JPH07183182A - Semiconductor manufacturing equipment - Google Patents
Semiconductor manufacturing equipmentInfo
- Publication number
- JPH07183182A JPH07183182A JP32838793A JP32838793A JPH07183182A JP H07183182 A JPH07183182 A JP H07183182A JP 32838793 A JP32838793 A JP 32838793A JP 32838793 A JP32838793 A JP 32838793A JP H07183182 A JPH07183182 A JP H07183182A
- Authority
- JP
- Japan
- Prior art keywords
- air
- semiconductor manufacturing
- front door
- manufacturing equipment
- prevent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 239000004065 semiconductor Substances 0.000 title claims abstract description 7
- 239000002245 particle Substances 0.000 abstract description 5
Landscapes
- Ventilation (AREA)
Abstract
(57)【要約】
【目的】 装置内部へのエア巻き込みを防止する。
【構成】 半導体製造装置１の正面扉２下部に装置１外
よりエア流入を防止する下カバー３を取付ける。
【効果】 装置内部へのエア巻き込みを防止できるの
で、装置内のエアフローを安定させることができると共
に、装置内へのエアの巻き込みによるパーティクルの侵
入を阻止することができる。
(57) [Summary] [Purpose] Prevents air entrapment inside the device. [Structure] A lower cover 3 is attached to a lower portion of a front door 2 of a semiconductor manufacturing apparatus 1 to prevent air from entering from outside the apparatus 1. As it is possible to prevent air from being trapped inside the apparatus, it is possible to stabilize the air flow in the apparatus and prevent particles from entering due to the trapping of air into the apparatus.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体製造装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus.
【０００２】[0002]
【従来の技術】図２は従来装置の１例を示す要部の正面
斜視図である。従来装置は、正面扉２の下部に隙間４が
あり、下カバーがなかった。2. Description of the Related Art FIG. 2 is a front perspective view of an essential part showing an example of a conventional device. In the conventional device, there is a gap 4 under the front door 2 and there is no lower cover.
【０００３】[0003]
【発明が解決しようとする課題】上記従来装置にあって
は、正面扉下部に隙間があるため、装置内部へのエアの
巻き込みが起るこのことにより、装置内のエアフロー、
即ち装置内をクリーンに保つための空気の流れを乱すた
め、装置内のクリーン化を妨げ、かつ装置外のパーティ
クルを侵入するという課題がある。In the above-mentioned conventional apparatus, since there is a gap in the lower portion of the front door, air is entrained in the inside of the apparatus, which causes air flow in the apparatus.
That is, since the flow of air for keeping the inside of the device clean is disturbed, there are problems that the inside of the device is prevented from being cleaned and particles outside the device enter.
【０００４】[0004]
【課題を解決するための手段】本発明装置は、上記の課
題を解決するため、正面扉２下部に装置１外よりエア流
入を防止する下カバー３を取付ける。In order to solve the above-mentioned problems, the device of the present invention has a lower cover 3 attached to the lower part of the front door 2 to prevent air from entering from outside the device 1.
【０００５】[0005]
【作 用】このような構成とすることにより装置内部へ
のエア巻き込みを防止できるので、装置内のエアフロー
を安定させることができると共に、装置内へのエアの巻
き込みによるパーティクルの侵入を阻止できることにな
る。[Operation] With such a configuration, it is possible to prevent air entrapment inside the device, so that it is possible to stabilize the air flow inside the device and prevent particles from entering due to air entrapment inside the device. Become.
【０００６】[0006]
【実施例】図１は本発明装置の１実施例を示す要部の正
面斜視図である。本実施例は、半導体製造装置１の正面
扉２下部に装置１外よりエア流入を防止する下カバー３
を取付ける。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a front perspective view of an essential part showing one embodiment of the device of the present invention. In this embodiment, a lower cover 3 for preventing air from flowing into the lower part of the front door 2 of the semiconductor manufacturing device 1 from the outside of the device 1.
Install.
【０００７】クリーンルーム側は、圧力を高めに設定さ
れており、顧客によりその圧力は一定ではない。そこで
全てのクリーンルームに対応するため、上記のように正
面扉１の下部に下カバー３を取付けることにより、装置
内部へのエア巻き込みを防止できるので、装置内のエア
フローを安定させることができると共に、装置内へのエ
アの巻き込みによるパーティクルの侵入を阻止できるこ
とになる。On the clean room side, the pressure is set high, and the pressure is not constant depending on the customer. Therefore, in order to deal with all clean rooms, by attaching the lower cover 3 to the lower portion of the front door 1 as described above, it is possible to prevent air entrapment into the inside of the device, and thus to stabilize the air flow in the device, The particles can be prevented from entering due to the entrainment of air into the device.
【０００８】[0008]
【発明の効果】上述のように本発明によれば、正面扉２
下部に装置１外よりエア流入を防止する下カバー３を取
付けることにより装置内部へのエア巻き込みを防止でき
るので、装置内のエアフローを安定させることができる
と共に、装置内へのエアの巻き込みによるパーティクル
の侵入を阻止することができる。As described above, according to the present invention, the front door 2
By attaching the lower cover 3 for preventing air inflow from the outside of the device 1 to the inside of the device, it is possible to prevent air entrapment into the device, so that the air flow inside the device can be stabilized and particles caused by the entrainment of air into the device. Can be blocked.
【図１】本発明装置の１実施例を示す要部の正面斜視図
である。FIG. 1 is a front perspective view of a main part showing an embodiment of a device of the present invention.
【図２】従来装置の１例を示す要部の正面斜視図であ
る。FIG. 2 is a front perspective view of an essential part showing an example of a conventional device.
１ 半導体製造装置 ２ 正面扉 ３ 下カバー ４ 隙間 1 Semiconductor manufacturing equipment 2 Front door 3 Lower cover 4 Gap
Claims (1)
外よりのエア流入を防止する下カバーを取付けることを
特徴とする半導体製造装置。1. A semiconductor manufacturing apparatus, wherein a lower cover is attached to a lower portion of a front door of the semiconductor manufacturing apparatus to prevent air from entering from outside the apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32838793A JPH07183182A (en) | 1993-12-24 | 1993-12-24 | Semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32838793A JPH07183182A (en) | 1993-12-24 | 1993-12-24 | Semiconductor manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07183182A true JPH07183182A (en) | 1995-07-21 |
Family
ID=18209686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32838793A Pending JPH07183182A (en) | 1993-12-24 | 1993-12-24 | Semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07183182A (en) |
-
1993
- 1993-12-24 JP JP32838793A patent/JPH07183182A/en active Pending
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