (en) * | 1995-03-28 | 2000-09-26 | Sumitomo Bakelite Company Limited | Laminated board and process for production thereof |
| EP1387605A3 (en) * | 2002-07-29 | 2004-11-24 | Fuji Electric Co., Ltd. | Multilayered printed wiring board |
| US6949289B1 (en) | 1998-03-03 | 2005-09-27 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| US7354641B2 (en) | 2004-10-12 | 2008-04-08 | Ppg Industries Ohio, Inc. | Resin compatible yarn binder and uses thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8105690B2 (en) | 1998-03-03 | 2012-01-31 | Ppg Industries Ohio, Inc | Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding |
| US8062746B2 (en) | 2003-03-10 | 2011-11-22 | Ppg Industries, Inc. | Resin compatible yarn binder and uses thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0382192A (en) * | 1989-08-25 | 1991-04-08 | Matsushita Electric Works Ltd | Electric laminated board |
| JPH0484489A (en) * | 1990-07-27 | 1992-03-17 | Mitsubishi Gas Chem Co Inc | Smooth surface metal foil clad laminate |
-
1993
- 1993-04-13 JP JP5085995A patent/JP2787846B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0382192A (en) * | 1989-08-25 | 1991-04-08 | Matsushita Electric Works Ltd | Electric laminated board |
| JPH0484489A (en) * | 1990-07-27 | 1992-03-17 | Mitsubishi Gas Chem Co Inc | Smooth surface metal foil clad laminate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6124220A (en) * | 1995-03-28 | 2000-09-26 | Sumitomo Bakelite Company Limited | Laminated board and process for production thereof |
| US6949289B1 (en) | 1998-03-03 | 2005-09-27 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| EP1387605A3 (en) * | 2002-07-29 | 2004-11-24 | Fuji Electric Co., Ltd. | Multilayered printed wiring board |
| US7354641B2 (en) | 2004-10-12 | 2008-04-08 | Ppg Industries Ohio, Inc. | Resin compatible yarn binder and uses thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2787846B2 (en) | 1998-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3119577B2 (en) | Laminated board | |
| JPH0221667B2 (en) | ||
| JP2787846B2 (en) | Printed circuit laminate | |
| JPS6059795A (en) | Laminated board for printed circuit | |
| JP2659490B2 (en) | Printed circuit laminate | |
| JP2740600B2 (en) | Printed circuit laminate | |
| JPS60203438A (en) | Laminated board for printed circuit | |
| JPH09254331A (en) | Laminated sheet | |
| JPH07176843A (en) | Laminated board for printed circuit | |
| JP2003136620A (en) | Composite laminate | |
| JPH05318640A (en) | Laminated sheet | |
| JPH01152138A (en) | Production of laminate for printed circuit | |
| JPH05327150A (en) | Laminated plate for printed circuit | |
| JP2924966B2 (en) | Printed circuit laminate | |
| JP3243027B2 (en) | Copper clad laminate | |
| JP3596819B2 (en) | Printed circuit laminate | |
| JP3578476B2 (en) | Printed circuit laminate | |
| JP2557325B2 (en) | Multilayer copper clad laminate | |
| JPH10166501A (en) | Manufacture of glass epoxy copper-clad laminate | |
| JP3288819B2 (en) | Copper clad laminate | |
| JP2935329B2 (en) | Manufacturing method of metal foil clad laminate | |
| JP4017801B2 (en) | Flame retardant composite laminate | |
| JPH10130399A (en) | Glass cloth base laminate | |
| JP4470260B2 (en) | Laminated board | |
| JPH05318650A (en) | Copper plated laminated sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Effective date: 20040130 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20040210 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040409 |
|
| A02 | Decision of refusal |
Effective date: 20041005 Free format text: JAPANESE INTERMEDIATE CODE: A02 |