JPH0719168Y2 - フォトダイオ−ドアレイの取付装置 - Google Patents

フォトダイオ−ドアレイの取付装置

Info

Publication number
JPH0719168Y2
JPH0719168Y2 JP1987090348U JP9034887U JPH0719168Y2 JP H0719168 Y2 JPH0719168 Y2 JP H0719168Y2 JP 1987090348 U JP1987090348 U JP 1987090348U JP 9034887 U JP9034887 U JP 9034887U JP H0719168 Y2 JPH0719168 Y2 JP H0719168Y2
Authority
JP
Japan
Prior art keywords
guide pin
photodiode array
chip
pda
mounting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987090348U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63200337U (2
Inventor
進清 安藤
貴史 的場
誠児 加藤
士郎 藤本
通昭 山県
俊夫 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Priority to JP1987090348U priority Critical patent/JPH0719168Y2/ja
Publication of JPS63200337U publication Critical patent/JPS63200337U/ja
Application granted granted Critical
Publication of JPH0719168Y2 publication Critical patent/JPH0719168Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Analogue/Digital Conversion (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Optical Transform (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Die Bonding (AREA)
JP1987090348U 1987-06-12 1987-06-12 フォトダイオ−ドアレイの取付装置 Expired - Lifetime JPH0719168Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987090348U JPH0719168Y2 (ja) 1987-06-12 1987-06-12 フォトダイオ−ドアレイの取付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987090348U JPH0719168Y2 (ja) 1987-06-12 1987-06-12 フォトダイオ−ドアレイの取付装置

Publications (2)

Publication Number Publication Date
JPS63200337U JPS63200337U (2) 1988-12-23
JPH0719168Y2 true JPH0719168Y2 (ja) 1995-05-01

Family

ID=30950124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987090348U Expired - Lifetime JPH0719168Y2 (ja) 1987-06-12 1987-06-12 フォトダイオ−ドアレイの取付装置

Country Status (1)

Country Link
JP (1) JPH0719168Y2 (2)

Also Published As

Publication number Publication date
JPS63200337U (2) 1988-12-23

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