JPH07183444A - Surface mount components - Google Patents

Abstract

(57) [Abstract] [Purpose] To enable the mounting direction of the soldering part and the package to be inspected by the X-ray inspection device. [Structure] A part of the lead 13 is formed in a shape different from that of the other leads. The irregularly shaped lead 13a is configured as a mounting orientation determination mark detected by the X-ray inspection apparatus.
The surface mount component 1 based on the positions of the leads 13a of different shapes
The mounting orientation of 1 is detected. Therefore, the mounting orientation can be confirmed while inspecting the soldering portion of the surface mount component 11 by the X-ray inspection apparatus, and the soldering portion inspection and the mounting orientation can be confirmed in the same inspection process. Therefore, the number of inspection steps can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component having leads symmetrically arranged on at least two side surfaces of a package.

[0002]

2. Description of the Related Art Conventionally, there is a surface mount component in which leads are symmetrically arranged on at least two side surfaces of a package. Since this type of surface mount component can be mounted even when the mounting direction on the board is different from the regular direction, the mounting direction was inspected after the mounting on the board. A conventional surface mount device of this type will be described with reference to FIGS.

FIG. 3 is a plan view of a conventional surface mount component in which a direction identification mark is printed on the package, and FIG. 4 is a plan view of a conventional surface mount component in which a notch is formed in a part of the package. [Fig. 6] is a plan view showing a state when a conventional surface mount component is seen through with an X-ray inspection apparatus. In these figures, reference numeral 1 is a surface mount component (SMD: Surface Mount).
Device), the surface mount component 1 is a semiconductor device in which a large number of leads 3 project from the four sides of the package 2.

The package 2 is formed in a substantially square shape in the plan view shown in the drawing, and the same number of leads 3 are arranged on each side of the package 2. The leads 3 are all formed in substantially the same shape, and are symmetrically arranged on the two side surfaces facing each other. The direction identifying mark 4 is printed on one of the four corners on the upper surface of the package 2 of the surface mount component 1 shown in FIG.

In the surface mount component 1 shown in FIG. 4, a direction identifying notch 5 is formed in the package 2 so that one of the four corners of the package 2 is obliquely cut out.

The surface mount component 1 having the above structure is
Since the leads 3 are provided on the four side portions of the package 2 in the same number and project in the same direction, the mounting direction is likely to be incorrect, and therefore the mark 4 and the notch 5 are formed after the surface mounting on a printed wiring board (not shown). It was inspected whether or not it was mounted in the proper orientation by visually confirming with a visual inspection device.

In addition to confirming the mounting direction as described above, this inspection was also conducted for the purpose of confirming whether or not the soldered portion of the lead 3 was correctly soldered.

In recent years, the number of leads 3 has increased and the lead pitch has become smaller from the viewpoint of achieving high-density mounting of the surface-mounted components 1, and the above-described visual inspection always surely finds a defective soldering portion. Since it is not possible to do so, the soldered parts have come to be inspected by an X-ray inspection device. That is, it has come to be detected that the lead 3 is misaligned with respect to the soldering pad of the printed wiring board or the solder bridge is formed between the leads 3 by using the X-ray. .

[0009]

However, when the X-ray inspection apparatus is used, the package 2 is transmitted through the X-ray inspection apparatus, and the mark 4 and the notch 5 cannot be recognized. I will end up. FIG. 5 shows a state in which the conventional surface mount component 1 is seen through by the X-ray inspection apparatus. As can be seen from the figure, not only the mark 4 cannot be recognized, but also the leads 3 have substantially the same shape, so the mounting direction cannot be inspected. In FIG. 5, reference numeral 6 is a wire for electrically connecting each lead 3 and a semiconductor chip (not shown), and 7 is a die pad on which the semiconductor chip is mounted.

For this reason, conventionally, in addition to inspecting the soldered portion by an X-ray inspection device, the mounting direction of the package 2 has been inspected by an appearance inspection device or visual inspection. That is,
There was a problem that the inspection man-hour increased.

The present invention has been made in order to solve such a problem, and an object thereof is to make it possible to inspect the mounting directions of a soldering portion and a package by an X-ray inspection apparatus.

[0012]

In the surface mount component according to the first aspect of the present invention, a part of a large number of leads is formed in a shape different from that of the other leads, and the leads of this different shape are detected by an X-ray inspection apparatus. It is configured as a mounting orientation determination mark to be detected.

In the surface mount component according to the second aspect of the present invention, the tie bar integrally formed with the element mounting die pad in the package is formed asymmetrically with respect to the center of the surface mount component, and the asymmetric tie bar is X-rayed. It is configured as a mounting orientation determination mark detected by the inspection device.

[0014]

Since the lead and the tie bar are detected by the X-ray inspection apparatus, the mounting direction of the surface mount component is detected based on the position of the lead formed in a different shape or the asymmetrical formed tie bar.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the first invention will be described in detail below with reference to FIG. FIG. 1 is a plan view showing a state where the surface electronic component according to the first invention is seen through by an X-ray inspection apparatus. In the figure, the same or equivalent members as those described in FIGS. 3 to 5 are designated by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 1, 11 is a surface electronic component according to the first invention. In the surface electronic component 11, as in the conventional case, a large number of leads 13 are projectingly provided on four sides of a package 12 having a substantially square shape in plan view. Of the multiple leads 13, one of the lead rows extending leftward and rightward under the package 12 in the figure has a different shape from the other leads 13. The lead formed in this irregular shape is denoted by reference numeral 13.
Denote by a.

The irregularly shaped lead 13a is used for the package 12
The end portion 13b located inside the package 12 is formed so as to be wider than other portions. Further, this wide portion is positioned inside the package 12 with respect to the other adjacent leads 13.

The surface mount component 11 on which the leads 13a having different shapes are formed is mounted on a printed wiring board (not shown) and then the soldered portion is inspected by an X-ray inspection apparatus. When the package 12 is seen through by the X-ray inspection apparatus when performing this inspection, it is possible to discriminate the lead 13a having an irregular shape as shown in FIG.

That is, when the soldered portion is inspected by the X-ray inspection apparatus, the lead 13a having an irregular shape can be detected. Therefore, the surface mount component 11 is mounted by detecting the position of the lead 13a having an irregular shape. You can check the direction.

Therefore, the lead 1 formed in a different shape
Since 3a serves as a mounting orientation determination mark detected by the X-ray inspection apparatus, the soldering portion inspection and the mounting orientation confirmation can be performed in the same inspection step.

In this embodiment, one of a large number of leads 13 is formed in a different shape, but the present invention is not limited to such a limitation and the mounting orientation can be detected. If possible, the number and position of the leads 13a having different shapes can be appropriately changed. Further, the length of the lead may be changed instead of expanding the width dimension in forming the different shape.

Next, the surface mount component according to the second invention will be described in detail with reference to FIG. FIG. 2 is a plan view showing a state where the surface mount component according to the second invention is seen through by the X-ray inspection apparatus. In the same figure, the above-mentioned FIG. 1, FIG. 3 to FIG.
The same or equivalent members as those described in 1 are assigned the same reference numerals and detailed description thereof will be omitted.

In FIG. 2, 21 and 22 are die pads 7.
It is a tie bar integrally formed on the. These tie bars 2
Reference numerals 1 and 22 are for connecting and supporting the die pad 7 to a frame body of a lead frame (not shown).
After the resin is sealed, the frame is cut from the frame. The tie bars 21 and 22 are arranged at the corners of the die pad 7 that face each other in the upper right portion and the lower left portion in FIG.

The tie bar 22 located in the lower left portion is formed to be narrower than the tie bar 21 located in the upper right portion, and a determination portion 22a having a rectangular shape in plan view is provided at the end portion on the side opposite to the die pad 7. There is.

When the tie bars 21 and 22 are formed asymmetrically with respect to the center of the surface-mounted component 11 in this way, the tie bars 21 and 22 serve as mounting orientation determination marks detected by the X-ray inspection apparatus, and therefore soldering is performed. The inspection of the parts and the confirmation of the mounting direction can be performed in the same inspection process.

In each of the above-described embodiments, the present invention is applied to the semiconductor device in which the leads project from the four sides of the package.
It can also be applied to an electronic component in which leads are symmetrically arranged on the side portion. Moreover, it is not limited to the semiconductor device.

[0027]

As described above, in the surface mount component according to the first aspect of the present invention, a part of a large number of leads is formed in a shape different from that of the other leads, and this different shape of lead is used in an X-ray inspection apparatus. The surface mounting component according to the second aspect of the present invention has a tie bar integrally formed on the element mounting die pad in the package with respect to the center of the surface mounting component. Are formed asymmetrically, and the asymmetrical tie bar is configured as a mounting orientation determination mark detected by the X-ray inspection apparatus.
Since the lead and the tie bar are detected by the X-ray inspection apparatus, the mounting direction of the surface mount component is detected based on the position of the lead formed in a different shape or the tie bar formed asymmetrically.

Therefore, since the mounting direction can be confirmed while inspecting the soldering portion of the surface-mounted component by the X-ray inspection device, the soldering portion inspection and the confirmation of the mounting direction can be performed in the same inspection process. it can. Therefore, the number of inspection steps can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view showing a state where a surface electronic component according to a first invention is seen through by an X-ray inspection apparatus.

FIG. 2 is a plan view showing a state where a surface mount component according to a second invention is seen through by an X-ray inspection apparatus.

FIG. 3 is a plan view of a conventional surface mount component in which a direction identification mark is printed on a package.

FIG. 4 is a plan view of a conventional surface mount component in which a notch is formed in a part of the package.

FIG. 5 is a plan view showing a state in which a conventional surface mount component is seen through by an X-ray inspection apparatus.

[Explanation of symbols]

 7 Die Pad 11 Surface Mount Components 12 Package 13 Lead 13a Deformed Lead 21 Tie Bar 22 Tie Bar

Claims (2)

[Claims] 1. In a surface mount component in which a large number of leads protruding from a package are symmetrically arranged on at least two side surfaces of the package, a part of the plurality of leads is formed in a shape different from other leads, A surface-mounted component characterized in that the lead of this irregular shape is configured as a mounting orientation determination mark detected by an X-ray inspection apparatus. 2. In a surface mount component in which a large number of leads protruding from the package are symmetrically arranged on at least two side surfaces of the package, a tie bar integrally formed with an element mounting die pad in the package is provided with a tie bar of the surface mount component. Form asymmetrically with respect to the center, and attach this asymmetrical tie bar to X
A surface-mounted component characterized by being configured as a mounting orientation determination mark detected by a line inspection device.